Patents by Inventor Tadayoshi Mutta

Tadayoshi Mutta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050067713
    Abstract: The semiconductor device of the present invention comprises a substrate; at least one through hole formed through the substrate between front and back surfaces of the substrate; an electrical connection portion formed by a semiconductor process on at least one surface of the front and back surfaces of the substrate in a vicinity of an end opening of the through hole; an insulating layer formed of an organic material on an inside surface of the through hole; and an electroconductive layer formed on an inside surface of the insulating layer, wherein the electrical connection portion is electrically connected to the electroconductive layer to be electrically connected to a side of the other surface of the substrate.
    Type: Application
    Filed: October 15, 2004
    Publication date: March 31, 2005
    Inventors: Tadayoshi Mutta, Jin Tachikawa, Riichi Saito, Tadanori Suto, Manabu Takayama, Hiroyuki Morimoto