Patents by Inventor Tadayoshi Shiomura

Tadayoshi Shiomura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6656589
    Abstract: A polyamide resin pellet for a miniature part, comprising a polyamide resin (A) whose melting point as measured by DSC is in the range of 280 to below 330° C., which has an average volume of 0.001 to 21 mm3, the average volume determined by randomly sampling 50 pellets, measuring the weight and specific gravity of each of the pellets and dividing the weight by the specific gravity. The polyamide resin pellet exhibits low water absorption and is excellent in moldability, mechanical strength characteristics and heat resistance. Further, it has specified average volume, configuration, average diameter and average length, so that, in an injection molding, plasticization is smoothly effected to thereby enable obtaining a molded item or article which exhibits low dispersion of weight and strength and has excellent hue. The polyamide resin pellet is especially suitable for use in a molding material for forming miniature parts for motor vehicles and electrical or electronic equipments.
    Type: Grant
    Filed: December 19, 2001
    Date of Patent: December 2, 2003
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Yoshimasa Ogo, Tadayoshi Shiomura
  • Publication number: 20020115818
    Abstract: A polyamide resin pellet for a miniature part, comprising a polyamide resin (A) whose melting point as measured by DSC is in the range of 280 to below 330° C., which has an average volume of 0.001 to 21 mm3, the average volume determined by randomly sampling 50 pellets, measuring the weight and specific gravity of each of the pellets and dividing the weight by the specific gravity. The polyamide resin pellet exhibits low water absorption and is excellent in moldability, mechanical strength characteristics and heat resistance. Further, it has specified average volume, configuration, average diameter and average length, so that, in an injection molding, plasticization is smoothly effected to thereby enable obtaining a molded item or article which exhibits low dispersion of weight and strength and has excellent hue. The polyamide resin pellet is especially suitable for use in a molding material for forming miniature parts for motor vehicles and electrical or electronic equipments.
    Type: Application
    Filed: December 19, 2001
    Publication date: August 22, 2002
    Inventors: Yoshimasa Ogo, Tadayoshi Shiomura
  • Patent number: 4489033
    Abstract: A process for injection compression molding ultra high molecular weight polyethylene having an intrinsic viscosity of 3 dl/g or higher measured at 135.degree. C. in decalin and a melt index of 0.01 g/10 min or less comprises,(a) heating the ultra high molecular weight polyethylene to 170.degree.-240.degree. C.,(b) adjusting the volume of the mold cavity V.sub.1 equal to the volume of the molded article V.sub.0,(c) injecting ultra high molecular weight polyethylene having a volume V.sub.0 into the mold cavity through a runner portion at a shear rate of at least 20,000 sec.sup.-1,(d) instantaneously expanding the mold cavity to adjust its volume V.sub.1 to satisfy the relation:1.2 V.sub.0 .ltoreq.V.sub.1at a time from T.sub.1 (immediately before completion of injection) and a time T.sub.
    Type: Grant
    Filed: April 12, 1982
    Date of Patent: December 18, 1984
    Assignee: Mitsui Petrochemical Industries
    Inventors: Naotake Uda, Yasuo Kouno, Tadayoshi Shiomura