Patents by Inventor Tadayuki Into

Tadayuki Into has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of thinning semiconductor wafer capable of preventing its front from being contaminated and back grinding device for semiconductor wafers
    Patent number: 6984586
    Abstract: In a method of thinning a semiconductor wafer, a protection tape smaller in size than the semiconductor wafer is applied to a front of the semiconductor wafer, and a back of the semiconductor wafer is etched. In the etching process, a chemical liquid falls down from the semiconductor wafer without being accumulated on the protection tape because the protection tape is smaller in size than the semiconductor wafer.
    Type: Grant
    Filed: December 13, 2002
    Date of Patent: January 10, 2006
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Noriki Iwasaki, Satoru Fukunaga, Tadayuki Into
  • Pickup apparatus for semiconductor chips
    Patent number: 6582223
    Abstract: A semiconductor chip pickup apparatus of the present invention includes an aspiration section and an aspiration unit connected to the aspiration section, in which the aspiration unit includes a stage for mounting the semiconductor chip thereon and an adhesive sheet is attached to the semiconductor chip between the stage and the semiconductor chip, the stage includes undulations in at least a part of an area in which the semiconductor chip is mounted, and by operating the aspiration section, a suction force is applied to at least a part of an area in which the undulations are formed.
    Type: Grant
    Filed: November 23, 2001
    Date of Patent: June 24, 2003
    Assignees: Sharp Kabushiki Kaisha, Sharp Takaya Electronic Industry Co., Ltd.
    Inventors: Hiroshi Yasumura, Tadayuki Into, Noriki Iwasaki, Yasuhiro Goto, Tatsuyuki Ishioka
  • Method of thinning semiconductor wafer capable of preventing its front from being contaminated and back grinding device for semiconductor wafers
    Publication number: 20030082915
    Abstract: In a method of thinning a semiconductor wafer, a protection tape smaller in size than the semiconductor wafer is applied to a front of the semiconductor wafer, and a back of the semiconductor wafer is etched. In the etching process, a chemical liquid falls down from the semiconductor wafer without being accumulated on the protection tape because the protection tape is smaller in size than the semiconductor wafer.
    Type: Application
    Filed: December 13, 2002
    Publication date: May 1, 2003
    Applicant: Sharp Kabushiki Kaisha
    Inventors: Noriki Iwasaki, Satoru Fukunaga, Tadayuki Into
  • Method of thinning semiconductor wafer capable of preventing its front from being contaminated and back grinding device for semiconductor wafers
    Patent number: 6520844
    Abstract: In a method of thinning a semiconductor wafer, a protection tape smaller in size than the semiconductor wafer is applied to a front of the semiconductor wafer, and a back of the semiconductor wafer is etched. In the etching process, a chemical liquid falls down from the semiconductor wafer without being accumulated on the protection tape because the protection tape is smaller in size than the semiconductor wafer.
    Type: Grant
    Filed: May 30, 2001
    Date of Patent: February 18, 2003
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Noriki Iwasaki, Satoru Fukunaga, Tadayuki Into
  • Pickup apparatus for semiconductor chips
    Publication number: 20020067982
    Abstract: A semiconductor chip pickup apparatus of the present invention includes an aspiration section and an aspiration unit connected to the aspiration section, in which the aspiration unit includes a stage for mounting the semiconductor chip thereon and an adhesive sheet is attached to the semiconductor chip between the stage and the semiconductor chip, the stage includes undulations in at least a part of an area in which the semiconductor chip is mounted, and by operating the aspiration section, a suction force is applied to at least a part of an area in which the undulations are formed.
    Type: Application
    Filed: November 23, 2001
    Publication date: June 6, 2002
    Inventors: Hiroshi Yasumura, Tadayuki Into, Noriki Iwasaki, Yasuhiro Goto, Tatsuyuki Ishioka
  • Method of thinning semiconductor wafer capable of preventing its front from being contaminated and back grinding device for semiconductor wafers
    Publication number: 20020016135
    Abstract: In a method of thinning a semiconductor wafer, a protection tape smaller in size than the semiconductor wafer is applied to a front of the semiconductor wafer, and a back of the semiconductor wafer is etched. In the etching process, a chemical liquid falls down from the semiconductor wafer without being accumulated on the protection tape because the protection tape is smaller in size than the semiconductor wafer.
    Type: Application
    Filed: May 30, 2001
    Publication date: February 7, 2002
    Inventors: Noriki Iwasaki, Satoru Fukunaga, Tadayuki Into