Abstract: A light emitting device includes a semiconductor laser element, a base member, and a cover. The base member includes a first alignment mark, a second alignment mark, a third alignment mark, and a fourth alignment mark. The base member has a disposition surface on which the semiconductor laser element is disposed. The cover is bonded to the base member to define a closed space in which the semiconductor laser element is arranged. The first alignment mark and the second alignment mark are arranged outside the closed space. The third alignment mark and the fourth alignment mark are arranged inside the closed space. A straight line connecting the first alignment mark and the second alignment mark is parallel to a straight line connecting the third alignment mark and the fourth alignment mark.

Abstract: A light-emitting device includes a semiconductor laser element, a wavelength conversion member, and a package. The wavelength conversion member includes a wavelength conversion portion and a reflective portion. The wavelength conversion portion includes a light incident surface and a light-emitting surface. The package includes a disposition region. The wavelength conversion member is disposed at a position away in a first direction from a position at which the semiconductor laser element is disposed. The light-emitting surface has a shape that, in a plan view perpendicular to the light-emitting surface, has a first region decreasing in width in a second direction perpendicular to the first direction from the side closest to the semiconductor laser element toward the first direction.

Abstract: A light emitting device includes: an insulating base; a first upper metal part located on an upper surface of the base; a first light emitting element that is disposed on the upper surface of the base with the first upper metal part being interposed between the first light emitting element and the base, and is configured to emit light laterally from a first emission end surface of the first light emitting element; a first reflective member that is disposed on the upper surface of the base without the first upper metal part being interposed between the first reflective member and the base, faces the first light emitting element, and has a first reflective surface configured to reflect the light upward; and one or more lower metal parts located on the lower surface of the base.

Abstract: A light emitting device includes: a base member including a mounting surface, a first light-emitting element that is disposed on the mounting surface and emits light passing along a first optical axis, a second light-emitting element that is disposed on the mounting surface and emits light passing along a second optical axis, a third light-emitting element that is disposed on the mounting surface and emits light passing along a third optical axis, and one or more light reflective members including a first light reflective surface that includes a first position to be irradiated with the light passing along the first optical axis, a second light reflective surface that includes a second position to be irradiated with the light passing along the second optical axis and, and a third light reflective surface that includes a third position to be irradiated with the light passing along the third optical axis.

Abstract: A light-emitting device includes first and second semiconductor laser elements configured to respectively emit first and second lights, first and second light reflecting members each having at least four light reflecting surfaces, and a wavelength conversion member including an incident surface on which the reflected first light and the reflected second light are incident. Light intensity distributions in the fast axis direction of the first and second lights on the incident surface are more uniform than light intensity distributions in a fast axis direction of a far-field pattern of each of the first and second semiconductor laser elements. In a state in which the first and second lights are combined on the incident surface, 93% or more of a sum of light outputs of the first and second lights is emitted to a region of a 0.5 mm square on the incident surface.

Abstract: A light emitting device includes: a base having a mounting surface; one or more light reflective members arranged on the mounting surface and providing one or more light reflective surfaces on one virtual plane; a first light-emitting element having a first light-exiting surface facing toward the one or more light reflective surfaces, arranged on the mounting surface such that the first light-exiting surface is oblique relative to the one or more light reflective surfaces, and wherein light emitted from the first light-exiting surface is irradiated on the one or more light reflective surfaces; and a second light-emitting element having a second light-exiting surface facing toward the one or more light reflective surfaces, arranged on the mounting surface such that the second light-exiting surface is oblique relative to the first light-exiting surface, and wherein light emitted from the second light-exiting surface is irradiated on the one or more light reflective surfaces.

Abstract: A light emitting device includes a semiconductor laser element, a base member, and a cover. The base member includes a first alignment mark, a second alignment mark, a third alignment mark, and a fourth alignment mark. The base member has a disposition surface on which the semiconductor laser element is disposed. The cover is bonded to the base member to define a closed space in which the semiconductor laser element is arranged. The first alignment mark and the second alignment mark are arranged outside the closed space. The third alignment mark and the fourth alignment mark are arranged inside the closed space. A straight line connecting the first alignment mark and the second alignment mark is parallel to a straight line connecting the third alignment mark and the fourth alignment mark.

Abstract: A light emitting device includes one or more electrical components and a base member. The electrical components include a first semiconductor laser element, which has a light emission end surface. The base member has a first surface on which the first semiconductor laser element is disposed. The base member includes a plurality of metal films including a first metal film and a second metal film. The first metal film is electrically connected to at least one of the electrical components, and defines a first alignment mark for aligning the first semiconductor laser element. The second metal film is electrically connected to at least one of the electrical components, and defines a second alignment mark for aligning the first semiconductor laser element. A straight line connecting the first alignment mark and the second alignment mark extends parallel to the light emission end surface of the first semiconductor laser element.

Abstract: A light emitting device includes: a base; a first semiconductor laser element disposed on an upper surface of the base and configured to emit first light; a first light reflecting member disposed on the upper surface of the base, the first light reflecting member having a first light reflecting face including a plane configured to reflect the first light; a second semiconductor laser element disposed on an upper surface of the base and configured to emit second light; a second light reflecting member disposed on the upper surface of the base, the second light reflecting member having a second light reflecting face including a plane configured to reflect the second light; and a phosphor member onto which the first light reflected from the first light reflecting member and the second light reflected from the second light reflecting member are irradiated.

Abstract: A light emitting device includes one or more electrical components and a base member. The electrical components include a first semiconductor laser element, which has a light emission end surface. The base member has a first surface on which the first semiconductor laser element is disposed. The base member includes a plurality of metal films including a first metal film and a second metal film. The first metal film is electrically connected to at least one of the electrical components, and defines a first alignment mark for aligning the first semiconductor laser element. The second metal film is electrically connected to at least one of the electrical components, and defines a second alignment mark for aligning the first semiconductor laser element. A straight line connecting the first alignment mark and the second alignment mark extends parallel to the light emission end surface of the first semiconductor laser element.

Abstract: A method of manufacturing a light emitting device, the method including: disposing a first semiconductor laser element on a disposition surface of a base member such that a light emission end surface of the first semiconductor laser element is parallel to a first line passing through a pair of alignment marks provided on the base member; and disposing a first light-reflective member on the disposition surface such that a reference line for the first light-reflective member, which serves as an alignment reference in disposing the first light-reflective member, is parallel to a second line that is oblique to the first line at a predetermined angle.

Abstract: A light emitting device includes a package body, a cover made of glass or sapphire directly or indirectly secured to the package body, one or more semiconductor laser elements configured to emit a laser light, and disposed in a space enclosed by the package body and the cover, a wavelength converting member disposed above the cover in an optical path of the laser light emitted from the one or more semiconductor laser elements, a wiring disposed on a light incidence surface-side of the wavelength converting member, a resin containing a light-absorbing filler material and covering a part of the cover and a part of the wavelength converting member, and electrodes disposed on a surface of the package body, exposed from the resin and electrically connected to the wiring.

Abstract: A light emitting device includes: a base; a first semiconductor laser element disposed on an upper surface of the base and configured to emit first light; a first light reflecting member disposed on the upper surface of the base, the first light reflecting member having a first light reflecting face including a plane configured to reflect the first light; a second semiconductor laser element disposed on an upper surface of the base and configured to emit second light; a second light reflecting member disposed on the upper surface of the base, the second light reflecting member having a second light reflecting face including a plane configured to reflect the second light; and a phosphor member onto which the first light reflected from the first light reflecting member and the second light reflected from the second light reflecting member are irradiated.

Abstract: A light emitting device includes a package body, a light-transmissive cover, one or more semiconductor laser elements, a wavelength converting member, a wiring, electrically conductive layers, an opaque electrically insulating member, and electrodes. The light-transmissive cover is secured to the package body. The wavelength converting member is disposed above the light-transmissive cover in an optical path of the laser light emitted from the semiconductor laser element. The wiring is disposed on a light incidence surface-side of the wavelength converting member. The electrically conductive layers are electrically connected to the wiring and disposed on an upper surface of the light-transmissive cover. The electrically insulating member at least partially covers the electrically conductive layers and the light-transmissive cover.

Abstract: A light emitting device includes: a base; a first semiconductor laser element disposed on an upper surface of the base and configured to emit first light; a first light reflecting member disposed on the upper surface of the base and configured to reflect the first light upwards; a phosphor member having a lower surface onto which the first light is irradiated and an upper surface serving as a light extraction surface; and a light shielding member surrounding lateral surfaces of the phosphor member. First and second regions of the first light reflecting member are formed such that a portion of the light reflected by the first region that is reflected on a side close to the second region and a portion of the light reflected by the second region that is reflected on a side close to the first region intersect before reaching the lower surface of the phosphor member.

Abstract: A method of manufacturing a light emitting device, the method including: disposing a first semiconductor laser element on a disposition surface of a base member such that a light emission end surface of the first semiconductor laser element is parallel to a first line passing through a pair of alignment marks provided on the base member; and disposing a first light-reflective member on the disposition surface such that a reference line for the first light-reflective member, which serves as an alignment reference in disposing the first light-reflective member, is parallel to a second line that is oblique to the first line at a predetermined angle.

Abstract: A light emitting device includes a package body, a light-transmissive cover, one or more semiconductor laser elements, a wavelength converting member, a wiring, electrically conductive layers, an opaque electrically insulating member, and electrodes. The light-transmissive cover is secured to the package body. The wavelength converting member is disposed above the light-transmissive cover in an optical path of the laser light emitted from the semiconductor laser element. The wiring is disposed on a light incidence surface-side of the wavelength converting member. The electrically conductive layers are electrically connected to the wiring and disposed on an upper surface of the light-transmissive cover. The electrically insulating member at least partially covers the electrically conductive layers and the light-transmissive cover.

Abstract: A light emitting device includes: a base; a first semiconductor laser element disposed on an upper surface of the base and configured to emit first light; a first light reflecting member disposed on the upper surface of the base and configured to reflect the first light upwards; a phosphor member having a lower surface onto which the first light is irradiated and an upper surface serving as a light extraction surface; and a light shielding member surrounding lateral surfaces of the phosphor member. First and second regions of the first light reflecting member are formed such that a portion of the light reflected by the first region that is reflected on a side close to the second region and a portion of the light reflected by the second region that is reflected on a side close to the first region intersect before reaching the lower surface of the phosphor member.

Abstract: A method for manufacturing a light emitting device includes: providing a substrate including a placement region for placing a light emitting element on a top surface; mounting the light emitting element in the placement region; and forming a frame body surrounding the placement region on the substrate. The step of forming the frame body is performed by arranging a first frame body and second frame body on the substrate to surround the placement region. The second frame body have a larger diameter than the first frame body, and have the same thickness as the first frame body.

Abstract: A method for manufacturing a light emitting device includes: providing a substrate including a placement region for placing a light emitting element on a top surface; mounting the light emitting element in the placement region; and forming a frame body surrounding the placement region on the substrate. The step of forming the frame body is performed by arranging a first frame body and second frame body on the substrate to surround the placement region. The second frame body have a larger diameter than the first frame body, and have the same thickness as the first frame body.