Patents by Inventor Tadayuki Sagawa

Tadayuki Sagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solder ball and electronic member
    Patent number: 9320152
    Abstract: A solder ball which suppresses generation of voids in a joint, excels in a thermal fatigue property, and can also obtain a good drop impact resistance property, and an electronic member using the same are provided. The solder ball is formed of a Sn—Bi type alloy containing Sn as a main element, 0.3 to 2.0 mass % of Cu, 0.01 to 0.2 mass % of Ni, and 0.1 to 3.0 mass % of Bi, and an intermetallic compound of (Cu, Ni)6Sn5 is formed in the Sn—Bi alloy so that the generation of voids in the joint when being jointed to an electrode is suppressed, a thermal fatigue property is excellent, and a good drop impact resistance property can also be obtained.
    Type: Grant
    Filed: May 12, 2014
    Date of Patent: April 19, 2016
    Assignees: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD., NIPPON MICROMETAL CORPORATION
    Inventors: Shinichi Terashima, Takayuki Kobayashi, Masamoto Tanaka, Katsuichi Kimura, Tadayuki Sagawa
  • SOLDER BALL AND ELECTRONIC MEMBER
    Publication number: 20150146394
    Abstract: A solder ball which suppresses generation of voids in a joint, excels in a thermal fatigue property, and can also obtain a good drop impact resistance property, and an electronic member using the same are provided. The solder ball is formed of a Sn—Bi type alloy containing Sn as a main element, 0.3 to 2.0 mass % of Cu, 0.01 to 0.2 mass % of Ni, and 0.1 to 3.0 mass % of Bi, and an intermetallic compound of (Cu, Ni)6Sn5 is formed in the Sn—Bi alloy so that the generation of voids in the joint when being jointed to an electrode is suppressed, a thermal fatigue property is excellent, and a good drop impact resistance property can also be obtained.
    Type: Application
    Filed: May 12, 2014
    Publication date: May 28, 2015
    Applicant: NIPPON STEEL & SUMKIN MATERIALS CO., LTD.
    Inventors: Shinichi Terashima, Takayuki Kobayashi, Masamoto Tanaka, Katsuichi Kimura, Tadayuki Sagawa