Patents by Inventor Tadayuki Sugahara

Tadayuki Sugahara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Reflow soldering method using Pb-free solder alloy and hybrid packaging method and structure
    Publication number: 20060239855
    Abstract: A hybrid mounting method using a Pb-free solder alloy including a reflow soldering step of soldering a surface mounting component 2 to at least the upper surface of a circuit board 1 using a Pb-free solder paste comprising an alloy based on Sn-(1-4)Ag-(0-1)Cu-(7-10)In (unit, mass %)-based alloy, an insertion step of inserting a lead or a terminal of an insertion mounting component 5 into a through hole perforated through the circuit board 1 from the upper surface thereof, a flux coating step, a preheating step, and a flow soldering step of spraying a jet flow 3 of Pb-free solder to the lower surface of the circuit board 1 preheated by the preheating step, thereby flow soldering the lead or the terminal of an insertion mounting component 5 to the circuit board.
    Type: Application
    Filed: July 1, 2004
    Publication date: October 26, 2006
    Inventors: Tetsuya Nakatsuka, Nobuhide Takano, Tadayuki Sugahara, Tomoyuki Omura, Toshio Saeki, Kouji Serizawa, Shousaku Ishihara