Abstract: A method for cleaning components of a system for filling holes in a printed circuit board with a fluid fill material includes removing the components being a dispensing head and a manifold connected to the dispensing head preferably as a single unit. The single unit is retained in that format. Excess fluid material from the dispensing head and manifold is evacuated preferably by passing air through the dispensing head and manifold. Then the dispensing head and manifold is placed in a cleaning tub, and the manifold is attached to a solvent pump line. The dispensing head and manifold is flushed with a flow of solvent from the solvent pump line; and excess solvent from the dispensing head and manifold is evacuated, by passing air through the dispensing head and manifold.

Abstract: There is a system for filling holes in a printed circuit board with a fluid fill material. The system receives a printed circuit board vertically within a main body. There is a dispensing head for selectively dispensing a fill material onto the vertically placed circuit board, the dispensing head having a plurality of holes. A feeding reservoir contains the fill material, and the feeding reservoir has a first end and a second end. An outlet system comprises a flow line connected to the first end of the feeding reservoir, and the flow line provides a flow path for the fill material from the first end of the feeding reservoir to the dispensing head. The flow line is attached to a manifold connected to the dispensing head, the manifold including connectors between the branches and with the absence of 90° elbows in the flow path.

Abstract: A method for cleaning components of a system for filling holes in a printed circuit board with a fluid fill material includes removing the components being a dispensing head and a manifold connected to the dispensing head preferably as a single unit. The single unit is retained in that format. Excess fluid material from the dispensing head and manifold is evacuated preferably by passing air through the dispensing head and manifold. Then the dispensing head and manifold is placed in a cleaning tub, and the manifold is attached to a solvent pump line. The dispensing head and manifold is flushed with a flow of solvent from the solvent pump line; and excess solvent from the dispensing head and manifold is evacuated, by passing air through the dispensing head and manifold.

Abstract: There is a system for filling holes in a printed circuit board with a fluid fill material. The system receives a printed circuit board vertically within a main body. There is a dispensing head for selectively dispensing a fill material onto the vertically placed circuit board, the dispensing head having a plurality of holes. A feeding reservoir contains the fill material, and the feeding reservoir has a first end and a second end. An outlet system comprises a flow line connected to the first end of the feeding reservoir, and the flow line provides a flow path for the fill material from the first end of the feeding reservoir to the dispensing head. The flow line is attached to a manifold connected to the dispensing head, the manifold including connectors between the branches and with the absence of 90° elbows in the flow path.