Patents by Inventor Tadej Semenic

Tadej Semenic has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240258522
    Abstract: Techniques are provided for implementing hybrid cathodes for batteries. In one example, a battery cathode includes a solid cathode material having an open pore structure and formed of a carbon monofluoride material and one or both of a phthalocyanine compound and a manganese oxide material and lithium polysulfide disposed within pores of the solid cathode material. In another example, a method includes assembling a solid cathode material and lithium metal anode with a porous separator therebetween, where the solid cathode material has an open pore structure and is formed of a carbon monofluoride material and one or both of a phthalocyanine compound and a manganese oxide, forming a catholyte having lithium polysulfide and infiltrating pores of the solid cathode material and the separator with the catholyte.
    Type: Application
    Filed: January 26, 2024
    Publication date: August 1, 2024
    Inventors: Peter Malati, Max Tsao, Tadej Semenic
  • Publication number: 20230395777
    Abstract: Techniques are provided for implementing hybrid anodes for batteries. In one example, a battery anode includes a current collector having a continuous particulate matrix and an open pore structure and an anode material disposed at least within pores of the current collector. In another example, a method of forming the anode includes forming a slurry of current collector particles, a binder, and a solvent, casting the slurry into a film, de-binding the slurry to remove the binder and solvent, sintering the particles to form a current collector, and infiltrating the current collector with an anode material.
    Type: Application
    Filed: June 1, 2022
    Publication date: December 7, 2023
    Inventors: Tadej Semenic, Peter Malati, Kyle Gould, Avijit Bhunia
  • Publication number: 20230187900
    Abstract: A thermo-optical ground plane includes a plate configured to mount a diode laser device defining a first surface area, an evaporation chamber in thermal communication with the plate, and a channel defined in thermal communication with the evaporation chamber. The channel is configured to receive and circulate a coolant fluid at a predetermined flowrate. The evaporation chamber is configured to receive a working fluid. The inner walls of the evaporation chamber define a second surface area that is greater than the first surface area of the diode laser device. The plate comprises beam shaping and folding optics for collimating and focusing the light from the diode laser device on an optical fiber. Light from a plurality of thermo-optical ground planes is combined on a single optical fiber. The structure enables cooling with exceptionally low coolant flowrate while also maintaining small specific volume and small specific weight.
    Type: Application
    Filed: December 13, 2021
    Publication date: June 15, 2023
    Inventors: Tadej Semenic, Seongchul Jun, Avijit Bhunia, Weiya Zhang, Milind Mahajan, John Mansell, Kyle Gould
  • Publication number: 20220160161
    Abstract: Cookware and a method of manufacture thereof are provided. The method comprises forming a fluid conduit defining a volume in a base of the cookware, the base comprising a heating zone configured for thermal communication with the fluid conduit. A working fluid is introduced to the fluid conduit via an open end of the fluid conduit. A liquid phase of the working fluid occupies less than the volume of the fluid conduit. The fluid conduit is Sized and configured to form vapor segments and liquid segments interspersed throughout the fluid conduit from the working fluid. The open end of the fluid conduit is sealed to define a closed fluid system.
    Type: Application
    Filed: March 27, 2019
    Publication date: May 26, 2022
    Inventors: Tadej SEMENIC, Seongchul JUN, Avijit BHUNIA
  • Patent number: 11060805
    Abstract: A thermal interface material system includes a thermally conductive porous matrix, the thermally conductive porous matrix having a plurality of interstitial voids, and a thermally conductive colloidal suspension disposed on each side of the thermally conductive porous matrix to inhibit thermal pump-out of the thermally conductive colloidal suspension so that the thermally conductive porous matrix and thermally conductive colloidal suspension collectively form a thermally conductive porous pad.
    Type: Grant
    Filed: December 11, 2015
    Date of Patent: July 13, 2021
    Assignee: TELEDYNE SCIENTIFIC & IMAGING, LLC
    Inventors: Tadej Semenic, Kyle D. Gould, Avijit Bhunia
  • Patent number: 11022383
    Abstract: A thermal-interface-material (TIM)-free thermal management apparatus includes a thermally-conductive unitary structure having an integrated circuit (IC) side and cooling system side, the thermally-conductive unitary structure including a plurality of high aspect ratio micro-pillars or porous structures extending from the IC side and a cooling system extending from the cooling system side. The cooling system may be selected from the group consisting of: a vapor chamber, micro-channel cooler, jet-impingement chamber, and air-cooled heat sink. The cooling system and the plurality of high aspect ratio micro-pillars form part of the same homogenous and thermally-conductive unitary structure.
    Type: Grant
    Filed: June 16, 2016
    Date of Patent: June 1, 2021
    Assignee: TELEDYNE SCIENTIFIC & IMAGING, LLC
    Inventors: Steve Q. Cai, Avijit Bhunia, Tadej Semenic
  • Patent number: 11015879
    Abstract: A thermal-interface-material (TIM)-free thermal management apparatus includes a thermally-conductive unitary structure having an integrated circuit (IC) side and cooling system side, the thermally-conductive unitary structure including a plurality of high aspect ratio micro-pillars or porous structures extending from the IC side and a cooling system extending from the cooling system side. The cooling system may be selected from the group consisting of: a vapor chamber, micro-channel cooler, jet-impingement chamber, and air-cooled heat sink. The cooling system and the plurality of high aspect ratio micro-pillars form part of the same homogenous and thermally-conductive unitary structure.
    Type: Grant
    Filed: November 19, 2018
    Date of Patent: May 25, 2021
    Assignee: TELEDYNE SCIENTIFIC & IMAGING, LLC
    Inventors: Steve Q. Cai, Avijit Bhunia, Tadej Semenic
  • Publication number: 20190086162
    Abstract: A thermal-interface-material (TIM)-free thermal management apparatus includes a thermally-conductive unitary structure having an integrated circuit (IC) side and cooling system side, the thermally-conductive unitary structure including a plurality of high aspect ratio micro-pillars or porous structures extending from the IC side and a cooling system extending from the cooling system side. The cooling system may be selected from the group consisting of: a vapor chamber, micro-channel cooler, jet-impingement chamber, and air-cooled heat sink. The cooling system and the plurality of high aspect ratio micro-pillars form part of the same homogenous and thermally-conductive unitary structure.
    Type: Application
    Filed: November 19, 2018
    Publication date: March 21, 2019
    Inventors: Steve Q. Cai, Avijit Bhunia, Tadej Semenic
  • Publication number: 20170363373
    Abstract: A thermal-interface-material (TIM)-free thermal management apparatus includes a thermally-conductive unitary structure having an integrated circuit (IC) side and cooling system side, the thermally-conductive unitary structure including a plurality of high aspect ratio micro-pillars or porous structures extending from the IC side and a cooling system extending from the cooling system side. The cooling system may be selected from the group consisting of: a vapor chamber, micro-channel cooler, jet-impingement chamber, and air-cooled heat sink. The cooling system and the plurality of high aspect ratio micro-pillars form part of the same homogenous and thermally-conductive unitary structure.
    Type: Application
    Filed: June 16, 2016
    Publication date: December 21, 2017
    Inventors: Steve Q. Cai, Avijit Bhunia, Tadej Semenic
  • Publication number: 20160169598
    Abstract: A thermal interface material system includes a thermally conductive porous matrix, the thermally conductive porous matrix having a plurality of interstitial voids, and a thermally conductive colloidal suspension disposed on each side of the thermally conductive porous matrix to inhibit thermal pump-out of the thermally conductive colloidal suspension so that the thermally conductive porous matrix and thermally conductive colloidal suspension collectively form a thermally conductive porous pad.
    Type: Application
    Filed: December 11, 2015
    Publication date: June 16, 2016
    Inventors: Tadej Semenic, Kyle D. Gould, Avijit Bhunia
  • Publication number: 20100307003
    Abstract: A vapor chamber structure includes a casing, a working fluid, and an improved wick layer. The casing has an airtight vacuum chamber. The working fluid is filled into the airtight vacuum chamber. The wick layer is formed on a surface of the airtight vacuum chamber. Therefore, the present invention can increase the backflow velocity of the working fluid and improve the boiling of the working fluid due to the match of the improved wick structure. Because the backflow velocity and boiling of the working fluid is increased, the heat-transmitting efficiency is increased.
    Type: Application
    Filed: June 23, 2010
    Publication date: December 9, 2010
    Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.
    Inventors: PAUL HOFFMAN, RAJIV TANDON, RALPH REMSBURG, TADEJ SEMENIC, CHU-WAN HONG, CHE-YIN LEE
  • Publication number: 20090040726
    Abstract: A vapor chamber structure includes a casing, a working fluid, a wick layer, a plurality of structure strengthening bodies, and a plurality of backflow accelerating bodies. The casing has an airtight vacuum chamber. The working fluid is filled into the airtight vacuum chamber. The wick layer is formed on a surface of the airtight vacuum chamber. The structure strengthening bodies are respectively arranged in the airtight vacuum chamber for supporting the casing. The backflow accelerating bodies are respectively arranged in the airtight vacuum chamber for increasing the backflow velocity of the working fluid. Therefore, the present invention can maintain the completeness of the vapor chamber structure and increase the backflow velocity of the working fluid due to the match of the structure strengthening bodies and backflow accelerating bodies. Because the backflow velocity of the working fluid is increased, the heat-transmitting efficiency is increased.
    Type: Application
    Filed: August 9, 2007
    Publication date: February 12, 2009
    Inventors: Paul Hoffman, Rajiv Tandon, Ralph Remsburg, Tadej Semenic, Chu-Wan Hong, Che-Yin Lee
  • Publication number: 20090025910
    Abstract: A vapor chamber structure includes a casing, a working fluid, and an improved wick layer. The casing has an airtight vacuum chamber. The working fluid is filled into the airtight vacuum chamber. The wick layer is formed on a surface of the airtight vacuum chamber. Therefore, the present invention can increase the backflow velocity of the working fluid and improve the boiling of the working fluid due to the match of the improved wick structure. Because the backflow velocity and boiling of the working fluid is increased, the heat-transmitting efficiency is increased.
    Type: Application
    Filed: July 27, 2007
    Publication date: January 29, 2009
    Inventors: Paul Hoffman, Rajiv Tandon, Ralph Remsburg, Tadej Semenic, Chu-wan Hong, Che-Yin Lee