Abstract: Disclosed herein are anisotropic conductive particles having superior electrical reliability which are useful as materials for electrical connection structures. Further disclosed is a method for preparing conductive particles comprising polymer resin base particles and a conductive complex metal plating layer formed on the surface of the base particles wherein the conductive complex metal plating layer has a substantially continuous density gradient and can include nickel (Ni) and gold (Au).

Abstract: Disclosed herein are anisotropic conductive particles contained in anisotropic conductive adhesive films, which can be used in circuit board mounting applications. The conductive particles can exhibit superior electrical reliability. Further disclosed are polymer particles having good compressive deformability and recoverability from deformation without being ruptured when an adhesive film containing conductive particles including the polymer particles as a component is interposed and compressed between connection substrates, thereby achieving a sufficient contact area between the particles and the connection substrates. Because the polymer particles have a spherical shape, a uniform particle diameter, and a narrow particle diameter distribution, the particles can exhibit enhanced conducting properties.

Abstract: Disclosed herein are anisotropic conductive particles contained in anisotropic conductive adhesive films which can be used in circuit board mounting applications. The conductive particles have a uniform shape, a narrow particle diameter distribution, and appropriate compressive de-formability and recoverability from deformation. In addition, the conductive particles exhibit enhanced conducting properties without being ruptured when interposed and compressed between connection substrates, thereby achieving a sufficient contact area between the particles and the connection substrates. Further disclosed are polymer-based particles used in the conductive particles.

Abstract: Provided herein are methods of preparing conductive particles including hydrophilizing the surface of polymer particles by a low-temperature plasma treatment; and coating the hydrophilized surface of the polymer particles with a conductive metal layer to form the conductive particles. The methods provided herein may provide desirable adhesion between the conductive metal layer and the polymer particles and may minimize the aggregation of the polymer particles during plating. As a result, methods disclosed herein may provide for conductive particles having desirable electrical conductivity and reliability.

Abstract: An insulated conductive particle for an anisotropic conductive film is disclosed. One embodiment of the particle includes a conductive particle and insulating fixative particles discontinuously fixed on the surface of the conductive particle. The insulating particles provides insulation with other adjacent insulated conductive particles, while the insulated conductive particle is electrically connected between electrodes with the insulating fixative particles being deviated from its position. The instant disclosure also provides a method for manufacturing the insulated conductive particle, an anisotropic conductive adhesive film containing the insulated conductive particles, and an electrically connected structure using the film.

Abstract: The insulated conductive particles of the present invention comprise a resin core 41 having an average particle size of 1 to 10 ?m, a Ni layer 42 coated on the surface of the resin core with a thickness of 0.01-0.1 ?m, an Au layer 43 coated on the Ni layer with a thickness of 0.03-0.3 ?m, and an inorganic insulating layer 44 coated on the Au layer with a thickness of 0.05-1 ?m. An anisotropic conductive film of the present invention comprises the insulated conductive particles in the number of 10,000-80,000 per square millimeter (mm2).

Abstract: A hybrid bioreactor for cell culture is disclosed. To simultaneously apply compressive strain for cell differentiation and shear strain for cell proliferation to cells, the hybrid bioreactor includes a plurality of reactor tube assemblies (100), a compressive strain motor (5), a shear strain motor (25), a lower anchor mount (20) having a plurality of toothed anchors (70) to respectively anchor the lower ends of the reactor tube assemblies (100) to the lower anchor mount (20), a ball screw (90) operated in conjunction with the compressive strain motor (5), an upper anchor mount (60) which engages with the ball screw (90) to vertically move upward and downward and having a plurality of compressive strain anchors (80) to anchor the upper ends of the reactor tube assemblies (100) to the upper anchor mount (60), a power transmission unit to transmit the rotating force of the shear strain motor (25) to the toothed anchors (70).