Abstract: Provided are a zinc alloy plated steel sheet and a method for manufacturing the zinc alloy plated steel sheet. The zinc alloy plated steel sheet includes a base steel sheet and a zinc alloy plating layer, wherein the zinc alloy plating layer includes a Zn single phase structure as a microstructure and a Zn—Al—Mg-based intermetallic compound, and the Zn single phase structure has a degree (f) of (0001) preferred orientation expressed by Formula 1 below within a range of 50% or greater. [Formula 1] f(%)=(Ibasal/Itotal)×100 where Itotal refers to the integral of all diffraction peaks of the Zn single phase structure when an X-ray diffraction pattern is measured within a range of 2 theta from 10° to 100° using a Cu-K? source, and Ibasal refers to the integral of diffraction peaks of the Zn single phase relating to a basal plane.

Abstract: Zn alloy plated steel material having excellent weldability and processed-part corrosion resistance and a method for production of Zn alloy plated steel material are provided. In the Zn alloy plated steel material comprising base steel material and a Zn alloy plating layer, the Zn alloy plating layer includes, by wt %, Al: 0.1-5.0%, Mg: 0.1-5.0%, as well as a remainder of Zn and inevitable impurities. The Zn alloy plated steel material includes a lower interface layer and an upper interface layer between the base steel material and the Zn alloy plating layer, wherein the lower interface layer is formed on the base steel material and has a dense structure, and the upper interface layer is formed on the lower interface layer and has a network-type or island-type structure.

Abstract: Provided is a descaling device for effectively removing scale formed on a surface of a hot-rolled steel strip (steel sheet). The descaling device, for example, may be configured to include: a device housing disposed in a feed path of a hot-rolled steel strip, a high-pressure fluid supply unit provided to supply a high-pressure fluid to the device housing, an abrasive input unit provided to introduce an abrasive to the device housing, and an abrasive slurry spraying unit provided in the device housing to spray an abrasive slurry of the high-pressure fluid and the abrasive mixed inside the device housing on the steel strip.

Abstract: A method for continuously removing scale from a hot-rolled carbon steel strip includes: cracking the scale on the hot-rolled steel strip; shot-blasting the cracked scale to remove the scale; deforming the hot-rolled steel strip so as to weaken the bond between scale remaining after the shot-blasting and the hot-rolled steel strip and so as to impart surface roughness to the hot-rolled steel sheet; and polishing the deformed hot-rolled steel strip to remove the remaining scale.

Abstract: Provided is a descaling device for effectively removing scale formed on a surface of a hot-rolled steel strip (steel sheet). The descaling device, for example, may be configured to include: a device housing disposed in a feed path of a hot-rolled steel strip, a high-pressure fluid supply unit provided to supply a high-pressure fluid to the device housing, an abrasive input unit provided to introduce an abrasive to the device housing, and an abrasive slurry spraying unit provided in the device housing to spray an abrasive slurry of the high-pressure fluid and the abrasive mixed inside the device housing on the steel strip.

Abstract: A method for continuously removing scale from a hot-rolled carbon steel strip includes: cracking the scale on the hot-rolled steel strip; shot-blasting the cracked scale to remove the scale; deforming the hot-rolled steel strip so as to weaken the bond between scale remaining after the shot-blasting and the hot-rolled steel strip and so as to impart surface roughness to the hot-rolled steel sheet; and polishing the deformed hot-rolled steel strip to remove the remaining scale.

Abstract: The present invention relates to a semiconductor manufacturing furnace having a heat blocker mounted to an elevating plate of the furnace. The heat blocker prevents the internal temperature of the furnace from decreasing radically when a wafer boat is lowered from the processing chamber of the furnace by the elevating plate. The heat blocker includes a sealed case, a plurality of horizontally extending heat-reflecting plates disposed in the case, and a plurality of support pins for supporting and fixing the reflecting plates in place. The heat-reflecting plates reflect heat back up into the processing chamber, as the elevating plate lowers the wafer boat, to keep the internal temperature of the heater stable. This not only enhances the productivity of the manufacturing process but also enhances the uniformity of the processed wafers.

Abstract: The present invention relates to a semiconductor manufacturing furnace having a heat blocker mounted to an elevating plate of the furnace. The heat blocker prevents the internal temperature of the furnace from decreasing radically when a wafer boat is lowered from the processing chamber of the furnace by the elevating plate. The heat blocker includes a sealed case, a plurality of horizontally extending heat-reflecting plates disposed in the case, and a plurality of support pins for supporting and fixing the reflecting plates in place. The heat-reflecting plates reflect heat back up into the processing chamber, as the elevating plate lowers the wafer boat, to keep the internal temperature of the heater stable. This not only enhances the productivity of the manufacturing process but also enhances the uniformity of the processed wafers.

Abstract: A chemical vapor deposition apparatus includes a processing chamber formed by an external tube, and an internal tube installed inside the external tube, a wafer boat securable within the processing chamber, and a single gas diffusing nozzle extending vertically within the processing chamber. The gas diffusing nozzle includes an outer tubular member having a closed top end, a diaphragm dividing the interior of the tubular member into two regions disposed side by side, and columns of gas diffusing openings extending through the tubular member on opposite sides of the diaphragm, respectively. The gas infused through the gas diffusing nozzle is forced by the diaphragm to rise up one side region of the tubular member and then descend through the other side region. In this way, the gas is evenly distributed to the wafers situated in the boat.