Patents by Inventor Tae Eui Kim

Tae Eui Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8166653
    Abstract: A method of manufacturing a printed circuit board (PCB) having embedded resistors, including providing a PCB on which internal layer circuit patterns, including electrode pads, are formed; layering insulating layers on the PCB; forming first via holes on the electrode pads and simultaneously forming second via holes at predetermined locations on the internal layer circuit patterns; forming contact pads for connecting the electrode pads with resistors by filling the first via holes with oxidation-resistant conductive material and flattening the oxidation-resistant conductive material; forming the resistors so that ends of each resistor are connected to two respective contact pads, which are spaced apart from each other; forming circuit patterns on the PCB, in which the second via holes are formed; and layering insulting layers on the PCB having the formed circuit patterns, and forming external layer circuit patterns.
    Type: Grant
    Filed: June 29, 2010
    Date of Patent: May 1, 2012
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hwa Sun Park, Tae Eui Kim
  • Patent number: 8022311
    Abstract: Disclosed are a printed circuit board for improving the tolerance of embedded capacitors and a method of manufacturing the same. The printed circuit board having embedded capacitors is manufactured by transferring and embedding a circuit layer having a lower electrode formed through an additive process into a resin insulating layer, and thereby is minimized in the circuit tolerance conventionally caused by an etching process to thus be applied to capacitors for RF matching.
    Type: Grant
    Filed: April 30, 2007
    Date of Patent: September 20, 2011
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Eui Kim, Byoung Youl Min, Myung Sam Kang, Je Gwang Yoo
  • Publication number: 20100269335
    Abstract: A method of manufacturing a printed circuit board (PCB) having embedded resistors, including providing a PCB on which internal layer circuit patterns, including electrode pads, are formed; layering insulating layers on the PCB; forming first via holes on the electrode pads and simultaneously forming second via holes at predetermined locations on the internal layer circuit patterns; forming contact pads for connecting the electrode pads with resistors by filling the first via holes with oxidation-resistant conductive material and flattening the oxidation-resistant conductive material; forming the resistors so that ends of each resistor are connected to two respective contact pads, which are spaced apart from each other; forming circuit patterns on the PCB, in which the second via holes are formed; and layering insulting layers on the PCB having the formed circuit patterns, and forming external layer circuit patterns.
    Type: Application
    Filed: June 29, 2010
    Publication date: October 28, 2010
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hwa Sun Park, Tae Eui Kim
  • Publication number: 20080212299
    Abstract: Disclosed are a printed circuit board for improving the tolerance of embedded capacitors and a method of manufacturing the same. The printed circuit board having embedded capacitors is manufactured by transferring and embedding a circuit layer having a lower electrode formed through an additive process into a resin insulating layer, and thereby is minimized in the circuit tolerance conventionally caused by an etching process to thus be applied to capacitors for RF matching.
    Type: Application
    Filed: April 30, 2007
    Publication date: September 4, 2008
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Eui Kim, Byoung Youl Min, Myung Sam Kang, Je Gwang Yoo
  • Publication number: 20080110669
    Abstract: Disclosed herein is a Printed Circuit Board (PCB) having embedded resistors and a method of manufacturing the same, in which contact pads are formed by filling via holes formed on electrode pads with oxidation-resistant conductive material, and resistors are formed on the contact pads. Accordingly, erosion that occurs between the electrode pads and the resistors can be prevented using the contact pads made of oxidation-resistant conductive material, and connections between circuits also can be realized. Furthermore, resistors are formed on a flat plane without any difference in height, attributable to the electrode pads, and thus differences between the resistance values of the built-in resistors can be greatly reduced.
    Type: Application
    Filed: October 26, 2007
    Publication date: May 15, 2008
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hwa Sun Park, Tae Eui Kim, Jong Kuk Hong, Sang Jin Baek, Hong Won Kim, Jin Soo Jeong