Patents by Inventor Tae-Eun Chang

Tae-Eun Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD FOR MANUFACTURING MULTILAYER CIRCUIT BOARD
    Publication number: 20120174394
    Abstract: Disclosed herein is a method for manufacturing a multilayer circuit board, and more particularly, is a method for manufacturing a coreless multilayer circuit board that forms a support including a separating layer made of a thermoplastic resin and allowing the support to be simply separated, thereby being advantageous in processing a subsequent process, regardless of a size of the board, and economical in the manufacturing process of the support and the manufacturing costs thereof.
    Type: Application
    Filed: January 9, 2012
    Publication date: July 12, 2012
    Applicant: Samsung Electro Mechanics Co., Ltd.
    Inventors: Tae-Eun CHANG, Sukwon Lee, Francis Sohn, Changgun Oh
  • CONDUCTIVE PASTE INCLUDING A CARBON NANOTUBE AND PRINTED CIRCUIT BOARD USING THE SAME
    Publication number: 20090294739
    Abstract: The invention provides a conductive paste including a carbon nanotube and a printed circuit board using the same. The invention provides the conductive paste which exhibits an excellent electrical conductivity and allows the implementation of the X-Y interconnection and simultaneously the Z-interconnection without loosing the carbon nanotube's own original characteristics.
    Type: Application
    Filed: November 3, 2008
    Publication date: December 3, 2009
    Inventors: Eung-Suek Lee, Je-Gwang Yoo, Chang-Sup Ryu, Jun-Oh Hwang, Tae-Eun Chang, Jee-Soo Mok