Patents by Inventor Tae Geuk LIM

Tae Geuk LIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10218064
    Abstract: The present disclosure provides a composite substrate for an antenna module, which includes: a first non-magnetic substrate that is configured to have a first copper foil; a second non-magnetic substrate that is configured to have a second copper foil; and a magnetic sheet that is configured to be interposed between the first non-magnetic substrate and the second non-magnetic substrate and that is configured to be integrally laminated with the non-magnetic substrates, and further provides a preparation method thereof. The present disclosure provides a simplification of a process, low costs, a slim design, and a grip-feeling of a metal material while providing functions of wireless charging, MST, and NFC.
    Type: Grant
    Filed: August 30, 2016
    Date of Patent: February 26, 2019
    Assignee: DOOSAN CORPORATION
    Inventors: Yoon Ho Jung, Hyung Min Cho, Hyo Seung Jin, Eun Song Baik, Tae Geuk Lim
  • Publication number: 20180205142
    Abstract: The present disclosure provides a composite substrate for an antenna module, which includes: a first non-magnetic substrate that is configured to have a first copper foil; a second non-magnetic substrate that is configured to have a second copper foil; and a magnetic sheet that is configured to be interposed between the first non-magnetic substrate and the second non-magnetic substrate and that is configured to be integrally laminated with the non-magnetic substrates, and further provides a preparation method thereof. The present disclosure provides a simplification of a process, low costs, a slim design, and a grip-feeling of a metal material while providing functions of wireless charging, MST, and NFC.
    Type: Application
    Filed: August 30, 2016
    Publication date: July 19, 2018
    Applicant: DOOSAN CORPORATION
    Inventors: Yoon Ho JUNG, Hyung Min CHO, Hyo Seung JIN, Eun Song BAIK, Tae Geuk LIM