Abstract: A method for forming a multi-level metal interconnection, comprising the step of forming a first metal interconnection over an underlying layer; forming an insulating layer having a selected thickness over the underlying layer including the first metal interconnection; etching the insulating layer to form a contact hole, thereby exposing the first metal interconnection; forming a metal plug in the contact hole to contact with the first metal interconnection; etching the insulating layer by a portion of the selected thickness; forming a pair of metal spacers in sidewalls of the metal plug over the insulating layer; and forming a second metal interconnection over the insulating layer to contact with the first metal interconnection through one of the metal spacers.

Abstract: A half-tone phase shift mask capable of preventing light from being transmitted in undesired areas, and thus capable of obtaining desired fine patterns. The present invention is to provide a photomask for simultaneously forming photoresist patterns on a first area in which fine patterns are to be formed and on a second area in which relatively large photoresist patterns are to be formed in a semiconductor device. The photomask comprises a transparent substrate, half-tone phase shift patterns disposed on the first area of the transparent substrate and light screen patterns disposed on the second area of the transparent substrate.