Abstract: An electronic device is provided. The electronic device includes a processor configured to receive first data packets via a first modem, store the first data packets in a first data buffer assigned to a first area of a volatile memory, receive second data packets via a second modem, store the second data packets in a second data buffer assigned to a second area of the volatile memory, and deliver the first data packets and the second data packets from the first data buffer and the second data buffer to an upper layer in an order in which the first data packets and the second data packets are received. The second data packets include the same internet protocol (IP) destination address as the first data packets.

Abstract: An electronic device is disclosed. The electronic device includes a memory configured to store processing rules of network traffic and a processor configured to determine an order where the network traffic is processed, depending on a rule to be applied, the rule corresponding to the at least one of app information of an application corresponding to at least one process which causes the network traffic, device state information, or network packet information among the processing rules.

Abstract: An electronic device is provided. The electronic device includes a processor configured to receive first data packets via a first modem, store the first data packets in a first data buffer assigned to a first area of a volatile memory, receive second data packets via a second modem, store the second data packets in a second data buffer assigned to a second area of the volatile memory, and deliver the first data packets and the second data packets from the first data buffer and the second data buffer to an upper layer in an order in which the first data packets and the second data packets are received. The second data packets include the same internet protocol (IP) destination address as the first data packets.

Abstract: An electronic device is disclosed. The electronic device includes a memory configured to store processing rules of network traffic and a processor configured to determine an order where the network traffic is processed, depending on a rule to be applied, the rule corresponding to the at least one of app information of an application corresponding to at least one process which causes the network traffic, device state information, or network packet information among the processing rules.

Abstract: A lead frame and a stack package module including the same are provided. The lead frame including a lower-end coupling portion coupled to a lower package through soldering, and an upper-end connecting portion contacting a side surface groove formed in a side surface of an upper package to support the upper package.

Abstract: Disclosed are a solar cell and a manufacturing method thereof. The solar cell in accordance with an embodiment of the present invention includes: a substrate having a plurality of holes formed on one surface thereof; a metal layer formed on an inner wall of the hole and on one surface of the substrate; a p-type semiconductor coated on the metal layer; an n-type semiconductor formed inside the hole and on one surface of the substrate; a transparent conductive oxide formed on the n-type semiconductor; and an electrode terminal formed on the p-type semiconductor and on the transparent conductive oxide.

Abstract: An inkjet head according to an aspect of the invention may include: a manifold storing ink being injected from the outside; ink chambers receiving the ink from the manifold to eject the ink to the outside through nozzles; and a restrictor connecting the manifold and the ink chambers to each other and providing a plurality of interconnection paths.

Abstract: Disclosed are a solar cell and a manufacturing method thereof. The solar cell in accordance with an embodiment of the present invention includes: a substrate having a plurality of holes formed on one surface thereof; a metal layer formed on an inner wall of the hole and on one surface of the substrate; a p-type semiconductor coated on the metal layer; an n-type semiconductor formed inside the hole and on one surface of the substrate; a transparent conductive oxide formed on the n-type semiconductor; and an electrode terminal formed on the p-type semiconductor and on the transparent conductive oxide.

Abstract: A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The method of manufacturing the printed circuit board can include adhering a film to an insulation base, in which the film is configured to flatten a surface of the insulation base, thermosetting the film, and forming a circuit pattern on the film by way of ink-jetting. In accordance with the present invention, a surface of the insulation base can be flattened and the surface roughness thereof can be made uniform, so that the diffusivity of the circuit pattern can be controlled while printing a minute circuit pattern and an adhesive strength between the insulation base and the circuit pattern can be increased.