Patents by Inventor Tae Gyeom LEE

Tae Gyeom LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240379289
    Abstract: There is provided a multilayer electronic component in which a short circuit between the internal electrodes, a decrease in capacitance, a decrease in breakdown voltage, and the like, may be suppressed by controlling an area fraction occupied by a region in which an intensity of brightness in a capacitance formation portion is 110% or more and 126% or less of an average value of an intensity of brightness of a cover portion.
    Type: Application
    Filed: June 18, 2024
    Publication date: November 14, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seon Jae MUN, Gi Long KIM, Tae Gyeom LEE, Byung Rok AHN, Kyoung Jin CHA, Jong Ho LEE
  • Publication number: 20240274368
    Abstract: A multilayer electronic component according to another exemplary embodiment of the present disclosure may suppress occurrence of a short circuit between the internal electrodes, lower capacitance or reduced breakdown voltage by controlling an area fraction of a region of a capacitance formation portion, in which a range of brightness intensity is 110% or more and 126% or less compared to an average value of brightness intensity of a cover portion.
    Type: Application
    Filed: April 25, 2024
    Publication date: August 15, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Gyeom LEE, Gi Long KIM, Seon Jae MUN, Byung Rok AHN, Kyoung Jin CHA
  • Patent number: 12051543
    Abstract: There is provided a multilayer electronic component in which a short circuit between the internal electrodes, a decrease in capacitance, a decrease in breakdown voltage, and the like, may be suppressed by controlling an area fraction occupied by a region in which an intensity of brightness in a capacitance formation portion is 110% or more and 126% or less of an average value of an intensity of brightness of a cover portion.
    Type: Grant
    Filed: May 16, 2022
    Date of Patent: July 30, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seon Jae Mun, Gi Long Kim, Tae Gyeom Lee, Byung Rok Ahn, Kyoung Jin Cha, Jong Ho Lee
  • Patent number: 12002623
    Abstract: A multilayer electronic component according to an exemplary embodiment of the present disclosure may control connectivity of an end of an internal electrode, thereby suppressing occurrence of a short circuit between the internal electrodes, reduced capacitance or lower breakdown voltage.
    Type: Grant
    Filed: May 24, 2022
    Date of Patent: June 4, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Gyeom Lee, Gi Long Kim, Seon Jae Mun, Byung Rok Ahn, Kyoung Jin Cha
  • Patent number: 12002627
    Abstract: A multilayer electronic component includes: a body including a plurality of dielectric layers and a plurality of internal electrodes alternately disposed with the dielectric layers in a first direction, wherein when a space where the plurality of internal electrodes overlap each other in the first direction is defined as a capacitance forming portion, the plurality of internal electrodes include internal electrodes that are curved at end portions thereof in the capacitance forming portion and internal electrodes that are flat in the capacitance forming portion, and in a cross section of the body in the first and second directions.
    Type: Grant
    Filed: May 20, 2022
    Date of Patent: June 4, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Gyeom Lee, Gi Long Kim, Seon Jae Mun, Byung Rok Ahn, Kyoung Jin Cha
  • Patent number: 12002628
    Abstract: Controlling an area fraction of a region of a capacitance formation portion of a multilayer electronic component may suppress occurrence of a short circuit between internal electrodes disposed inside a body of the multilayer electronic component, lower capacitance or reduced breakdown voltage. A range of brightness intensity of the region of the capacitance formation portion of the multilayer electronic component is 110% or more and 126% or less compared to an average value of brightness intensity of a cover portion disposed on the capacitance formation portion.
    Type: Grant
    Filed: May 25, 2022
    Date of Patent: June 4, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Gyeom Lee, Gi Long Kim, Seon Jae Mun, Byung Rok Ahn, Kyoung Jin Cha
  • Patent number: 11996244
    Abstract: A multilayer electronic component includes: a body including internal electrodes alternately disposed with dielectric layers in a first direction, wherein when a region in which the internal electrodes overlap each other in the first direction is a capacitance forming portion, the internal electrodes include internal electrodes that are curved at end portions thereof in the capacitance forming portion and internal electrodes that are flat in the capacitance forming portion, and in a cross-section of the body in the first and second directions, (F1+F2)/D1×100 is 35 or less, where F1 is a maximum distance from an uppermost internal electrode to an uppermost flat internal electrode in the first direction, F2 is a maximum distance from a lowermost internal electrode to a lowermost flat internal electrode in the first direction, and D1 is a size of the capacitance forming portion in the first direction at the center thereof in the second direction.
    Type: Grant
    Filed: April 19, 2022
    Date of Patent: May 28, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seon Jae Mun, Gi Long Kim, Kyoung Jin Cha, Tae Gyeom Lee, Byung Rok Ahn, Jong Ho Lee
  • Patent number: 11990284
    Abstract: A multilayer electronic component according to an exemplary embodiment of the present disclosure may control connectivity of an end of an internal electrode, thereby suppressing occurrence of a short circuit between the internal electrodes, reduced capacitance or lower breakdown voltage. The internal electrode may include a plurality of conductor portions and a plurality of cut-off portions.
    Type: Grant
    Filed: April 27, 2022
    Date of Patent: May 21, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong Ho Lee, Seon Jae Mun, Gi Long Kim, Tae Gyeom Lee, Byung Rok Ahn, Kyoung Jin Cha
  • Patent number: 11721485
    Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and an internal electrode, an electrode layer connected to the internal electrode, and a conductive resin layer disposed on the electrode layer. The conductive resin layer includes a conductive metal, a metal having a lower melting point than the conductive metal, a conductive carbon, and a base resin. The metal having the lower melting point than the conductive metal is tin (Sn). The conductive metal of the conductive resin layer includes at least one of copper (Cu), nickel (Ni), silver (Ag), and silver-palladium (Ag—Pd).
    Type: Grant
    Filed: March 25, 2022
    Date of Patent: August 8, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Hun Park, Won Kuen Oh, Tae Gyeom Lee, Ji Hong Jo
  • Publication number: 20230207210
    Abstract: A multilayer electronic component according to another exemplary embodiment of the present disclosure may suppress occurrence of a short circuit between the internal electrodes, lower capacitance or reduced breakdown voltage by controlling an area fraction of a region of a capacitance formation portion, in which a range of brightness intensity is 110% or more and 126% or less compared to an average value of brightness intensity of a cover portion.
    Type: Application
    Filed: May 25, 2022
    Publication date: June 29, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Gyeom LEE, Gi Long KIM, Seon Jae MUN, Byung Rok AHN, Kyoung Jin CHA
  • Publication number: 20230207192
    Abstract: A multilayer electronic component according to an exemplary embodiment of the present disclosure may control connectivity of an end of an internal electrode, thereby suppressing occurrence of a short circuit between the internal electrodes, reduced capacitance or lower breakdown voltage.
    Type: Application
    Filed: May 24, 2022
    Publication date: June 29, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Gyeom LEE, Gi Long KIM, Seon Jae MUN, Byung Rok AHN, Kyoung Jin CHA
  • Publication number: 20230207209
    Abstract: A multilayer electronic component includes: a body including a plurality of dielectric layers and a plurality of internal electrodes alternately disposed with the dielectric layers in a first direction, wherein when a space where the plurality of internal electrodes overlap each other in the first direction is defined as a capacitance forming portion, the plurality of internal electrodes include internal electrodes that are curved at end portions thereof in the capacitance forming portion and internal electrodes that are flat in the capacitance forming portion, and in a cross section of the body in the first and second directions.
    Type: Application
    Filed: May 20, 2022
    Publication date: June 29, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Gyeom Lee, Gi Long Kim, Seon Jae Mun, Byung Rok Ahn, Kyoung Jin Cha
  • Patent number: 11676766
    Abstract: A multilayer capacitor includes a capacitor body having first through six surfaces, and having alternately stacked first internal electrodes and second internal electrodes having dielectric layers therebetween and each having one end thereof exposed through a respective one of third and fourth surfaces. First and second conductive layers respectively include first and second connection portions respectively disposed on the third and fourth surfaces of the capacitor body and respectively connected to the first and second internal electrodes, and first and second band portions respectively extending from the first and second connection portions to respective portions of the first, second, fifth, and sixth surfaces of the capacitor body. First and second reinforcing layers each include a carbon material and an impact-absorbing binder and are respectively disposed on the first and second band portions.
    Type: Grant
    Filed: March 29, 2022
    Date of Patent: June 13, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Won Kuen Oh, Hye Hun Park, Tae Gyeom Lee
  • Publication number: 20220392706
    Abstract: A multilayer electronic component according to an exemplary embodiment of the present disclosure may control connectivity of an end of an internal electrode, thereby suppressing occurrence of a short circuit between the internal electrodes, reduced capacitance or lower breakdown voltage. The internal electrode may include a plurality of conductor portions and a plurality of cut-off portions.
    Type: Application
    Filed: April 27, 2022
    Publication date: December 8, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong Ho Lee, Seon Jae Mun, Gi Long Kim, Tae Gyeom Lee, Byung Rok Ahn, Kyoung Jin Cha
  • Publication number: 20220392703
    Abstract: There is provided a multilayer electronic component in which a short circuit between the internal electrodes, a decrease in capacitance, a decrease in breakdown voltage, and the like, may be suppressed by controlling an area fraction occupied by a region in which an intensity of brightness in a capacitance formation portion is 110% or more and 126% or less of an average value of an intensity of brightness of a cover portion.
    Type: Application
    Filed: May 16, 2022
    Publication date: December 8, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seon Jae MUN, Gi Long KIM, Tae Gyeom LEE, Byung Rok AHN, Kyoung Jin CHA, Jong Ho LEE
  • Publication number: 20220384114
    Abstract: A multilayer electronic component includes: a body including internal electrodes alternately disposed with dielectric layers in a first direction, wherein when a region in which the internal electrodes overlap each other in the first direction is a capacitance forming portion, the internal electrodes include internal electrodes that are curved at end portions thereof in the capacitance forming portion and internal electrodes that are flat in the capacitance forming portion, and in a cross-section of the body in the first and second directions, (F1+F2)/D1×100 is 35 or less, where F1 is a maximum distance from an uppermost internal electrode to an uppermost flat internal electrode in the first direction, F2 is a maximum distance from a lowermost internal electrode to a lowermost flat internal electrode in the first direction, and D1 is a size of the capacitance forming portion in the first direction at the center thereof in the second direction.
    Type: Application
    Filed: April 19, 2022
    Publication date: December 1, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seon Jae MUN, Gi Long KIM, Kyoung Jin CHA, Tae Gyeom LEE, Byung Rok AHN, Jong Ho LEE
  • Patent number: 11393629
    Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric and an internal electrode, an electrode layer electrically connected to the internal electrode, and a conductive resin layer disposed on the electrode layer and including a conductive metal, a graphene platelet, and a base resin.
    Type: Grant
    Filed: January 14, 2021
    Date of Patent: July 19, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Won Kuen Oh, Tae Gyeom Lee, Hang Kyu Cho, Hye Hun Park, Han Seong Jung
  • Publication number: 20220223347
    Abstract: A multilayer ceramic electronic component includes a ceramic body having a dielectric layer and an internal electrode, an electrode layer connected to the internal electrode, and a conductive resin layer disposed on the electrode layer and including a conductive metal, a metal having a lower melting point than the conductive metal, a conductive carbon, and a base resin. The conductive carbon is included in the conductive resin layer in an amount of 0.5 to 5.0 parts by weight based on 100 parts by weight of the conductive metal.
    Type: Application
    Filed: March 25, 2022
    Publication date: July 14, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Hun PARK, Won Kuen OH, Tae Gyeom LEE, Ji Hong JO
  • Publication number: 20220223348
    Abstract: A multilayer capacitor includes a capacitor body having first through six surfaces, and having alternately stacked first internal electrodes and second internal electrodes having dielectric layers therebetween and each having one end thereof exposed through a respective one of third and fourth surfaces. First and second conductive layers respectively include first and second connection portions respectively disposed on the third and fourth surfaces of the capacitor body and respectively connected to the first and second internal electrodes, and first and second band portions respectively extending from the first and second connection portions to respective portions of the first, second, fifth, and sixth surfaces of the capacitor body. First and second reinforcing layers each include a carbon material and an impact-absorbing binder and are respectively disposed on the first and second band portions.
    Type: Application
    Filed: March 29, 2022
    Publication date: July 14, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Won Kuen Oh, Hye Hun Park, Tae Gyeom Lee
  • Patent number: 11322305
    Abstract: A multilayer capacitor includes a capacitor body having first through six surfaces, and having alternately stacked first internal electrodes and second internal electrodes having dielectric layers therebetween and each having one end thereof exposed through a respective one of third and fourth surfaces. First and second conductive layers respectively include first and second connection portions respectively disposed on the third and fourth surfaces of the capacitor body and respectively connected to the first and second internal electrodes, and first and second band portions respectively extending from the first and second connection portions to respective portions of the first, second, fifth, and sixth surfaces of the capacitor body. First and second reinforcing layers each include a carbon material and an impact-absorbing binder and are respectively disposed on the first and second band portions.
    Type: Grant
    Filed: January 31, 2020
    Date of Patent: May 3, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Won Kuen Oh, Hye Hun Park, Tae Gyeom Lee