Abstract: A dynamic random access memory (DRAM) cell array using facing bars and a method of fabricating the DRAM cell array are disclosed. A first DRAM cell and a second DRAM cell of each of DRAM cell pairs of a DRAM cell array fabricated using a method of fabricating a DRAM cell array share a facing bar and a bit line plug therebetween. Thus, the overall layout area is greatly reduced by a DRAM cell array fabricated using the method of fabricating the DRAM cell array. Further, in the method of fabricating the DRAM cell array, a storage of each of the DRAM cells of the DRAM cell array is formed as a multi-fin type having a plurality of lateral protrusions, thereby greatly increasing an area of the storage.

Abstract: A NAND flash memory device having a facing bar and a method of fabricating the same are provided. The method includes forming one transistor or a plurality of stack transistors as cell transistors on two side surfaces of a facing bar to have transmission channels thereat. In this case, the height of the facing bar may be easily increased. Thus, not only a layout area of unit transistors including the cell transistors but also a layout area of cell strings may be minimized, and lengths of the transmission channels of the cell transistors may be sufficiently extended. As a result, according to the NAND flash memory device and the method of fabricating the same, the overall operating characteristics are improved.

Abstract: A dynamic random access memory (DRAM) cell array using facing bars and a method of fabricating the DRAM cell array are disclosed. A first DRAM cell and a second DRAM cell of each of DRAM cell pairs of a DRAM cell array fabricated using a method of fabricating a DRAM cell array share a facing bar and a bit line plug therebetween. Thus, the overall layout area is greatly reduced by a DRAM cell array fabricated using the method of fabricating the DRAM cell array. Further, in the method of fabricating the DRAM cell array, a storage of each of the DRAM cells of the DRAM cell array is formed as a multi-fin type having a plurality of lateral protrusions, thereby greatly increasing an area of the storage.

Abstract: A NAND flash memory device having a facing bar and a method of fabricating the same are provided. The method includes forming one transistor or a plurality of stack transistors as cell transistors on two side surfaces of a facing bar to have transmission channels thereat. In this case, the height of the facing bar may be easily increased. Thus, not only a layout area of unit transistors including the cell transistors but also a layout area of cell strings may be minimized, and lengths of the transmission channels of the cell transistors may be sufficiently extended. As a result, according to the NAND flash memory device and the method of fabricating the same, the overall operating characteristics are improved.

Abstract: The fabricating method of a DRAM cell includes forming a facing bar that extends in a direction of the word line; forming a gate of the cell transistor on one side surface of the facing bar; forming a bit line plug that is electrically connected to one side of the transmission channel, which is formed on the one side surface of the facing bar; and forming the storage that is electrically connected to the other side of the transmission channel, which is formed on the horizontal surface of the semiconductor substrate. A pair of DRAM cells shares a facing bar and a bit line plug. In accordance with the present disclosure, a required layout area is significantly reduced.

Abstract: The fabricating method of a DRAM cell includes forming a facing bar that extends in a direction of the word line; forming a gate of the cell transistor on one side surface of the facing bar; forming a bit line plug that is electrically connected to one side of the transmission channel, which is formed on the one side surface of the facing bar; and forming the storage that is electrically connected to the other side of the transmission channel, which is formed on the horizontal surface of the semiconductor substrate. A pair of DRAM cells shares a facing bar and a bit line plug. In accordance with the present disclosure, a required layout area is significantly reduced.

Abstract: A flash memory device reducing a layout area is provided. In the flash memory device, even power transistors and odd power transistors of a plurality of power connection portions corresponding to a plurality of pairs of bit lines and even select transistors and odd select transistors of a plurality of select connection portions corresponding thereto are disposed in one common active region. In the flash memory device, since the number of insulation regions/layout areas for distinguishing active regions is reduced, a layout length in the vertical direction is reduced, ultimately reducing an entire required layout area considerably.

Abstract: A flash memory device reducing a layout area is provided. In the flash memory device, even power transistors and odd power transistors of a plurality of power connection portions corresponding to a plurality of pairs of bit lines and even select transistors and odd select transistors of a plurality of select connection portions corresponding thereto are disposed in one common active region. In the flash memory device, since the number of insulation regions/layout areas for distinguishing active regions is reduced, a layout length in the vertical direction is reduced, ultimately reducing an entire required layout area considerably.

Abstract: A ternary content addressable memory (TCAM) device comprising a plurality of TCAM cells for storing data, each TCAM cell having two memory cells and a comparison circuit for comparing between data stored in the memory cells and data input on a search line pair connected to the comparison circuit, wherein the comparison circuit comprises a first plurality of MOS transistors connected between a match line and a second plurality of MOS transistors, the second plurality of MOS transistors being connected to ground, wherein the first plurality of MOS transistors are gated by signals from the memory cells connected thereto and the second plurality of transistors are gated by signals from a search line pair. The TCAM device includes redundant memory cells which replaces by corresponding column memory cells determined to be defective. Each line of a search line pair is connected to a defective cell is discharged to ground.

Abstract: A ternary content addressable memory (TCAM) device comprising a plurality of TCAM cells for storing data, each TCAM cell having two memory cells and a comparison circuit for comparing between data stored in the memory cells and data input on a search line pair connected to the comparison circuit, wherein the comparison circuit comprises a first plurality of MOS transistors connected between a match line and a second plurality of MOS transistors, the second plurality of MOS transistors being connected to ground, wherein the first plurality of MOS transistors are gated by signals from the memory cells connected thereto and the second plurality of transistors are gated by signals from a search line pair. The TCAM device includes redundant memory cells which replaces by corresponding column memory cells determined to be defective. Each line of a search line pair is connected to a defective cell is discharged to ground.

Abstract: A ternary content addressable memory (TCAM) device comprising a plurality of TCAM cells for storing data, each TCAM cell having two memory cells and a comparison circuit for comparing between data stored in the memory cells and data input on a search line pair connected to the comparison circuit, wherein the comparison circuit comprises a first plurality of MOS transistors connected between a match line and a second plurality of MOS transistors, the second plurality of MOS transistors being connected to ground, wherein the first plurality of MOS transistors are gated by signals from the memory cells connected thereto and the second plurality of transistors are gated by signals from a search line pair. The TCAM device includes redundant memory cells which replaces by corresponding column memory cells determined to be defective. Each line of a search line pair is connected to a defective cell is discharged to ground.

Abstract: A semiconductor device layout involving the following: arranging active regions of a plurality of transistors having at least more than one first and second electrodes disposed on a substrate; arranging a plurality of gates of transistors between more than one first and second electrodes of those active regions respectively by positioning at least more than one gates having predetermined width and length at a constant gap on the substrate; and arranging a plurality of dummy gates having predetermined width and length between a plurality of transistors (or between and outside transistors) at the same gap as that of the gates of transistors on the substrate, so that all the gates of transistors are arranged at a constant gap to minimize the variance of process deviations and accordingly reduce the difference of threshold voltage of transistors, thereby increasing reliability of the semiconductor device.

Abstract: A ternary content addressable memory (TCAM) device comprising a plurality of TCAM cells for storing data, each TCAM cell having two memory cells and a comparison circuit for comparing between data stored in the memory cells and data input on a search line pair connected to the comparison circuit, wherein the comparison circuit comprises a first plurality of MOS transistors connected between a match line and a second plurality of MOS transistors, the second plurality of MOS transistors being connected to ground, wherein the first plurality of MOS transistors are gated by signals from the memory cells connected thereto and the second plurality of transistors are gated by signals from a search line pair. The TCAM device includes redundant memory cells which replaces by corresponding column memory cells determined to be defective. Each line of a search line pair is connected to a defective cell is discharged to ground.

Abstract: A semiconductor device comprises a plurality of input/output pads, and a plurality of input buffers for receiving external signals synchronized with a clock signal through corresponding ones of the input/output pads, wherein the input buffers are arranged adjacent to each other to minimize skewing of the clock signal to the input buffers.