Patents by Inventor Tae H. Park

Tae H. Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6804440
    Abstract: An integrated device includes a waveguide, which may be connected to a photonic circuit and an external fiber, and an on-chip device formed on an optical chip by forming a region in which the waveguide terminates. The region is bounded by reflective surfaces. Light coming from the waveguide is essentially trapped inside the region and directed to an on-chip device disposed in the region. An integrated device consists of a low index difference waveguide, an on-chip mode converter, a high index difference waveguide, and an on-chip function formed on a single optical chip so that the high index difference waveguide is close to the substrate surface upon which the mode converter is formed. Substrate surface height differences are provided to define different substrate surface mounting heights for a low index difference waveguide, high index difference waveguide, a mode converter, and an on-chip device.
    Type: Grant
    Filed: December 7, 2002
    Date of Patent: October 12, 2004
    Assignee: LNL Technologies, Inc.
    Inventors: Kevin K. Lee, Desmond R. Lim, Tae H. Park
  • Publication number: 20040017962
    Abstract: An integrated device includes a waveguide, which may be connected to a photonic circuit and an external fiber, and an on-chip device formed on an optical chip by forming a region in which the waveguide terminates. The region is bounded by reflective surfaces Light coming from the waveguide is essentially trapped inside the region and directed to an on-chip device disposed in the region.
    Type: Application
    Filed: December 7, 2002
    Publication date: January 29, 2004
    Inventors: Kevin K. Lee, Desmond R. Lim, Tae H. Park
  • Patent number: 5631266
    Abstract: The present invention relates to quinolone carboxylic acid derivatives having useful antibacterial activities of formula (I): ##STR1## wherein, R.sub.1, R.sub.2, and R.sub.3, which may be the same or different, are each hydrogen or a halogen atom, or a lower alkyl group optionally substituted with an amino or a hydroxy group;R.sub.4 is hydrogen atom, a lower alkyl, benzyl, t-butoxycarbonyl or ethoxycarbonyl group;R.sub.5 is hydrogen, chlorine atom, methyl or an amino group;R.sub.6 is a lower alkyl group, or a cyclopropyl or a phenyl group optionally substituted with a halogen atom; andX is nitrogen atom, or a methyne group optionally substituted with a lower alkyl or a lower alkoxy group or a halogen atom, and pharmaceutically acceptable salts thereof, and processes for preparing these compounds. The present invention also relates to novel intermediates which are useful for preparing the quinolone compounds of the invention.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: May 20, 1997
    Assignee: Korea Research Institute of Chemical Technology
    Inventors: Wan J. Kim, Tae H. Park, Moon H. Kim, Tae S. Lee, Keun S. Nam
  • Patent number: 5612261
    Abstract: The present invention relates to a novel sealing glass composition, in particular, one which comprises solid PbO--ZnO--B.sub.2 O.sub.3 glass and natural garnet as a filler component. This composition has the advantage that thermal strain does not occur at the interface between the crystalline glass and filler because of the excellent chemical affinity. This prevents cracks from propagating at the interface between the main glass and filler, thereby improving the mechanical strength of the glass.
    Type: Grant
    Filed: June 23, 1995
    Date of Patent: March 18, 1997
    Assignee: Samsung Corning Co., Ltd
    Inventors: Byung C. Lim, Tae H. Park, Tae H. Park
  • Patent number: 5510300
    Abstract: The present invention relates to low temperature sealing glass compositions using ceramic composite filler useful for sealing alumina ceramic package, in particular, to compositions for hermetic-sealing cap and base of alumina package which consists of a solid PbO-B.sub.2 O.sub.3 glass powder and a filler selected from zinc zirconium silicate composite or magnesium aluminum zirconium silicate composite as a low thermal expansion ceramic composite. The used composite filler composes of zircon and willemite crystal phase or zircon and cordierite crystal phase uniformly mixed on the filler and has the low thermal expansion coefficient of 20.degree..about.40.degree..times.10.sup.-7 /.degree.C.
    Type: Grant
    Filed: June 29, 1995
    Date of Patent: April 23, 1996
    Assignee: Samsung Corning Co., Ltd.
    Inventors: Byung C. Lim, Yoo S. Hong, Ki Y. Lee, Tae H. Park
  • Patent number: 5498615
    Abstract: The present invention relates to novel quinolone carboxylic acid derivatives having useful antibacterial activities of formula (I): ##STR1## wherein, R.sub.1, R.sub.2, and R.sub.3, which may be the same or different, are each hydrogen or a halogen atom, or a lower alkyl group optionally substituted with an amino or a hydroxy group;R.sub.4 is hydrogen atom, a lower alkyl, benzyl, t-butoxycarbonyl or ethoxycarbonyl group;R.sub.5 is hydrogen, chlorine atom, methyl or an amino group;R.sub.6 is a lower alkyl group, or a cyclopropyl or a phenyl group optionally substituted with a halogen atom; andX is a methyne group optionally substituted with a lower alkyl or a lower alkoxy group or a halogen atom, and pharmaceutically acceptable salts thereof, and processes for preparing these compounds. The present invention also relates to novel intermediates which are useful for preparing the quinolone compounds of the invention.
    Type: Grant
    Filed: July 20, 1994
    Date of Patent: March 12, 1996
    Assignee: Korea Research Institute of Chemical Technology
    Inventors: Wan J. Kim, Tae H. Park, Moon H, Kim, Tae S. Lee, Keun S. Nam