Patents by Inventor Tae Ha Woo

Tae Ha Woo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8484889
    Abstract: The present invention relates to a seed sticker for seeding and planting flowers or sprouts easily and quickly in a small vessel or in a flower garden and a manufacturing method thereof. The present invention is characterized by a seed sticker, inside of which a seed is enshrined, comprising: a transfer paper wherein a coating layer is formed on the surface of the transfer paper; an adhesive layer which is formed on the surface of the coating layer; a seed pellet which is enshrined on the surface of the adhesive layer; a red clay soil sheet accumulated over the upper part of the seed pellet; and a polyvinyl alcohol (PVA) sheet accumulated over the upper part of the red clay soil sheet and covering both the seed pellet and the red clay soil sheet, and the edge of which is bonded to the adhesive layer.
    Type: Grant
    Filed: September 29, 2009
    Date of Patent: July 16, 2013
    Assignee: OMICSIS, Inc.
    Inventors: Tae Ha Woo, Jung Min Seo
  • Publication number: 20120011770
    Abstract: The present invention relates to a seed sticker for seeding and planting flowers or sprouts easily and quickly in a small vessel such as a pot at home or in a flower garden and a manufacturing method thereof. The present invention is characterized by a seed sticker inside of which a seed is enshrined comprising: a transfer paper 10 wherein a coating layer 11 is formed on the surface of the transfer paper; an adhesive layer 20 which is formed on the surface of the coating layer 11; a seed pellet 30 which is enshrined on the surface of the adhesive layer 20; a red clay soil sheet 40 which is accumulated over the upper part of the seed pellet 30; and a polyvinyl alcohol (PVA) sheet which is accumulated over the upper part of the red clay soil sheet 40 and covers both the seed pellet and the red clay soil sheet and the edge of which is bonded to the adhesive layer 30. It is possible to cultivate a desired kind of plant into desired forms by producing the seeds in a sticker form as disclosed above.
    Type: Application
    Filed: September 29, 2009
    Publication date: January 19, 2012
    Applicant: Omicsis, Inc.
    Inventors: Tae Ha Woo, Jung Min Seo