Abstract: The inventive concept provides a substrate treating method. The substrate treating method includes pre-treating a substrate by cleaning the substrate; etching the substrate by supplying an etchant and heating a substrate supplied with the etchant; and post-treating the substrate after the etching the substrate, and wherein the pre-treating the substrate, the etching the substrate, and the post-treating the substrate are each performed in different chambers, a substrate on which the pre-treating the substrate is completed is transferred in a dry state to a chamber at which the etching the substrate is performed, and a substrate on which the etching the substrate is completed is transferred in a wetted state with a liquid to a chamber at which the post-treating the substrate is performed.

Abstract: A chair capable of allowing positions of armrests and a back plate to be simultaneously adjusted having an integrated back plate cell including a backrest portion and armrest portions extending forward from the backrest portion, a lower frame including a seat plat support portion and an armrest support portion which extends upward from the seat plat support portion and is coupled to each of the armrest portions, and a fixing lever which fixes the armrest portion to the armrest support portion, wherein the integrated back plate cell is obliquely movable relative to the lower frame.

Abstract: A chair capable of allowing positions of armrests and a back plate to be simultaneously adjusted having an integrated back plate cell including a backrest portion and armrest portions extending forward from the backrest portion, a lower frame including a seat plat support portion and an armrest support portion which extends upward from the seat plat support portion and is coupled to each of the armrest portions, and a fixing lever which fixes the armrest portion to the armrest support portion, wherein the integrated back plate cell is obliquely movable relative to the lower frame.