Abstract: An integrated circuit may include a first active region and a second active region, and the first and second active regions may extend on a substrate in a first horizontal direction in parallel to each other and have different conductivity types from each other. A first gate line may extend in a second horizontal direction crossing the first horizontal direction, and may form a first transistor with the first active region. The first transistor may include a gate to which a first input signal is applied. The first gate line may include a first partial gate line that overlaps the first active region in a perpendicular direction and that has an end on a region between the first and second active regions.

Abstract: A display device includes a substrate including an emission area and a non-emission area, alignment electrodes arranged to be spaced from each other in a first direction on the substrate and extending in a second direction crossing the first direction, and pixels arranged along the second direction. Pixels adjacent to each other in the second direction from among the pixels may be configured to emit light of different colors. Each of the pixels may include first light emitting elements on the alignment electrodes and arranged along the second direction, second light emitting elements on the alignment electrodes, spaced from the first light emitting elements in the first direction, and arranged along the second direction, a first pixel electrode electrically connected to a first driving power and first ends of the first light emitting elements, a second pixel electrode spaced from the first pixel electrode in the first direction.

Abstract: A display device may include pixels on a substrate. Each of the pixels may include: a first alignment electrode and a second alignment electrode located on the substrate and spaced from each other; a first insulating layer on the first alignment electrode and the second alignment electrode; a light emitting element located on the first insulating layer between the first and second alignment electrodes; a dummy pattern located between the first insulating layer and the light emitting element; a second insulating layer located on the light emitting element and exposing first and second ends of the light emitting element; a first electrode electrically connected to the first end of the light emitting element; and a second electrode spaced from the first electrode, and electrically connected to the second end of the light emitting element. The dummy pattern may include a same material as the second insulating layer.

Abstract: A display device includes: light emitting elements, each of the light emitting elements including a first end having a first polarity and a second end having a second polarity different from the first polarity; and a first type connection electrode contacting the first ends and/or the second ends of the light emitting elements, wherein a first type connection electrode includes: a middle portion extending in a first direction; a first electrode portion extending from the middle portion toward a first side in a second direction intersecting the first direction; a second electrode portion extending from the middle portion toward the first side in the second direction and spaced from the first electrode portion by a first width in the first direction; a third electrode portion extending from the middle portion toward a second side in the second direction; and a fourth electrode portion.

Abstract: An apparatus includes a lighting unit configured to irradiate a light emitting device package including a light transmitting resin containing a light conversion material with light having a certain color; a camera configured to capture an image of the light emitting device package; and a controller configured to determine color coordinates of the light emitting device package using the image, captured by the camera, to determine whether the light emitting device package is defective.

Abstract: Provided is a light emitting diode (LED) module. The LED module includes: a light emitting chip on a substrate; and an optical lens on the substrate configured to envelop the light emitting chip, wherein the optical lens includes a body comprising a groove receiving the light emitting chip therein and having a dome-shaped upper surface and a ring-shaped supporting portion protruding from a lower surface of the body.

Abstract: An apparatus includes a lighting unit configured to irradiate a light emitting device package including a light transmitting resin containing a light conversion material with light having a certain color; a camera configured to capture an image of the light emitting device package; and a controller configured to determine color coordinates of the light emitting device package using the image, captured by the camera, to determine whether the light emitting device package is defective.

Abstract: A resin dispensing apparatus is provided. The resin dispensing apparatus includes an external body portion including a discharge nozzle configured to discharge a phosphor-containing resin, and an internal body portion including at least one flow passage, the internal body portion being mounted within the external body portion. An axial length of the internal body portion is shorter than an axial length of the external body portion.

Abstract: Provided is a light emitting diode (LED) module. The LED module includes: a light emitting chip on a substrate; and an optical lens on the substrate configured to envelop the light emitting chip, wherein the optical lens includes a body comprising a groove receiving the light emitting chip therein and having a dome-shaped upper surface and a ring-shaped supporting portion protruding from a lower surface of the body.

Abstract: Provided are a curved semiconductor package, and a device including the semiconductor package. The semiconductor package includes: a flexible printed circuit board (PCB) including a fixed bent portion formed as an arch-shape and including a first surface facing a first direction and a second surface opposite to the first surface; at least one semiconductor chip attached to the second surface of the fixed bent portion of the flexible PCB; and a mold layer having rigidity and formed on the second surface of the fixed bending portion of the flexible PCB while surrounding the at least one semiconductor chip.

Abstract: Provided are a curved semiconductor package, and a device including the semiconductor package. The semiconductor package includes: a flexible printed circuit board (PCB) including a fixed bent portion formed as an arch-shape and including a first surface facing a first direction and a second surface opposite to the first surface; at least one semiconductor chip attached to the second surface of the fixed bent portion of the flexible PCB; and a mold layer having rigidity and formed on the second surface of the fixed bending portion of the flexible PCB while surrounding the at least one semiconductor chip.