Patents by Inventor TAE-HEUM KIM

TAE-HEUM KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solid state drive package and data storage system including the same
    Patent number: 9847319
    Abstract: A solid state drive (SSD) package type has a lower package including a lower package substrate, a controller chip mounted on the lower package substrate, and a plurality of upper packages disposed on the lower package as spaced apart from each other. The plurality of upper packages includes at least one non-volatile memory and at least one first individual electronic component. The upper packages are electrically connected to the lower package such that the package type is a package-on-package (PoP) type. The height of the first individual electronic component is greater than the spacing between the lower package and each of the upper packages.
    Type: Grant
    Filed: May 6, 2016
    Date of Patent: December 19, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sang-Sub Song, Sung-Wook Hwang, Yeoung-Jun Cho, Ki-Hong Jeong, Tae-Heum Kim
  • SOLID STATE DRIVE PACKAGE AND DATA STORAGE SYSTEM INCLUDING THE SAME
    Publication number: 20170025385
    Abstract: A solid state drive (SSD) package type has a lower package including a lower package substrate, a controller chip mounted on the lower package substrate, and a plurality of upper packages disposed on the lower package as spaced apart from each other. The plurality of upper packages includes at least one non-volatile memory and at least one first individual electronic component. The upper packages are electrically connected to the lower package such that the package type is a package-on-package (PoP) type. The height of the first individual electronic component is greater than the spacing between the lower package and each of the upper packages.
    Type: Application
    Filed: May 6, 2016
    Publication date: January 26, 2017
    Inventors: SANG-SUB SONG, SUNG-WOOK HWANG, YEOUNG-JUN CHO, KI-HONG JEONG, TAE-HEUM KIM