Abstract: There is provided a method of a terminal for performing task offloading with at least one satellite in an MEC network. The method includes the steps of: acquiring at least one initial input value; acquiring information needed for determining whether or not to perform task offloading, from the at least one satellite in time slot t; setting an object function according to whether or not to perform task offloading on the basis of information on the terminal and the information needed for determining whether or not to perform task offloading acquired from the at least one satellite in time slot t; acquiring a minimum value of each object function according to whether or not to perform task offloading, and comparing the minimum value of each object function; and determining whether or not to perform task offloading to the at least one satellite in time slot t according to a result of the comparison.

Abstract: Provided is a substrate processing apparatus, and more particularly, to a substrate processing apparatus that performs substrate processing on a plurality of substrates in a process chamber defining a plurality of processing spaces. The substrate processing apparatus includes a process chamber in which N processing spaces are defined to process substrates, N gas injection units installed above the process chamber to respectively correspond to the N processing spaces, N substrate supports that face the gas injection units and support the substrates, a transfer support installed in the process chamber to support the substrates, a rotation support which is installed between the adjacent substrate supports that are substrate transfer paths according to rotation driving of the transfer support and on which the substrates are seated to be rotated about a vertical second rotation axis passing through the substrates.

Abstract: The present invention relates to a substrate processing apparatus and a substrate processing method, the substrate processing apparatus including: a load-lock chamber; a transfer chamber disposed on one side of the load-lock chamber; a process chamber disposed on one side of the transfer chamber; and a substrate transfer robot disposed inside the transfer chamber to transfer a substrate between the load-lock chamber and the process chamber, wherein the process chamber includes a plurality of substrate support plates configured to support the substrate, a plurality of gas spray units configured to respectively spray process gases on the plurality of substrate support plates, a turntable configured to transfer the substrate between the plurality of substrate support plates, a first gate through which an unprocessed substrate is taken in, and a second gate through which a processed substrate is taken out; and the substrate transfer robot independently transfers the unprocessed substrate and the processed substra