Patents by Inventor Tae Ho JO

Tae Ho JO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9158081
    Abstract: A semiconductor package includes a substrate and an optical communication part. A first chip stack part and a second chip stack part are disposed over the substrate and are separate from each other, and the optical communication part is disposed in a cavity formed in the substrate to provide an optical signal path between the first and second chip stack parts.
    Type: Grant
    Filed: November 25, 2013
    Date of Patent: October 13, 2015
    Assignee: SK HYNIX INC.
    Inventors: Tae Ho Jo, Taek Joong Kim, Wan Choon Park, Sung Su Park
  • Publication number: 20150010269
    Abstract: A semiconductor package includes a substrate and an optical communication part. A first chip stack part and a second chip stack part are disposed over the substrate and are separate from each other, and the optical communication part is disposed in a cavity formed in the substrate to provide an optical signal path between the first and second chip stack parts.
    Type: Application
    Filed: November 25, 2013
    Publication date: January 8, 2015
    Applicant: SK HYNIX INC.
    Inventors: Tae Ho JO, Taek Joong KIM, Wan Choon PARK, Sung Su PARK