Abstract: An image is decoded by deriving a first candidate list for the current block by using motion information of neighboring blocks of the current block; deriving a second candidate list for the current block by using previously reconstructed motion information; deriving a third candidate list by using the first candidate list and the second candidate list; and deriving a prediction block for the current block by using the third candidate list.

Abstract: The present invention relates to a method and apparatus for video encoding/decoding by using a geometric modified picture. The encoding method according to the present invention includes: generating a geometric modified picture by geometrically modifying a reference picture; and generating a first prediction block of a current block by performing inter prediction referencing the geometric modified picture.

Abstract: A lung phantom unit for radiotherapy according to an embodiment of the present disclosure may arrange, at a location not affected by a magnetic field, a phantom driving cylinder and a driving device which may move a lung mimic and a tumor mimic in a lung simulation block. The lung phantom unit may be used for general purpose even as a phantom for MRI-based and CT image-based radiotherapy. Since lung and tumor motions are implemented by air injection, it may be possible to precisely measure the motion and volume change of a lung according to subtle changes in air pressure so that customized radiotherapy suitable for a patient having various breathing patterns is possible.

Abstract: A display device includes a first substrate including a display area comprising pixels, and a non-display area surrounding the display area, a thin film transistor layer disposed on the first substrate and comprising a thin film transistor, a second substrate disposed on the thin film transistor layer and facing the first substrate, a sealing part disposed between the first substrate and the second substrate in the non-display area, and bonding the first and second substrates, a metal line disposed in the non-display area on the thin film transistor layer and overlapping the sealing part, and an antistatic member comprising a support supported by the metal line, a first receiver protruding from a top portion of the support to an exterior of the sealing part, and a second receiver protruding from a bottom portion of the support toward the exterior of the sealing part and facing the first receiver.

Abstract: The present invention relates to novel mesylate salt of N-(5-(4-(4-((dimethylamino)methyl)-3-phenyl-1H-pyrazol-1-yl)pyrimidine-2-ylamino)-4-methoxy-2-morpholinophenyl)acrylamide, a novel crystalline form thereof, and a process for preparing the same. More specifically, the present invention relates to mesylate salt of N-(5-(4-(4-((dimethylamino)methyl)-3-phenyl-1H-pyrazol-1-yl)pyrimidine-2-ylamino)-4-methoxy-2-morpholinophenyl)acrylamide, which is excellent in stability, solubility, and bioavailability when it is administered not only alone but also in combination with other drugs and which has a high purity, a crystalline form thereof, and a process for preparing the same.

Abstract: An image decoding method is disclosed in the present specification. An image decoding method according to the present invention may comprise deriving a candidate list for inter-prediction of a current block, deriving motion information of the current block by using the candidate list, deriving a cumulative coding information candidate by using the motion information of the current block, inserting the derived cumulative coding information candidate into a cumulative coding information candidate list and updating the candidate list by using the cumulative coding information candidate list, wherein the updated candidate list is used for inter-prediction of a block to be decoded after the current block.

Abstract: An electrodeionization filter includes: a housing having a water inlet and a water outlet; a first electrode installed inside the housing in a spiral shape; a second electrode installed inside the housing in a spiral shape so as to be spaced apart from the first electrode; and an ion exchange module installed between the first electrode and the second electrode for adsorbing or desorbing ionic substances contained in water introduced by an application of electricity. At least one of the first electrode and the second electrode has a structure in which a center portion thereof is denser than a peripheral region thereof. Accordingly, the lifespan of the electrodes of the electrodeionization filter can be increased, and the assembly of the electrodes and related parts can be easily facilitated.

Abstract: A semiconductor package includes a plurality of semiconductor chips stacked sequentially. Each semiconductor chip includes a substrate including a back surface and a front surface which are opposite to each other, a plurality of first back conductive pads disposed on the back surface, a plurality of second back conductive pads disposed on the back surface, and a redistribution pattern disposed on the back surface and disposed between the plurality of second back conductive pads.

Abstract: A display device including: a substrate; a plurality of light-emitting elements on the substrate; and a touch sensing layer disposed on the plurality of light-emitting elements, wherein the touch sensing layer includes: a first touch conductive layer; a first insulating layer disposed on the first touch conductive layer; and a second touch conductive layer disposed on the first insulating layer, and wherein the first insulating layer includes a light-converting material that converts light into near-infrared light.

Abstract: A display device includes a first pixel including a first emission area formed to emit light having a first color in a third direction, a second pixel including a second emission area formed to emit light having a second color different from the first color, a first partition wall in which a first opening overlapping the first emission area in a plan view is defined, a second partition wall in which a second opening overlapping the second emission area in the plan view is defined, and a first layer covering the first partition wall and the second partition wall. The first partition may be provided with a first height in the third direction. The second partition wall may be provided with a second height different from the first height.

Abstract: An image is decoded by deriving a first candidate list for the current block by using motion information of neighboring blocks of the current block; deriving a second candidate list for the current block by using previously reconstructed motion information; deriving a third candidate list by using the first candidate list and the second candidate list; and deriving a prediction block for the current block by using the third candidate list.

Abstract: The present invention relates to a method and apparatus for video encoding/decoding by using a geometric modified picture. The encoding method according to the present invention includes: generating a geometric modified picture by geometrically modifying a reference picture; and generating a first prediction block of a current block by performing inter prediction referencing the geometric modified picture.

Abstract: Provided is a near-infrared ray absorbing article. A near-infrared ray absorbing article of the present invention is capable of preventing a decrease in visible transmittance and near-infrared absorption due to the interaction between a plurality of organic materials forming light-absorbing layers. In addition, the near-infrared ray absorbing article of the present invention has the advantage of being able to be thinner. In addition, the near-infrared ray absorbing article of the present invention has the advantage of excellent mechanical properties such as strength and heat resistance.

Abstract: A super-steep switching device is provided. The super-steep switching device may include a substrate, a semiconductor channel on the substrate, a source electrode and a drain electrode, which are disposed on the semiconductor channel and spaced apart from each other, a gate electrode overlapping a portion of the semiconductor channel and not overlapping a remaining portion of the semiconductor channel, and an insulating layer disposed between the gate electrode and the semiconductor channel and covering an entire surface of the semiconductor channel.

Abstract: A heat treatment apparatus includes a furnace body, a roller inside the furnace body, a heater inside the furnace body, an upper and lower discharge pipes on the furnace body, and a lower supply pipe on the lower part of the furnace body. The furnace body includes areas having the upper and lower discharge pipes, the areas including a first area to an Nth area disposed sequentially along a second direction being a transport direction of each of the materials, a length of the first area in the second direction is shorter than lengths of the second area to the Nth area in the second direction, and in each of the first area to the Nth area, the upper discharge pipe and the lower supply pipe are not arranged in a straight line in a third direction being a height direction to be misaligned from each other.

Abstract: A super-steep switching device and an inverter device using the same are disclosed. The super-steep switching device includes a semiconductor channel disposed on a substrate and made of a semiconductor material having impact ionization characteristic; a source electrode and a drain electrode in contact with the semiconductor channel, wherein the source electrode and the drain electrode are disposed on the substrate and are spaced apart from each other; and a gate electrode disposed on the semiconductor channel so as to overlap only a portion of the semiconductor channel, wherein a top surface of the semiconductor channel includes a first area overlapping the gate electrode, and a second area non-overlapping the gate electrode, wherein a ratio of a length of the first area and a length of the second area is in a range of 1:0.1 to 0.4.

Abstract: Proposed are a substrate processing apparatus and a substrate processing method capable of efficiently preventing contamination of a substrate and a processing space caused by a reverse flow of purge gas.

Abstract: Provided is a semiconductor package. The semiconductor package may comprise a first die, a second die on the first die, and connection terminals, the first die comprises: a first silicon substrate that has a lower side and an upper side opposite to the lower side, first through vias, first chip pads, and a first dummy pattern on the upper side of the first silicon substrate, the first dummy pattern having a grid shape from a plan view and at least partially surrounding each of the first chip pads, the second die comprises: a second silicon substrate that has a lower side and an upper side opposite to the lower side, and second through vias, wherein the connection terminals and the first chip pads are in contact with each other and are electrically connected, respectively, and wherein the first dummy pattern includes a metal film or a polymer film.

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a housing having a treating space; a support unit configured to support a substrate in the treating space; and a brush unit configured to clean the substrate supported on the support unit, and wherein the brush unit includes: a body having a circular-shaped cross-section; and a plurality of contact pads protruding from the body and defining a plurality of groove portions for discharging foreign substances dropped from a substrate, each groove portion defined between adjacent contact pads, and wherein a width of the groove portion near a center of the body is different from a width of the groove portion near an edge of the body.

Abstract: A semiconductor package includes a mold substrate, at least one first semiconductor chip in the mold substrate and including chip pads, wiring bonding pads formed at a first surface of the mold substrate and connected to the chip pads by bonding wires, and a redistribution wiring layer covering the first surface of the mold substrate and including redistribution wirings connected to the wiring bonding wirings.