Patents by Inventor Tae Hong Lee

Tae Hong Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150085503
    Abstract: An illuminating device includes a light source module; a heat radiator including a heat radiating plate having a cavity open toward a front surface thereof and receiving the light source module therein and ventilation holes disposed along an edge of the cavity, and heat radiating fins extending to a rear surface of the heat radiating plate, disposed in a radial manner along an edge of the heat radiating plate and positioned between the ventilation holes to form ventilation channels therebetween communicating with the ventilation holes; a cooler fixed to the heat radiator to be in contact with ends of the heat radiating fins and including air jet holes allowing air to be blown toward the heat radiator; and an electrical connector connected to the light source module and the cooler and supplying electrical signals thereto.
    Type: Application
    Filed: August 23, 2011
    Publication date: March 26, 2015
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yun Whan Na, Han Byul Chang, Yong Keun Jee, Kyu Cheol Kang, Choong Gunn Park, Jin Jong Kim, Tae Hong Lee, Choul Ho Lee
  • Patent number: 7935971
    Abstract: The present invention relates to a light emitting diode module capable of facilitating the connection between light emitting diode modules. The present invention provides a light emitting diode module including an insulating layer, a first circuit pattern layer and a second circuit pattern layer which are stacked on a top surface and a bottom surface of the insulating layer respectively and have one ends protruding to an outside of the insulating layer and the other ends positioned inside the insulating layer, a solder resist layer coated on the first circuit pattern layer, a first via formed vertically through a portion of the solder resist layer to be electrically connected to the first circuit pattern layer, a second via formed vertically through a portion of the solder resist layer and the insulating layer to be electrically connected to the second circuit pattern layer and a light emitting element mounted on the solder resist layer.
    Type: Grant
    Filed: December 9, 2008
    Date of Patent: May 3, 2011
    Assignee: Samsung Led Co. Ltd.
    Inventors: Min Sang Lee, Tae Hong Lee, Won Hoe Koo, Kyung Seob Oh
  • Publication number: 20100044742
    Abstract: The present invention relates to a light emitting diode module capable of facilitating the connection between light emitting diode modules. The present invention provides a light emitting diode module including an insulating layer, a first circuit pattern layer and a second circuit pattern layer which are stacked on a top surface and a bottom surface of the insulating layer respectively and have one ends protruding to an outside of the insulating layer and the other ends positioned inside the insulating layer, a solder resist layer coated on the first circuit pattern layer, a first via formed vertically through a portion of the solder resist layer to be electrically connected to the first circuit pattern layer, a second via formed vertically through a portion of the solder resist layer and the insulating layer to be electrically connected to the second circuit pattern layer and a light emitting element mounted on the solder resist layer.
    Type: Application
    Filed: December 9, 2008
    Publication date: February 25, 2010
    Inventors: Min Sang LEE, Tae Hong Lee, Won Hoe Koo, Kyung Seob Oh
  • Patent number: D591695
    Type: Grant
    Filed: December 4, 2007
    Date of Patent: May 5, 2009
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kyung Seob Oh, Min Sang Lee, Tae Hong Lee