Abstract: Disclosed herein is an a compressor including a main body, a fixed scroll fixed on the inside of the main body, an orbiting scroll arranged to orbit relative to the fixed scroll, a compressing chamber formed by the fixed scroll and the orbiting scroll, an oil supply hole arranged to supply oil to a contact portion formed by the fixed scroll and the orbiting scroll, and an oil groove formed on an inner side of the contact portion to be closed to an outer side of the contact portion. The oil groove is extended into the form of an arc by being rotated by about 270 degrees or more along the circumference of the fixed scroll to cover the compressing chamber from the outside of the compressing chamber to supply oil all across the area of the contact portion easier which leads to more reliable operation of the compressor.

Abstract: Disclosed herein is an a compressor including a main body, a fixed scroll fixed on the inside of the main body, an orbiting scroll arranged to orbit relative to the fixed scroll, a compressing chamber formed by the fixed scroll and the orbiting scroll, an oil supply hole arranged to supply oil to a contact portion formed by the fixed scroll and the orbiting scroll, and an oil groove formed on an inner side of the contact portion to be closed to an outer side of the contact portion. The oil groove is extended into the form of an arc by being rotated by about 270 degrees or more along the circumference of the fixed scroll to cover the compressing chamber from the outside of the compressing chamber to supply oil all across the area of the contact portion easier which leads to more reliable operation of the compressor.

Abstract: A transformer of fully symmetric structure includes a primary coil assembly and a secondary coil assembly. The primary coil assembly includes a plurality of primary coils formed in a plurality of metal layers, and a first interlayer connection unit for connecting the primary coils. The secondary coil assembly includes a plurality of secondary coils formed in the plurality of metal layers, and a second interlayer connection unit for connecting the secondary coils. The primary and secondary coils formed in the same metal layer are concentric and axisymmetric with respect to a diameter line passing through a planar center point. A balanced-unbalanced transformer (balun) is a type of transformer that may be used to convert an unbalanced signal to a balanced one or vice versa. An integrated circuit may include a semiconductor substrate and a transformer. Electrical elements such as transistors may be formed on the semiconductor substrate.

Abstract: A transformer of fully symmetric structure includes a primary coil assembly and a secondary coil assembly. The primary coil assembly includes a plurality of primary coils formed in a plurality of metal layers, and a first interlayer connection unit for connecting the primary coils. The secondary coil assembly includes a plurality of secondary coils formed in the plurality of metal layers, and a second interlayer connection unit for connecting the secondary coils. The primary and secondary coils formed in the same metal layer are concentric and axisymmetric with respect to a diameter line passing through a planar center point. A balanced-unbalanced transformer (balun) is a type of transformer that may be used to convert an unbalanced signal to a balanced one or vice versa. An integrated circuit may include a semiconductor substrate and a transformer. Electrical elements such as transistors may be formed on the semiconductor substrate.

Abstract: A transformer includes a primary coil assembly and a secondary coil assembly juxtaposed in a stack and which are electromagnetically inductively coupled and substantially symmetrical to one another. The primary coil assembly includes a plurality of primary coils coplanar with first insulation layers, respectively, and symmetrical to each other, and a first via unit connecting adjacent ones of the primary coils to each other. The secondary coil assembly includes a plurality of secondary coils coplanar with a plurality of second insulation layers, respectively, and symmetrical to each other, and a second via unit connecting adjacent ones of the secondary coils to each other.

Abstract: Provided is a method for forming metal interconnect only in desired regions of a semiconductor device based on selective damascene using an insulation material against plating to form the metal interconnect without a Chemical Mechanical Polishing (CMP) or an additional lithography process. The selective damascene is stable and effective in the respect of cost and simplifies the semiconductor interconnect forming process.