Patents by Inventor Tae Hoon HAN
Tae Hoon HAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240145369Abstract: In one example, an electronic device comprises a substrate comprising a conductive structure and a dielectric structure, the dielectric structure comprising an upper dielectric layer, an electronic component over a top side of the substrate and coupled with the conductive structure, an encapsulant over the top side of the substrate and adjacent a lateral side of the electronic component, and a shield over the top side of the electronic component and contacting a lateral side of the encapsulant and a first lateral side of the substrate. The conductive structure comprises a first tab structure at the first lateral side of the substrate, and wherein the first tab structure contacts the shield and extends above the upper dielectric layer. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: October 28, 2022Publication date: May 2, 2024Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Soo Hyun Kim, Won Myoung Ki, Dong Hoon Han, Tae Kyeong Hwang
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Patent number: 11974433Abstract: A semiconductor memory device includes a third insulating pattern and a first insulating pattern on a substrate, the third insulating pattern and the first insulating pattern being spaced apart from each other in a first direction that is perpendicular to the substrate such that a bottom surface of the third insulating pattern and a top surface of the first insulating pattern face each other, a gate electrode between the bottom surface of the third insulating pattern and the top surface of the first insulating pattern, and including a first side extending between the bottom surface of the third insulating pattern and the top surface of the first insulating pattern, and a second insulating pattern that protrudes from the first side of the gate electrode by a second width in a second direction, the second direction being different from the first direction.Type: GrantFiled: January 14, 2022Date of Patent: April 30, 2024Assignee: Samsung Electronics Co., Ltd.Inventors: Joo-Heon Kang, Tae Hun Kim, Jae Ryong Sim, Kwang Young Jung, Gi Yong Chung, Jee Hoon Han, Doo Hee Hwang
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Patent number: 11950522Abstract: A method for manufacturing an electronic device including a semiconductor memory may include forming a first carbon electrode material, surface-treating the first carbon electrode material to decrease a surface roughness of the first carbon electrode material, and forming a second carbon electrode material on the treated surface of the first carbon electrode material. The second carbon electrode material may have a thickness that is greater than a thickness of the first carbon electrode material.Type: GrantFiled: June 22, 2022Date of Patent: April 2, 2024Assignee: SK hynix Inc.Inventors: Myoung Sub Kim, Tae Hoon Kim, Beom Seok Lee, Seung Yun Lee, Hwan Jun Zang, Byung Jick Cho, Ji Sun Han
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Patent number: 11795549Abstract: A metal plate to be used in the manufacture of a deposition mask comprises: a base metal plate; and a surface layer disposed on the base metal plate, wherein the surface layer includes elements different from those of the base metal plate, or has a composition ratio different from that of the base metal plate, and an etching rate of the base metal plate is greater than the etching rate of the surface layer. An embodiment includes a manufacturing method for a deposition mask having an etching factor greater than or equal to 2.5. The deposition mask of the embodiment includes a deposition pattern region and a non-deposition region, the deposition pattern region includes a plurality of through-holes, the deposition pattern region is divided into an effective region, a peripheral region, and a non-effective region, and through-holes can be formed in the effective region and the peripheral region.Type: GrantFiled: March 7, 2022Date of Patent: October 24, 2023Assignee: LG INNOTEK CO., LTD.Inventors: Dong Mug Seong, Jong Min Yun, Su Hyeon Cho, Hae Sik Kim, Tae Hoon Han, Hyo Won Son, Sang Yu Lee, Sang Beum Lee
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Patent number: 11732364Abstract: A metal plate to be used in the manufacture of a deposition mask comprises: a base metal plate; and a surface layer disposed on the base metal plate, wherein the surface layer includes elements different from those of the base metal plate, or has a composition ratio different from that of the base metal plate, and an etching rate of the base metal plate is greater than the etching rate of the surface layer. An embodiment includes a manufacturing method for a deposition mask having an etching factor greater than or equal to 2.5. The deposition mask of the embodiment includes a deposition pattern region and a non-deposition region, the deposition pattern region includes a plurality of through-holes, the deposition pattern region is divided into an effective region, a peripheral region, and a non-effective region, and through-holes can be formed in the effective region and the peripheral region.Type: GrantFiled: January 12, 2022Date of Patent: August 22, 2023Assignee: LG INNOTEK CO., LTD.Inventors: Dong Mug Seong, Jong Min Yun, Su Hyeon Cho, Hae Sik Kim, Tae Hoon Han, Hyo Won Son, Sang Yu Lee, Sang Beum Lee
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Publication number: 20220190250Abstract: A metal plate to be used in the manufacture of a deposition mask comprises: a base metal plate; and a surface layer disposed on the base metal plate, wherein the surface layer includes elements different from those of the base metal plate, or has a composition ratio different from that of the base metal plate, and an etching rate of the base metal plate is greater than the etching rate of the surface layer. An embodiment includes a manufacturing method for a deposition mask having an etching factor greater than or equal to 2.5. The deposition mask of the embodiment includes a deposition pattern region and a non-deposition region, the deposition pattern region includes a plurality of through-holes, the deposition pattern region is divided into an effective region, a peripheral region, and a non-effective region, and through-holes can be formed in the effective region and the peripheral region.Type: ApplicationFiled: March 7, 2022Publication date: June 16, 2022Inventors: Dong Mug SEONG, Jong Min YUN, Su Hyeon CHO, Hae Sik KIM, Tae Hoon HAN, Hyo Won SON, Sang Yu LEE, Sang Beum LEE
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Patent number: 11335854Abstract: A metal plate to be used in the manufacture of a deposition mask comprises: a base metal plate; and a surface layer disposed on the base metal plate, wherein the surface layer includes elements different from those of the base metal plate, or has a composition ratio different from that of the base metal plate, and an etching rate of the base metal plate is greater than the etching rate of the surface layer. An embodiment includes a manufacturing method for a deposition mask having an etching factor greater than or equal to 2.5. The deposition mask of the embodiment includes a deposition pattern region and a non-deposition region, the deposition pattern region includes a plurality of through-holes, the deposition pattern region is divided into an effective region, a peripheral region, and a non-effective region, and through-holes can be formed in the effective region and the peripheral region.Type: GrantFiled: March 27, 2020Date of Patent: May 17, 2022Assignee: LG INNOTEK CO., LTD.Inventors: Dong Mug Seong, Jong Min Yun, Su Hyeon Cho, Hae Sik Kim, Tae Hoon Han, Hyo Won Son, Sang Yu Lee, Sang Beum Lee
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Publication number: 20220149283Abstract: A metal plate to be used in the manufacture of a deposition mask comprises: a base metal plate; and a surface layer disposed on the base metal plate, wherein the surface layer includes elements different from those of the base metal plate, or has a composition ratio different from that of the base metal plate, and an etching rate of the base metal plate is greater than the etching rate of the surface layer. An embodiment includes a manufacturing method for a deposition mask having an etching factor greater than or equal to 2.5. The deposition mask of the embodiment includes a deposition pattern region and a non-deposition region, the deposition pattern region includes a plurality of through-holes, the deposition pattern region is divided into an effective region, a peripheral region, and a non-effective region, and through-holes can be formed in the effective region and the peripheral region.Type: ApplicationFiled: January 12, 2022Publication date: May 12, 2022Inventors: Dong Mug SEONG, Jong Min YUN, Su Hyeon Cho, Hae Sik Kim, Tae Hoon Han, Hyo Won Son, Sang Yu Lee, Sang Beum Lee
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Patent number: 10727409Abstract: A metal plate to be used in the manufacture of a deposition mask comprises: a base metal plate; and a surface layer disposed on the base metal plate, wherein the surface layer includes elements different from those of the base metal plate, or has a composition ratio different from that of the base metal plate, and an etching rate of the base metal plate is greater than the etching rate of the surface layer. An embodiment includes a manufacturing method for a deposition mask having an etching factor greater than or equal to 2.5. The deposition mask of the embodiment includes a deposition pattern region and a non-deposition region, the deposition pattern region includes a plurality of through-holes, the deposition pattern region is divided into an effective region, a peripheral region, and a non-effective region, and through-holes can be formed in the effective region and the peripheral region.Type: GrantFiled: August 22, 2017Date of Patent: July 28, 2020Assignee: LG INNOTEK CO., LTD.Inventors: Dong Mug Seong, Jong Min Yun, Su Hyeon Cho, Hae Sik Kim, Tae Hoon Han, Hyo Won Son, Sang Yu Lee, Sang Beum Lee
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Publication number: 20200227640Abstract: A metal plate to be used in the manufacture of a deposition mask comprises: a base metal plate; and a surface layer disposed on the base metal plate, wherein the surface layer includes elements different from those of the base metal plate, or has a composition ratio different from that of the base metal plate, and an etching rate of the base metal plate is greater than the etching rate of the surface layer. An embodiment includes a manufacturing method for a deposition mask having an etching factor greater than or equal to 2.5. The deposition mask of the embodiment includes a deposition pattern region and a non-deposition region, the deposition pattern region includes a plurality of through-holes, the deposition pattern region is divided into an effective region, a peripheral region, and a non-effective region, and through-holes can be formed in the effective region and the peripheral region.Type: ApplicationFiled: March 27, 2020Publication date: July 16, 2020Inventors: Dong Mug SEONG, Jong Min YUN, Su Hyeon CHO, Hae Sik KIM, Tae Hoon HAN, Hyo Won SON, Sang Yu LEE, Sang Beum LEE
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Publication number: 20190259951Abstract: A metal plate to be used in the manufacture of a deposition mask comprises: a base metal plate; and a surface layer disposed on the base metal plate, wherein the surface layer includes elements different from those of the base metal plate, or has a composition ratio different from that of the base metal plate, and an etching rate of the base metal plate is greater than the etching rate of the surface layer. An embodiment includes a manufacturing method for a deposition mask having an etching factor greater than or equal to 2.5. The deposition mask of the embodiment includes a deposition pattern region and a non-deposition region, the deposition pattern region includes a plurality of through-holes, the deposition pattern region is divided into an effective region, a peripheral region, and a non-effective region, and through-holes can be formed in the effective region and the peripheral region.Type: ApplicationFiled: August 22, 2017Publication date: August 22, 2019Inventors: Dong Mug SEONG, Jong Min YUN, Su Hyeon CHO, Hae Sik KIM, Tae Hoon HAN, Hyo Won SON, Sang Yu LEE, Sang Beum LEE
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Patent number: 9499103Abstract: Provided is a display room mirror, including a room mirror disposed in an inner part of a vehicle to detect a rear situation of the vehicle; and an organic light emitting diode (OLED) panel formed in a part or an entire part of a front surface of the room mirror, thereby improving a contrast and a reaction velocity and reducing a thickness and a weight of the room mirror.Type: GrantFiled: September 25, 2013Date of Patent: November 22, 2016Assignee: LG INNOTEK CO., LTD.Inventor: Tae Hoon Han
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Publication number: 20140085913Abstract: Provided is a display room mirror, including a room mirror disposed in an inner part of a vehicle to detect a rear situation of the vehicle; and an organic light emitting diode (OLED) panel formed in a part or an entire part of a front surface of the room mirror, thereby improving a contrast and a reaction velocity and reducing a thickness and a weight of the room mirror.Type: ApplicationFiled: September 25, 2013Publication date: March 27, 2014Applicant: LG Innotek Co., Ltd.Inventor: Tae Hoon HAN