Abstract: A robot synchronization sealer discharge system is provided. The robot synchronization sealer discharge system is interlocked with a robot for a sealer work of a vehicle factory and includes: a sealer gun mounted on a robot and moving along an application path of a vehicle body to discharge a sealer and a communication unit for receiving a TCP speed of the sealer gun moving based on robot operation. A synchronization controller assigns a unique ID and a received TCP time to the TCP speed and generates a discharge instruction message recording the sealer discharge amount according to the TCP speed. A sealer controller adjusts a discharge of the sealer gun based on the discharge instruction message and feeds back the sealer time according to a discharge completion to the synchronization controller.

Abstract: A robot synchronization sealer discharge system is provided. The robot synchronization sealer discharge system is interlocked with a robot for a sealer work of a vehicle factory and includes: a sealer gun mounted on a robot and moving along an application path of a vehicle body to discharge a sealer and a communication unit for receiving a TCP speed of the sealer gun moving based on robot operation. A synchronization controller assigns a unique ID and a received TCP time to the TCP speed and generates a discharge instruction message recording the sealer discharge amount according to the TCP speed. A sealer controller adjusts a discharge of the sealer gun based on the discharge instruction message and feeds back the sealer time according to a discharge completion to the synchronization controller.

Abstract: Disclosed are an auxiliary mat for a vehicle and an apparatus for processing the mat. The mat may include a fabric to form an exterior appearance, a bubble paper to which the fabric is threaded and coupled, a coating layer coated on the lower surface of the bubble layer, a backing layer coupled to a lower surface of the coating layer, an adhesive layer interposed between the coating layer and the backing layer, and serving as an adhesive for bonding the lower surface of the coating layer and an upper surface of the backing layer, and a plurality of protrusions coated on a lower surface of the backing layer, and formed in a shape protruding from the lower surface of the backing layer. The protrusions may be coated on the lower surface of the backing layer in a substantially uniform dot pattern.

Abstract: An optical semiconductor illuminating apparatus includes a heat dissipating base having a first side, a second side opposed to the first side, and at least one edge therebetween, a light emitting module connected to the first side of the heat dissipating base and heat dissipating fins protruding from the second side of the heat dissipating base. The heat dissipating fins extend beyond at least one edge of the heat dissipating base.

Abstract: Embodiments of the invention provide an optical semiconductor illuminating apparatus, which includes a heat dissipating base; a light emitting module comprising at least one semiconductor light emitting device and mounted on a lower side of the heat dissipating base; and a plurality of heat dissipating fins each having opposite edges protruding from opposite sides of the heat dissipating base and being mounted on an upper surface of the heat dissipating base.

Abstract: Disclosed are an auxiliary mat for a vehicle and an apparatus for processing the mat. The mat may include a fabric to form an exterior appearance, a bubble paper to which the fabric is threaded and coupled, a coating layer coated on the lower surface of the bubble layer, a backing layer coupled to a lower surface of the coating layer, an adhesive layer interposed between the coating layer and the backing layer, and serving as an adhesive for bonding the lower surface of the coating layer and an upper surface of the backing layer, and a plurality of protrusions coated on a lower surface of the backing layer, and formed in a shape protruding from the lower surface of the backing layer. The protrusions may be coated on the lower surface of the backing layer in a substantially uniform dot pattern.

Abstract: An optical semiconductor illuminating apparatus capable of being simply installed and built, easily detecting a fault generation point, being simply repaired and replaced, and being compactly implemented. A bracket assembly having a power supply embedded therein is mounted at an upper side of a heat sink including a fixed unit, the power supply is seated on the heat sink including the fixed unit, a plurality of heat radiation fins protrude from an inner surface of the heat sink, and an upper surface of the power supply is disposed at a position higher than or equal to that of an edge of an upper end portion of the heat sink.

Abstract: An optical semiconductor illuminating apparatus capable of being simply installed and built, easily detecting a fault generation point, being simply repaired and replaced, and being compactly implemented. A bracket assembly having a power supply embedded therein is mounted at an upper side of a heat sink including a fixed unit, the power supply is seated on the heat sink including the fixed unit, a plurality of heat radiation fins protrude from an inner surface of the heat sink, and an upper surface of the power supply is disposed at a position higher than or equal to that of an edge of an upper end portion of the heat sink.

Abstract: A light emitting diode (LED) illuminating apparatus including a heat sink, a light emitting module, a power connection portion, a translucent cover and a wiring path. The heat sink has a plurality of heat dissipation fins. The light emitting module is positioned on an upper portion of the heat sink. The power connection portion is positioned below a lower portion of the heat sink. The translucent cover is mounted to cover an upper portion of the light emitting module. The wiring path is formed in the heat sink so as to accommodate a wire for electrically connecting the power connection portion and the light emitting module. In the LED illuminating apparatus, the light emitting module emits light by directly receiving AC power supplied through the wire accommodated in the wiring path.

Abstract: A light emitting diode (LED) illuminating apparatus including a heat sink, a light emitting module, a power connection portion, a translucent cover and a wiring path. The heat sink has a plurality of heat dissipation fins. The light emitting module is positioned on an upper portion of the heat sink. The power connection portion is positioned below a lower portion of the heat sink. The translucent cover is mounted to cover an upper portion of the light emitting module. The wiring path is formed in the heat sink so as to accommodate a wire for electrically connecting the power connection portion and the light emitting module. In the LED illuminating apparatus, the light emitting module emits light by directly receiving AC power supplied through the wire accommodated in the wiring path.

Abstract: Embodiments of the invention provide an optical semiconductor illuminating apparatus, which includes a heat dissipating base; a light emitting module comprising at least one semiconductor light emitting device and mounted on a lower side of the heat dissipating base; and a plurality of heat dissipating fins each having opposite edges protruding from opposite sides of the heat dissipating base and being mounted on an upper surface of the heat dissipating base.

Abstract: A light emitting diode (LED) illuminating apparatus including a heat sink, a light emitting module, a power connection portion, a translucent cover and a wiring path. The heat sink has a plurality of heat dissipation fins. The light emitting module is positioned on an upper portion of the heat sink. The power connection portion is positioned below a lower portion of the heat sink. The translucent cover is mounted to cover an upper portion of the light emitting module. The wiring path is formed in the heat sink so as to accommodate a wire for electrically connecting the power connection portion and the light emitting module. In the LED illuminating apparatus, the light emitting module emits light by directly receiving AC power supplied through the wire accommodated in the wiring path.

Abstract: An optical semiconductor illuminating apparatus capable of being simply installed and built, easily detecting a fault generation point, being simply repaired and replaced, and being compactly implemented. A bracket assembly having a power supply embedded therein is mounted at an upper side of a heat sink including a fixed unit, the power supply is seated on the heat sink including the fixed unit, a plurality of heat radiation fins protrude from an inner surface of the heat sink, and an upper surface of the power supply is disposed at a position higher than or equal to that of an edge of an upper end portion of the heat sink.

Abstract: An optical semiconductor lighting apparatus having at least one or more clamping units are formed along a longitudinal direction of a race way. A first sealing unit finishes both ends of a housing attached to or detached from the clamping unit. A second sealing unit surrounds upper and lower portions of both edges of an optical member disposed on the bottom surface of the housing. A wireless communication unit receives a dimming signal through a wireless communication network, and outputs the received dimming signal to a power supply unit. The power supply unit supplies a DC voltage to the light emitting module to control the illuminance of the light emitting module according to the dimming signal input from the wireless communication unit.

Abstract: A barrier net mounting structure may include a roof bracket provided on a head lining, and a hook provided on a lateral portion of a barrier net and inserted into the roof bracket, wherein the hook includes a rod having one end provided on the lateral portion of the barrier net, and the other end inserted into the roof bracket, and a locking portion and a stopper portion which may be provided on the other end of the rod in a spaced state therebetween, wherein one end of the locking portion may be locked to an inner surface of the roof bracket, and one end of the stopper portion may be supported by an outer surface of the roof bracket.

Abstract: A barrier net mounting structure may include a roof bracket provided on a head lining, and a hook provided on a lateral portion of a barrier net and inserted into the roof bracket, wherein the hook includes a rod having one end provided on the lateral portion of the barrier net, and the other end inserted into the roof bracket, and a locking portion and a stopper portion which may be provided on the other end of the rod in a spaced state therebetween, wherein one end of the locking portion may be locked to an inner surface of the roof bracket, and one end of the stopper portion may be supported by an outer surface of the roof bracket.

Abstract: A tray apparatus may include a housing, a tray slidably accommodated in the housing to be opened or closed, a rotary lock pivotally coupled to the housing at a hinge portion of the rotary lock and locking the tray to the housing when external shock is applied to the tray beyond a predetermined value, wherein a center of gravity of the rotary lock is positioned above the hinge portion, and a holding unit for holding the rotary lock in a normal state so that the rotary lock maintains an original position thereof.

Abstract: A tray apparatus may include a housing, a tray slidably accommodated in the housing to be opened or closed, a rotary lock pivotally coupled to the housing at a hinge portion of the rotary lock and locking the tray to the housing when external shock is applied to the tray beyond a predetermined value, wherein a center of gravity of the rotary lock is positioned above the hinge portion, and a holding unit for holding the rotary lock in a normal state so that the rotary lock maintains an original position thereof.