Patents by Inventor Tae Hun Lim

Tae Hun Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8722204
    Abstract: Provided is an aluminum coated steel sheet having excellent oxidation and heat resistance. The aluminum coated steel sheet includes an aluminum coating layer and an alloy layer. The aluminum coating layer is formed on a surface of a steel sheet which includes 0.001 to 0.015 wt % of carbon (C), 0.05 to 0.3 wt % of silicon (Si), 0.1 to 0.6 wt % of manganese (Mn), 0.01 to 0.05 wt % niobium (Nb), 0.01 wt % or less of phosphorus (P), 0.01 wt % or less of sulfur (S), 0.1 wt % or less of soluble aluminum (Al), 0.05 to 0.5 wt % of copper (Cu), 0.05 to 0.5 wt % nickel (Ni), 0.001 to 0.01 wt % of nitrogen (N), and the balance of Fe and inevitable impurities. The alloy layer includes an intermetallic compound at an interface between the steel sheet and the aluminum coating layer.
    Type: Grant
    Filed: December 9, 2011
    Date of Patent: May 13, 2014
    Assignee: Posco
    Inventors: Dae-Chul Bae, Tae-Hun Lim, Young-Sool Jin
  • Publication number: 20130280552
    Abstract: Provided is an aluminum coated steel sheet having excellent oxidation and heat resistance. The aluminum coated steel sheet includes an aluminum coating layer and an alloy layer. The aluminum coating layer is formed on a surface of a steel sheet which includes 0.001 to 0.015 wt % of carbon (C), 0.05 to 0.3 wt % of silicon (Si), 0.1 to 0.6 wt % of manganese (Mn), 0.01 to 0.05 wt % niobium (Nb), 0.01 wt % or less of phosphorus (P), 0.01 wt % or less of sulfur (S), 0.1 wt % or less of soluble aluminum (Al), 0.05 to 0.5 wt % of copper (Cu), 0.05 to 0.5 wt % nickel (Ni), 0.001 to 0.01 wt % of nitrogen (N), and the balance of Fe and inevitable impurities. The alloy layer includes an intermetallic compound at an interface between the steel sheet and the aluminum coating layer.
    Type: Application
    Filed: December 9, 2011
    Publication date: October 24, 2013
    Applicants: POSCO COATED & COLOR STEEL CO., LTD., POSCO
    Inventors: Dae-Chul Bae, Tae-Hun Lim, Young-Sool Jin
  • Publication number: 20120312043
    Abstract: A heat pump that uses solar heat as an evaporation heat source of a refrigerant. The heat pump includes a solar heat collector, a compressor to compress a refrigerant, a first heat exchanger to condense the refrigerant compressed by the compressor and to perform heat exchange between the condensed refrigerant and water, a second heat exchanger to perform heat exchange between the refrigerant having passed through the first heat exchanger and heat collected by the solar heat collector, a third heat exchanger to perform heat exchange between the refrigerant having passed through the first heat exchanger and external air, and a first flow channel switching valve to allow the refrigerant having passed through the first heat exchanger to selectively flow to the second heat exchanger or the third heat exchanger therethrough.
    Type: Application
    Filed: June 5, 2012
    Publication date: December 13, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Rock Hee KIM, Tae Hun LIM, Chang Soo LIM, Young Chal PARK
  • Patent number: D629126
    Type: Grant
    Filed: February 17, 2010
    Date of Patent: December 14, 2010
    Assignee: LG Electronics Inc.
    Inventors: Tae Hun Lim, Ki Wan Nahm
  • Patent number: D629127
    Type: Grant
    Filed: February 17, 2010
    Date of Patent: December 14, 2010
    Assignee: LG Electronics Inc.
    Inventors: Tae Hun Lim, Ki Wan Nahm
  • Patent number: D629128
    Type: Grant
    Filed: February 17, 2010
    Date of Patent: December 14, 2010
    Assignee: LG Electronics Inc.
    Inventors: Tae Hun Lim, Ki Wan Nahm