Abstract: A vehicle power module includes an upper substrate and a lower substrate spaced from each other in a vertical direction, a semiconductor chip connected to one of the upper substrate and the lower substrate, and a spacer formed of a metal material containing copper and connecting the semiconductor chip to the other of the upper substrate and the lower substrate or to connect the upper substrate to the lower substrate, the spacer including a plurality of penetration portions formed to penetrate an inside thereof.

Abstract: The present disclosure relates to a machine learning-based automatic routing method and apparatus for semiconductor equipment, and the machine learning-based automatic routing method for semiconductor equipment according to one embodiment of the present disclosure includes: a first operation of disposing semiconductor equipment and ancillary equipment; a second operation of recognizing connection points (points of connection, POC) which are three-dimensional (3D) coordinates of the semiconductor equipment and the ancillary equipment; and a third operation of generating an optimal path which connects the connection points (POC) using a machine learning algorithm.

Abstract: Provided is a real-time fitness coaching system using a smart health sensor. The real-time fitness coaching system includes smart fitness equipment including a reference position sensor disposed at a preset position, a smart wearable band which includes a motion position sensor and is attached to a part of an individual's body, and a server connected to the smart fitness equipment and the smart wearable band via a network, wherein the server receives reference position information of the reference position sensor from the smart fitness equipment, receives motion position information of the motion position sensor from the smart wearable band, generates fitness correction information on the basis of a relative value of the motion position information with respect to the reference position information, and provides the fitness correction information to a user terminal connected thereto via a network.

Abstract: A three dimensional (3D) virtual shape modeling method for an object produced through a semiconductor process is provided, which can model a 3D shape of an object produced through processes such as deposition, etching, and so on that are used in a semiconductor or planar display panel manufacturing process. Specifically, convenient modeling can be performed when forming a layer produced through deposition and then etching on a non-flat, preceding layer, by using two dimensional projection method.