Abstract: According to one embodiment, a chemical supply device includes: a bubbler configured to contain a chemical solution which is used in a semiconductor process and to receive an input gas for vaporizing the chemical solution into an output gas; a constant-temperature bath configured to contain the bubbler and to adjust a temperature of the chemical solution; a valve module fluidically connected with the bubbler and configured to provide channels for the chemical solution, the input gas, and the output gas; a level sensor configured to detect a remaining level of the chemical solution; a controller; and a memory configured to store a program for operating the controller, and the controller is configured to determine a target flow rate of the input gas to cause a flow rate of the output gas to have a designated flow rate, based on the remaining level of the chemical solution.

Abstract: There is provided a chemical supply device for use in a semiconductor manufacturing process, the chemical supply device including a bubbler, wherein the bubbler includes: a lower support surface including a lower concave portion; a side surface smoothly connected to the lower support surface through a corner curved portion; an upper surface extended from the side surface; an inlet extended from an outside of the upper surface to an inside of the bubbler, and configured to inject an output gas for causing a chemical solution contained in the bubbler to evaporate; and an outlet configured to transmit the chemical salutation evaporated in the bubbler, wherein a radius of curvature of the upper surface is greater than or equal to 45% and less than 58% of a diameter of the lower support surface.

Abstract: According to to various embodiments, there is provided a chemical supply device for use in a semiconductor manufacturing process, the chemical supply device including: a bubbler configured to contain a chemical solution to be used in a semiconductor manufacturing process and to evaporate the chemical solution; a constant temperature bath configured to accommodate the bubbler and to adjust a temperature of the chemical solution; and a heat transferring structure configured to enhance temperature adjustment efficiency of the chemical solution, wherein the heat transferring structure includes: a constant temperature cup configured to provide an accommodation space to have the bubbler seated therein; a heat transferring member disposed between a side surface area of the bubbler.

Abstract: The present disclosure relates to a machine learning-based automatic routing method and apparatus for semiconductor equipment, and the machine learning-based automatic routing method for semiconductor equipment according to one embodiment of the present disclosure includes: a first operation of disposing semiconductor equipment and ancillary equipment; a second operation of recognizing connection points (points of connection, POC) which are three-dimensional (3D) coordinates of the semiconductor equipment and the ancillary equipment; and a third operation of generating an optimal path which connects the connection points (POC) using a machine learning algorithm.

Abstract: Provided is a real-time fitness coaching system using a smart health sensor. The real-time fitness coaching system includes smart fitness equipment including a reference position sensor disposed at a preset position, a smart wearable band which includes a motion position sensor and is attached to a part of an individual's body, and a server connected to the smart fitness equipment and the smart wearable band via a network, wherein the server receives reference position information of the reference position sensor from the smart fitness equipment, receives motion position information of the motion position sensor from the smart wearable band, generates fitness correction information on the basis of a relative value of the motion position information with respect to the reference position information, and provides the fitness correction information to a user terminal connected thereto via a network.

Abstract: A three dimensional (3D) virtual shape modeling method for an object produced through a semiconductor process is provided, which can model a 3D shape of an object produced through processes such as deposition, etching, and so on that are used in a semiconductor or planar display panel manufacturing process. Specifically, convenient modeling can be performed when forming a layer produced through deposition and then etching on a non-flat, preceding layer, by using two dimensional projection method.