Patents by Inventor Tae Hwan LIM
Tae Hwan LIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12179560Abstract: A compressor control apparatus and method includes: a sensor configured to detect air conditioner operation state information necessary to control engagement and disengagement of a clutch of an air conditioner compressor; an electromagnetic coil in the clutch of the air conditioner compressor configured to perform clutch engagement upon receiving battery current; a microcomputer configured to determine whether the current air conditioner operation state satisfies a clutch engagement allowance condition or a clutch disengagement condition based on the air conditioner operation state information detected by the sensor and to output an operation signal based on the result of determination; and a switch configured to be turned on or off according to the operation signal output by the microcomputer and to control supply of the battery current to the electromagnetic coil such that clutch engagement or clutch disengagement is performed.Type: GrantFiled: November 9, 2021Date of Patent: December 31, 2024Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATIONInventors: Ji Wan Son, Chang Hwan Kim, Sang Hun Lee, Tae Woong Lim, Jin Sung Kim
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Patent number: 12138101Abstract: Provided is an X-ray image apparatus. The X-ray imaging apparatus include an imaging body and a control circuit. The image body acquires X-ray image data of an object and includes an X-ray generation device and an X-ray sensing device. The X-ray generating device and the X-ray sensing device are disposed to face each other with the object in between. The control circuit reconfigures an X-ray image of the object based on the X-ray image data, acquire size information of the object, rotate the X-ray generation device and the X-ray sensing device about a rotation axis between the X-ray generation device and the X-ray sensing device, and move the object along a direction of the rotation axis with respect to the X-ray generation device and the X-ray sensing device when acquiring the X-ray image data.Type: GrantFiled: August 31, 2021Date of Patent: November 12, 2024Assignees: VATECH Co., Ltd., VATECH EWOO Holdings Co., Ltd.Inventors: Tae Hee Han, Yong Joo Yang, Sung Hwan Lim
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Publication number: 20240344952Abstract: In a method for estimating nanoparticles in a solution, a laser-induced plasma is generated by making a pulsed laser beam incident on inside a cell containing a solution, feedback signals is acquired based on light, shock wave and sound generated by the laser-induced plasma, the feedback signals, an intensity of the laser incident on the cell, and intensities of each laser passing through the cell for each laser pulse are acquired, the feedback signals acquired for each laser pulse, the intensity of the laser, and the intensities of the lasers passing through the cell into a pre-trained nanoparticle estimation model is input to estimate sizes or types of unknown nanoparticles included in the solution.Type: ApplicationFiled: April 11, 2024Publication date: October 17, 2024Inventors: SUNG HO BAEK, GI HWAN AHN, MIN JU LEE, TAE YONG KIM, SOO YEONG LIM, SU YOUNG CHOI, MIN GI HWANG
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Patent number: 12106996Abstract: A semiconductor fabricating apparatus may include a collet structure configured to pick-up a semiconductor chip. The collet structure may include a holder, a plate, an absorption member and an edge contact. The holder may be configured to downwardly receive vacuum. The holder may include a magnet arranged in the holder. The plate may include an upper surface magnetically and mechanically combined with the holder. The plate may include a sidewall wholly exposed by the holder. The plate may receive the vacuum from the holder. The absorption member may make contact with the plate to pick-up the semiconductor chip using the vacuum received from the plate. The edge contact may include a protrusion having a first length protruded from an edge portion of a bottom surface of the holder to make contact with the plate.Type: GrantFiled: April 28, 2021Date of Patent: October 1, 2024Assignee: SK hynix Inc.Inventors: Jung Bum Woo, Soo Hyuk Kim, Byeong Ho Lee, Tae Hwan Lim
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Publication number: 20240308323Abstract: A battery pack comprises a plurality of battery modules. Each battery module of the plurality of battery modules includes: a stacked structure including a plurality of stacked battery cells; and a front cover and a rear cover respectively disposed on a front side and a rear side of the stacked structure, configured to cover the stacked structure, and including a cover surface facing the stacked structure, a first fastening portion laterally protruding from a first side of the stacked structure in a stacking direction of the plurality of stacked battery cells, and a second fastening portion laterally protruding from a second side of the stacked structure in the stacking direction.Type: ApplicationFiled: May 30, 2024Publication date: September 19, 2024Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATIONInventors: Ji Woong Jung, Yong Hwan Choi, Yu Ri Oh, Tae Hyuck Kim, Gyung Hoon Shin, Hae Kyu Lim
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Publication number: 20240291035Abstract: The present disclosure relates to an electrolyte for a lithium-sulfur battery comprising: a base electrolyte comprising a lithium salt and an organic solvent; and an electrolyte additive, wherein the electrolyte additive comprises an isocyanate functional group (—N?C?O).Type: ApplicationFiled: June 2, 2022Publication date: August 29, 2024Inventors: Dong-Won KIM, Da-Ae LIM, Jun-Hwan AHN, Tae-Sun YOU, Ji-Wan KIM
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Publication number: 20240287223Abstract: A ligand compound represented by the following Formula 1, which shows high catalyst activity and high selectivity to 1-hexene and 1-octene, and may perform ethylene oligomerization with excellent efficiency, an organochromium compound, a catalyst composition comprising the organochromium compound and a method for oligomerizing ethylene using the same, are described: wherein all the variables are described herein.Type: ApplicationFiled: March 3, 2023Publication date: August 29, 2024Applicant: LG Chem, Ltd.Inventors: Seok Pil Sa, Seok Sun Kim, Tae Hee Kim, Seung Hwan Jung, Eun Ji Shin, Yeon Ho Cho, Won Taeck Lim, Hee Jeong Kim
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Patent number: 12062484Abstract: A coil component includes a body having one surface, and one end surface and the other end surface connected to the one surface and opposing each other; a coil portion including lead-out patterns within the body; slit portions respectively disposed in an edge portion between the one end surface and the one surface of the body and an edge portion between the other end surface and the one surface of the body to expose the lead-out patterns; external electrodes disposed to be spaced apart from each other on the one surface and respectively extending to the slit portions to be connected to the lead-out patterns; and surface insulating layers, respectively disposed on the one end surface and the other end surface of the body. The surface insulating layers include a first insulating thin film including silicon dioxide (SiO2), and a second insulating thin film including aluminum oxide (Al2O3).Type: GrantFiled: November 24, 2020Date of Patent: August 13, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ju Hwan Yang, Seung Mo Lim, Tae Jun Choi, Byung Soo Kang, Boum Seock Kim
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Patent number: 11958874Abstract: According to the embodiment of the present disclosure, an organo tin compound is represented by the following Chemical Formula 1: In Chemical Formula 1, L1 and L2 are each independently selected from an alkoxy group having 1 to 10 carbon atoms and an alkylamino group having 1 to 10 carbon atoms, R1 is a substituted or unsubstituted aryl group having 6 to 8 carbon atoms, and R2 is selected from a substituted or unsubstituted linear alkyl group having 1 to 4 carbon atoms, a branched alkyl group having 3 to 4 carbon atoms, a cycloalkyl group having 3 to 6 carbon atoms, and an allyl group having 2 to 4 carbon atoms.Type: GrantFiled: April 11, 2022Date of Patent: April 16, 2024Assignees: EGTM Co., Ltd., SK hynix Inc.Inventors: Jang Keun Sim, Sung Jun Ji, Tae Young Lee, Shin Beom Kim, Sun Young Baik, Tae Hwan Lim, Dong Kyun Lee, Sang Hyun Lee, Su Pill Chun
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Publication number: 20230227972Abstract: A thin film deposition method and a method of fabricating an electronic device using the same are disclosed. The thin film deposition method may include preparing a substrate structure having a pattern portion including a hole, adsorbing a reaction inhibitor to inside and outside of the hole in the substrate structure, wherein an adsorption density of the reaction inhibitor may be lower in the inside than the outside, and depositing a metal layer on the inside and outside the hole by an atomic layer deposition (ALD) process, wherein a deposition rate of the depositing may vary depending on regions by the reaction inhibitor, and wherein the reaction inhibitor may include a metal atom and a ligand for reaction inhibition bonded to the metal atom, and the metal atom may remain on the substrate structure in the depositing the metal layer.Type: ApplicationFiled: January 17, 2023Publication date: July 20, 2023Inventors: Do Han LEE, Eun Soo KIM, Seung Wook RYU, Tae Hwan LIM, Han-Bo-Ram LEE, Abu Saad Aqueel Ahmed ANSARI, Ngoc le TRINH
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Publication number: 20220402946Abstract: According to the embodiment of the present disclosure, an organo tin compound is represented by the following Chemical Formula 1: In Chemical Formula 1, L1 and L2 are each independently selected from an alkoxy group having 1 to 10 carbon atoms and an alkylamino group having 1 to 10 carbon atoms, R1 is a substituted or unsubstituted aryl group having 6 to 8 carbon atoms, and R2 is selected from a substituted or unsubstituted linear alkyl group having 1 to 4 carbon atoms, a branched alkyl group having 3 to 4 carbon atoms, a cycloalkyl group having 3 to 6 carbon atoms, and an allyl group having 2 to 4 carbon atoms.Type: ApplicationFiled: April 11, 2022Publication date: December 22, 2022Inventors: Jang Keun SIM, Sung Jun Ji, Tae Young Lee, Shin Beom Kim, Sun Young Baik, Tae Hwan Lim, Dong Kyun Lee, Sang Hyun Lee, Su Pill Chun
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Publication number: 20220115256Abstract: A semiconductor fabricating apparatus may include a collet structure configured to pick-up a semiconductor chip. The collet structure may include a holder, a plate, an absorption member and an edge contact. The holder may be configured to downwardly receive vacuum. The holder may include a magnet arranged in the holder. The plate may include an upper surface magnetically and mechanically combined with the holder. The plate may include a sidewall wholly exposed by the holder. The plate may receive the vacuum from the holder. The absorption member may make contact with the plate to pick-up the semiconductor chip using the vacuum received from the plate. The edge contact may include a protrusion having a first length protruded from an edge portion of a bottom surface of the holder to make contact with the plate.Type: ApplicationFiled: April 28, 2021Publication date: April 14, 2022Inventors: Jung Bum WOO, Soo Hyuk KIM, Byeong Ho LEE, Tae Hwan LIM