Patents by Inventor Tae-Hyeon Lim

Tae-Hyeon Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7661358
    Abstract: The present invention relates to an apparatus and method for forming a predetermined pattern on a substrate using a gravure offset printing method. The apparatus for forming a pattern using a gravure offset printing method comprises a gravure on which a pattern to be filled with a color resist is formed; a roller brought into contact with the gravure to transfer the pattern formed on the gravure to the roller and then to print the transferred pattern onto a substrate; a roller driving means for rotating and horizontally driving the roller to transfer the pattern formed on the gravure to the roller and then to print the transferred pattern onto the substrate as it is; and a substrate support on which the substrate is placed.
    Type: Grant
    Filed: February 13, 2007
    Date of Patent: February 16, 2010
    Assignee: SFA Engineering Corp.
    Inventors: Sang-Kyong Kim, Sung-Won Choi, Jun-Young Son, Jong-Kyong Kim, Tae-Hyeon Lim, Byong-Sik Kang, Ho-Chol Chae
  • Publication number: 20070186791
    Abstract: The present invention relates to an apparatus and method for forming a predetermined pattern on a substrate using a gravure offset printing method. The apparatus for forming a pattern using a gravure offset printing method comprises a gravure on which a pattern to be filled with a color resist is formed; a roller brought into contact with the gravure to transfer the pattern formed on the gravure to the roller and then to print the transferred pattern onto a substrate; a roller driving means for rotating and horizontally driving the roller to transfer the pattern formed on the gravure to the roller and then to print the transferred pattern onto the substrate as it is; and a substrate support on which the substrate is placed.
    Type: Application
    Filed: February 13, 2007
    Publication date: August 16, 2007
    Inventors: Sang-Kyong KIM, Sung-Won Choi, Jun-Young Son, Jong-Kyong Kim, Tae-Hyeon Lim, Byong-Sik Kang, Ho-Chol Chae