Abstract: An autonomous driving safety system for sharing a risk-based operation design domain includes an autonomous driving system configured to control a vehicle driving unit according to information detected by a sensor unit to perform autonomous driving, in which the autonomous driving system includes an operation design domain update unit configured to evaluate a risk of at least one of a static operation design domain and a dynamic operation design domain recognized by the sensor unit while driving to update the operation design domain.

Abstract: Provided is a display device comprising at least one sensing pixel including a sensing pixel circuit, a sensing unit including sensing circuit, and a temperature output unit to calculate a temperature of the display panel based on the sensing data. The sensing data is generated from a sensing pixel including a driving transistor in which a current generated according to temperature varies, and a temperature is measured from the sensing data.

Abstract: An apparatus and method for manufacturing a grilled seaweed includes the apparatus comprising a grilling unit having a first housing with a first inlet opening and a first outlet opening which communicate with each other; a first conveyor for transferring a sheet of seaweed from the first inlet opening to the first outlet opening; a first heating source installed over the first conveyor to discharge a flame onto a top surface of the seaweed being transferred by the first conveyor; and a second heating source installed on both sides of a lower portion of the first conveyor to apply a flame onto a bottom surface of the seaweed being transferred by the first conveyor.

Abstract: The present disclosure discloses a substrate heat-treating apparatus including a process chamber in which a flat substrate to be heat treated is placed, the process chamber comprising a beam transmitting plate placed below the flat substrate and an infrared transmitting plate placed above the flat substrate; a beam irradiating module for irradiating a VCSEL beam having a single wavelength to a lower surface of the flat substrate through the beam transmitting plate; and an temperature measuring module configured to measure the laser beam reflected from the lower surface or an upper surface the flat substrate, thereby measuring the temperature of the flat substrate.

Abstract: A semiconductor device structure, including integrated circuits of semiconductor chips and scribe lanes between the regions in which the circuits have been formed, has at least one redistribution pad disposed in one of the scribe lanes for simultaneously testing a group of the integrated circuits, and a metal interconnection structure disposed beneath the redistribution pad(s). The metal interconnection structure includes at least conductive via contacting the redistribution pad at the bottom of the pad. The conductive via(s) is/are arranged so that at least a portion of each via remains attached to the redistribution pad when the structure is sawed along the scribe lane.

Abstract: A semiconductor device structure, including integrated circuits of semiconductor chips and scribe lanes between the regions in which the circuits have been formed, has at least one redistribution pad disposed in one of the scribe lanes for simultaneously testing a group of the integrated circuits, and a metal interconnection structure disposed beneath the redistribution pad(s). The metal interconnection structure includes at least conductive via contacting the redistribution pad at the bottom of the pad. The conductive via(s) is/are arranged so that at least a portion of each via remains attached to the redistribution pad when the structure is sawed along the scribe lane.