Abstract: The present invention discloses a wavelength self-filtering ultra-low noise near infrared quantum dot photodiode manufacturing method and a near infrared quantum dot photodiode manufactured thereby. According to the present invention, a near infrared (NIR) quantum dot photodiode includes: a transparent electrode through which visible light and near-infrared light pass; a p-type layer that is formed on the transparent electrode to shield the visible light; a quantum dot light absorption layer that is formed on the p-type layer to a preset thickness or more to generate excitons through the near-infrared light; an n-type layer that moves negative charges generated by the excitons; and an upper electrode that is formed on the n-type layer.

Abstract: Disclosed are an efficient indoor photovoltaic cell using two-dimensional transition metal carbides, MXene nanosheets and a manufacturing method thereof. According to the present invention, provided is an indoor photovoltaic cell including: a transparent lower electrode through which indoor light passes, an organic semiconductor layer in which a donor and a receptor generating an exciton by the indoor light and separating the exciton into a positive charge and a negative charge, and MXene having a predetermined concentration are mixed, and an upper electrode absorbing the negative charge.

Abstract: Disclosed are a method for manufacturing a high-performance indoor photovoltaic cell using self-assembled monolayers and an indoor photovoltaic cell manufactured thereby. According to the present invention, provided is an indoor photovoltaic cell including: a transparent lower electrode passing through indoor light; a self-assembled single-layer based ultra thin 2PACz layer formed on the lower electrode with a predetermined thickness; an organic semiconductor layer formed on the 2PACz layer by mixing materials for forming a donor layer and an acceptor layer, and 2PACz, generating an exciton by the indoor light, and separating the exciton into a positive charge and a negative charge; and an upper electrode absorbing the negative charge.

Abstract: An artificial indoor photovoltaic cell and a manufacturing method thereof are disclosed. The artificial indoor photovoltaic cell includes: a transparent electrode; an electron transport layer formed on the transparent electrode layer; a photoactive layer formed on the electron transport layer and including a donor layer and an acceptor layer that generate an exciton by indoor light and separate the exciton into positive and negative charges; and a charge transport layer formed on the photoactive layer and made of a material homogenous with the donor layer.

Abstract: A bonder viewer system may provide an automated procedure for determining a wire bonding sequence based on information provided by a drawing management system. The bonder viewer system may include a bonding sequence decision unit receiving pad and lead coordinate data corresponding to an IC chip, and determining a bonding sequence for bonding wires of the IC chip. The bonder viewer system may further include a turning point check unit and a bonding simulation unit which may provide modifications to the bonding sequence information, which may be based on whether a capillary of a wire bonder is in contact with a pre-bonded wire of the IC chip. The bonder viewer system may also include a standard file generator for generating data based on the bonding sequence information and a translator for preparing the data in a format suitable for a wire bonder.

Abstract: A molding apparatus for molding semiconductor devices using a molding compound in which a mold is automatically treated with a mold releasing agent is provided. A lead frame strip in-magazine part and a tablet loading part are designed so that dummy lead frame strips and releasing tablets used in a mold releasing agent treatment process are automatically supplied to the molding apparatus in a mold releasing agent treatment mode or a mold cleaning mode. After the mold releasing agent treatment mode or mold cleaning mode is complete, the molding apparatus is switched back to a normal molding process and normal lead frame strips and molding compound tablets are to the mold part. In addition, a pick-up part and a stack magazine part are designed to distinguish by-products generated during the mold releasing agent treatment process from normally molded products by switching from a normal molding process to either a mold releasing agent treatment process or a mold cleaning process.

Abstract: A bonder viewer system may provide an automated procedure for determining a wire bonding sequence based on information provided by a drawing management system. The bonder viewer system may include a bonding sequence decision unit receiving pad and lead coordinate data corresponding to an IC chip, and determining a bonding sequence for bonding wires of the IC chip. The bonder viewer system may further include a turning point check unit and a bonding simulation unit which may provide modifications to the bonding sequence information, which may be based on whether a capillary of a wire bonder is in contact with a pre-bonded wire of the IC chip. The bonder viewer system may also include a standard file generator for generating data based on the bonding sequence information and a translator for preparing the data in a format suitable for a wire bonder.

Abstract: Provided are a variety of snap cure apparatus configuration and corresponding methods for operating each such apparatus in order to snap cure an adhesive composition. Each of the configurations includes at least one vertical stack of heater blocks whereby the horizontal area required for conducting the snap cure processing may be reduced. Depending on the configuration utilized, two or more transfer devices may be required to remove the substrate(s) from a conveyor, index the substrate(s) through the heater blocks to apply the predetermined thermal cycle and return the cured substrate to the conveyor. Similarly, depending on the particular adhesive utilized, the number, relative temperatures, and duration of the substrate(s) on each of the heater blocks may be adjusted to provide the desired degree of curing.

Abstract: A molding apparatus for molding semiconductor devices using a molding compound in which a mold is automatically treated with a mold releasing agent is provided. A lead frame strip in-magazine part and a tablet loading part are designed so that dummy lead frame strips and releasing tablets used in a mold releasing agent treatment process are automatically supplied to the molding apparatus in a mold releasing agent treatment mode or a mold cleaning mode. After the mold releasing agent treatment mode or mold cleaning mode is complete, the molding apparatus is switched back to a normal molding process and normal lead frame strips and molding compound tablets are to the mold part. In addition, a pick-up part and a stack magazine part are designed to distinguish by-products generated during the mold releasing agent treatment process from normally molded products by switching from a normal molding process to either a mold releasing agent treatment process or a mold cleaning process.

Abstract: An improved method of attaching a semiconductor chip onto a die pad of a lead frame using an epoxy adhesive by dispensing the epoxy adhesive onto the die pad, decreasing a viscosity of the epoxy adhesive dispensed onto the die pad by blowing a hot gas over at least part of the epoxy adhesive thereby preventing a formation of an epoxy tail, and placing the chip into the adhesive to attach the chip to the die pad. The hot gas used may be air or nitrogen, having a temperature from 50.degree. C. to 70.degree. C. The hot gas is blown from a blower between the die pad and the dispenser, and may be blown onto the epoxy adhesive from more than one direction.