Abstract: In one example, an electronic device includes a substrate having a substrate top side, a substrate bottom side opposite to the substrate top side, and a substrate conductive structure. The substrate conductive structure includes a grounded path and a powered path. An electronic component is coupled to the substrate top side. An encapsulant covers the electronic component and the substrate top side. The encapsulant includes apertures and the powered path is exposed by the apertures. A first network structure includes a first network cover over the encapsulant. and first network interconnects coupled to the first network cover and the powered path through the apertures. A second network structure includes a second network cover having a second cover ceiling and second cover sidewalls extending from the second cover ceiling; and a second network contact coupled to the second network cover and the grounded path.

Abstract: A display module includes a plurality of light-emitting elements and a sealing element sealing the plurality of light-emitting elements. The sealing element includes a base part including a transparent material and a cover layer. The cover layer is in contact with a surface of the base part and includes a plurality of first patterns, each of which is engraved in an intaglio manner to a first depth, and a plurality of second patterns, each of which is engraved in an intaglio manner to a second depth different from the first depth.

Abstract: The present invention relates to a vehicle air conditioner, and more particularly, to a vehicle air conditioner having a photocatalyst module, which provides an optimal design location or a mounting structure in which the photocatalyst module is mounted on an upper surface of a duct, the upper surface of the duct has a predetermined inclination with respect to a floor surface, and the photocatalyst module is mounted on a left/right independent air conditioner.

Abstract: A semiconductor device with EMI shield and a fabricating method thereof are provided. In one embodiment, the semiconductor device includes EMI shield on all six surfaces of the semiconductor device without the use of a discrete EMI lid.

Abstract: An electronic device including: a display layer; and a sensor layer that includes: first electrodes in a sensing area and having different lengths; second electrodes in the sensing area; first cross electrodes in the sensing area; second cross electrodes in the sensing area and having different lengths; pads in a peripheral area; first lines extended from the first electrodes at a first side of the sensing area towards the pads; second lines extended from the second electrodes at a second side of the sensing area towards the pads; first cross lines extending from the first cross electrodes towards the pads; and second cross lines extending from the second cross electrodes towards the pads, the first lines being different from the second lines in number, and the first cross lines being different from the second cross lines in number.

Abstract: A display module includes a plurality of light-emitting elements and a sealing element sealing the plurality of light-emitting elements. The sealing element includes a base part including a transparent material and a cover layer. The cover layer is in contact with a surface of the base part and includes a plurality of first patterns, each of which is engraved in an intaglio manner to a first depth, and a plurality of second patterns, each of which is engraved in an intaglio manner to a second depth different from the first depth.

Abstract: Provided is a negative electrode active material for a lithium secondary battery according to the present invention, including a carbon-based particle including pores in an inner portion and/or a surface thereof; and a silicon-based coating layer positioned on a pore surface and/or a pore-free surface of the carbon-based particle and containing silicon carbon compound.

Abstract: An electronic device includes a substrate comprising outward terminals. An electronic component is connected to the outward terminals. External interconnects are connected to the outward terminals and include a first external interconnect connected to a first outward terminal. A lower shield is adjacent to the substrate bottom side and is laterally between the external interconnects. The lower shield is electrically isolated from the first external interconnect by one or more of 1) a dielectric buffer interposed between the lower shield and the first external interconnect; or 2) the lower shield including a first part and a second part, the first part being laterally separated from the second part by a first gap, wherein the first part laterally surrounds lateral sides of the first external interconnect; and the second part is vertically interposed between the first outward terminal and the first external interconnect.

Abstract: The present invention relates to a method capable of recognizing disease-related factors included in document data and extracting relations between the disease-related factors.

Abstract: An input sensor includes: a first sensing electrode including first sensing patterns and a first pattern disposed between the first sensing patterns; a second sensing electrode disposed on the same layer as the first sensing patterns; and a floating pattern including a plurality of segments each overlapping the first pattern and insulated from the second sensing electrode, wherein at least one of the plurality of segments is surrounded by a portion overlapping the first pattern among the second sensing electrode.

Abstract: An electronic device including: a display layer; and a sensor layer that includes: first electrodes in a sensing area and having different lengths; second electrodes in the sensing area; first cross electrodes in the sensing area; second cross electrodes in the sensing area and having different lengths; pads in a peripheral area; first lines extended from the first electrodes at a first side of the sensing area towards the pads; second lines extended from the second electrodes at a second side of the sensing area towards the pads; first cross lines extending from the first cross electrodes towards the pads; and second cross lines extending from the second cross electrodes towards the pads, the first lines being different from the second lines in number, and the first cross lines being different from the second cross lines in number.

Abstract: A broadcast receiving apparatus according to an embodiment of the disclosure includes: a broadcast contents processing unit which is configured to request, when receiving a channel switching signal, broadcast contents of a switched channel and to display the transmitted broadcast contents of the switched channel on a first plane; a zapping advertisements processing unit which is configured to request a moving image zapping advertisement corresponding to the switched channel from a zapping advertisements server and to displays the received moving image zapping advertisement on a first plane; and a screen control unit which is configured to display the broadcast contents of the switched channel on the first plane after the moving image zapping advertisement is finished.

Abstract: Disclosed herein is an in-mold electronics (IME) structure. The IME structure includes a film, a first plastic resin positioned under the film, and a second plastic resin positioned under the first plastic resin. An electronic circuit is formed on a top or bottom surface of the second plastic resin by a plating method and also electronic elements are mounted thereon. The electronic elements include LED light sources, a plurality of protruding light guides configured to guide lighting through distribution and direction is formed on the top surface of the second plastic resin, and the LED light sources are installed in respective spaces provided by the light guides.

Abstract: A printed board, a screen-printing ink, and a screen-printing method are provided. The printed board comprises a printed pattern and/or printed line which comprises a polymer binder and a fluorine-based surfactant, has excellent thickness uniformity and straightness, has no edge top defect, and is not damaged even when formed on a repeatedly folded substrate.

Abstract: There is provided, a semiconductor manufacturing apparatus which reduces loss of a process gas or a precursor transferred from a nozzle to a wafer by improving the injection efficiency of the process gas or the precursor from the nozzle to the substrate. The semiconductor manufacturing apparatus includes a boat on which a substrate is loaded in a first direction, an inner tube which covers the boat, a nozzle which extends in the first direction and through which a process gas to be provided to the substrate moves, a nozzle tube which surrounds the nozzle and comprises a gas injection hole for injecting the process gas toward the substrate, and a nozzle protrusion which is connected to the gas injection hole and extends in a second direction, wherein a shortest distance from an end of the nozzle protrusion to the substrate is greater than 0 mm and less than 9 mm.

Abstract: A semiconductor device can comprise a substrate dielectric structure and a substrate conductive structure that traverses the substrate dielectric structure and comprises first and second substrate terminals; an electronic component with a component terminal coupled to the first substrate terminal; and a first antenna element with a first element terminal coupled to the second substrate terminal, a first element head side adjacent a first antenna pattern, a first element base side opposite the first element side, and a first element sidewall. The first element terminal can be exposed from the first element dielectric structure at the first element base side or at the first element sidewall. The first antenna pattern can be coupled to the substrate through the first element terminal. The substrate conductive structure can couple the first antenna element to the electronic component. Other examples and methods are also disclosed.

Abstract: Disclosed herein is a full-screen display device capable of sufficiently securing light transmittance of a sensor area overlapping a sensor unit in a pixel array and minimizing deterioration in perceived image quality of the sensor area. The pixels are arranged in the sensor area overlapping the sensor unit in the pixel array of the full-screen display device such that the number of pixels gradually decreases from the outer periphery toward the center of the sensor area in units of masks, and the area of a transmission portion gradually increases from the outer periphery toward the center of the sensor area in units of masks.

Abstract: In one example, an electronic device includes a substrate comprising a substrate top side, a substrate bottom side, and outward terminals. An electronic component is connected to the outward terminals. External interconnects are connected to the outward terminals and include a first external interconnect connected to a first outward terminal. A lower shield is adjacent to the substrate bottom side and is laterally between the external interconnects. The lower shield is electrically isolated from the first external interconnect by one or more of 1) a dielectric buffer interposed between the lower shield and the first external interconnect; or 2) the lower shield including a first part and a second part, the first part being laterally separated from the second part by a first gap, wherein the first part laterally surrounds lateral sides of the first external interconnect; and the second part is vertically interposed between the first outward terminal and the first external interconnect.

Abstract: In one example, a semiconductor device can comprise (a) an electronic device comprising a device top side, a device bottom side opposite the device top side, and a device sidewall between the device top side and the device bottom side, (b) a first conductor comprising, a first conductor side section on the device sidewall, a first conductor top section on the device top side and coupled to the first conductor side section, and a first conductor bottom section coupled to the first conductor side section, and (c) a protective material covering the first conductor and the electronic device. A lower surface of the first conductor top section can be higher than the device top side, and an upper surface of the first conductor bottom section can be lower than the device top side. Other examples and related methods are also disclosed herein.

Abstract: A sliding type glove box is proposed. The sliding type glove box includes a housing mounted to a dashboard, a plurality of rails provided inside the housing, and a storage part configured to be ejected in a sliding manner while being moved along the rails, wherein the rails include: outer rails mounted to the housing; and inner rails configured to be movable along the outer rails and connected to a lower portion of the storage part, wherein each of the outer rails has a stopper removably provided thereon to limit a moving distance of the storage part.