Abstract: A printed circuit board (PCB) assembly includes a PCB, electronic components mounted on the PCB, a shield can provided to block electromagnetic waves of the electronic components, and an insulating layer provided to prevent an electrical short between the electronic components and the shield can, and the insulating layer is sprayed and formed on the shield can. The insulating layer which is sprayed and formed on the shield can does not have an adhesive layer, and thus the thickness thereof can be remarkably reduced compared to insulating materials requiring an adhesive layer.

Abstract: An image sensor includes a comparator configured to compare a pixel signal with a ramp signal and generate a comparison signal and a counter configured to be reset by a counter reset value based on an offset of the comparator and to generate a digital pixel signal according to the comparison signal.

Abstract: A magnetic jack type in-vessel control element drive mechanism includes: an upper coil assembly which includes a first sleeve configured to coaxially wrap a control element drive shaft, a first coil, and a first coil housing which is externally coupled to the first sleeve; a lower coil assembly which includes a second sleeve configured to coaxially wrap the control element drive shaft, a second coil, and a second coil housing which is externally coupled to the second sleeve, wherein the lower coil assembly is located under the upper coil assembly, a connecting member which connects the upper coil assembly and the lower coil assembly; a support tube which extends downward from the lower coil assembly; a motor assembly which is located between the control element drive shaft, and the first and second sleeves; and an anti-separation cap which prevents separation of the motor assembly.

Abstract: A semiconductor device includes a substrate, a plurality of insulating layers vertically stacked on the substrate, a plurality of channels arranged in vertical openings formed through at least some of the plurality of insulating layers, and a plurality of portions alternatingly positioned with the plurality of insulating layers in the vertical direction. At least some of the portions are adjacent corresponding channels of the plurality of channels. Each of the portions includes a conductive barrier pattern formed on an inner wall of the portion, a filling layer pattern positioned in the portion on the conductive barrier pattern, and a gate electrode positioned in a remaining area of the portion not occupied by the conductive barrier or filling layer pattern.

Abstract: In one embodiment, an image sensor includes a pixel array including a plurality of pixels, an analog-to-digital converter configured to convert analog pixel signals output from the pixels into digital signals, a first cluster configured to store a first group of digital signals among the digital signals and to output first image data, a second cluster configured to store a second group of digital signals among the digital signals and to output second image data, and at least one cluster switch connected to the first cluster and the second cluster, a first channel, and a second channel. The image sensor is configured to transmit at least one among the first image data and the second image data to at least one among the first channel and the second channel based on an operation mode.

Abstract: Provided is an apparatus for efficiently removing a pollutant source in a snout of a steel plating line such as a steel galvanizing line. The pollutant removing apparatus includes at least one pollutant collecting member connecting to a snout between a heating furnace and a plating tank, and a contact-free inducer varying magnetic field within the snout to forcibly guide, without contact, a pollutant source of a steel plate or a processing unit to the pollutant collecting member.

Abstract: A mobile communication terminal with a radiant-heat function is provided. The mobile communication terminal includes: a display module; a rear cover; an inner support structure positioned between the display module and the rear cover and including a first surface facing the display module and a second surface facing an opposite side to the display module; a first radiant-heat sheet positioned between the first surface of the support structure and the display module; a printed circuit board positioned between the first radiant-heat sheet and the first surface of the support structure; and a second radiant-heat sheet positioned between the second surface of the support structure and the rear cover.

Abstract: A fastening structure for a shield can is capable of ensuring easy attachment/detachment of the shield can and prevents deformation caused by excessive impact when the shield can is attached and detached by improving the fastening structure for a shield can fixed to a printed circuit board. The fastening structure for a shield can provided to shield a printed circuit board on which electronic components are mounted and the electronic components from electromagnetic waves includes a frame provided with a fixing part allowing the frame to be fixed to the printed circuit board, a shield cover provided to surround an outer side of the frame, fastening parts provided at the shield cover and the frame, respectively, such that the shield cover and the frame are attached/detached to/from each other. The fastening parts and the fixing part are disposed without overlapping each other.

Abstract: An antenna switching system according to an exemplary embodiment of the present invention includes a plurality of directional antenna which is mounted in a ship to receive a wireless signal; an antenna switch which selects one of the plurality of directional antennas; a modem which is connected to the directional antennas through the antenna switch to extract a strength of a received signal; and a switching determining unit which outputs an antenna selection signal to the antenna switch based on the strength of the received signal and GPS/DR information of a transmission side ship and its own ship.

Abstract: In a method of a vertical memory device, insulation layers and sacrificial layers are alternately and repeatedly formed on a substrate. A hole is formed through the insulation layers and the sacrificial layers that expose a top surface of the substrate. Then, an interior portion of the hole may be enlarged. A semiconductor pattern is formed to partially fill the enlarged portion of the hole. A blocking layer, a charge storage layer and a tunnel insulation layer may be formed on a sidewall of the hole and the semiconductor pattern. Then, the tunnel insulation layer, the charge storage layer and the blocking layer are partially removed to expose a top surface of the semiconductor pattern. A channel is formed on the exposed top surface of the semiconductor pattern and the tunnel insulation layer. The sacrificial layers are replaced with gate electrodes.

Abstract: The present invention relates to a method and device for generating an engineering topology of a digital substation. The method may include: generating, by a single line diagram generation module, a single line diagram of the digital substation based on input information regarding a plurality of substation component devices and connection relations therebetween; converting, by a topology conversion module, the single line diagram of the digital substation into an engineering topology conforming to international standards by use of conversion conditions stored in a topology component management module; verifying, by a topology verification module, whether the engineering topology is suitable for the digital substation based on the international standards; and generating, by an international standard file generation module, a single line diagram engineering file of the digital substation as a system specification description (SSS) by use of the verified engineering topology.

Abstract: Methods of manufacturing a three-dimensional semiconductor device are provided. The method includes: forming a thin film structure, where first and second material layers of at least 2n (n is an integer more than 2) are alternately and repeatedly stacked, on a substrate; wherein the first material layer applies a stress in a range of about 0.1×109 dyne/cm2 to about 10×109 dyne/cm2 to the substrate and the second material layer applies a stress in a range of about ?0.1×109 dyne/cm2 to about ?10×109 dyne/cm2 to the substrate.

Abstract: A semiconductor device includes a substrate, a plurality of insulating layers vertically stacked on the substrate, a plurality of channels arranged in vertical openings formed through at least some of the plurality of insulating layers, and a plurality of portions alternatingly positioned with the plurality of insulating layers in the vertical direction. At least some of the portions are adjacent corresponding channels of the plurality of channels. Each of the portions includes a conductive barrier pattern formed on an inner wall of the portion, a filling layer pattern positioned in the portion on the conductive barrier pattern, and a gate electrode positioned in a remaining area of the portion not occupied by the conductive barrier or filling layer pattern.

Abstract: Provided is a cruise control system and method. A vehicle cruise control system collects state information of components inside and outside a vehicle, state information of a road on which the vehicle is provided, and drive pattern information of a driver of the vehicle, analyzes a mileage amount and an exhaust gas emission amount of the vehicle based on the collected state information of the components, the road state information, and the drive pattern information, calculates a cruise control speed based on the analysis result, and controls the vehicle to run at the cruise control speed.

Abstract: Disclosed herein are a method and apparatus for generating multiband Radio Frequency (RF) signals in maritime wireless communication. The apparatus includes a baseband conversion unit, a phase compensation unit, a Direct Current (DC) offset compensation unit, and an RF transmission unit. The baseband conversion unit converts RF signals corresponding to a baseband modulation signal having a negative frequency and a baseband modulation signal having a positive frequency into baseband signals, respectively. The phase compensation unit eliminates the images of multiband signals so as to correspond to the baseband signals. The DC offset compensation unit compensates the baseband modulation signals for DC offsets using the multiband signals from which the images have been eliminated. The RF transmission unit generates the RF signals using the signals which have been compensated for the DC offsets, and sends the RF signals via an antenna.

Abstract: A pixel array includes pixels arranged in a grid, with separate readout paths configured to readout image data from different subsets of the pixels in the array. An image sensor may employ image data from one subset of pixels, which may include fewer pixels than another subset of pixels in the array, to quickly form an image.

Abstract: A semiconductor device includes a substrate, a plurality of insulating layers vertically stacked on the substrate, a plurality of channels arranged in vertical openings formed through at least some of the plurality of insulating layers, and a plurality of portions alternatingly positioned with the plurality of insulating layers in the vertical direction. At least some of the portions are adjacent corresponding channels of the plurality of channels. Each of the portions includes a conductive barrier pattern formed on an inner wall of the portion, a filling layer pattern positioned in the portion on the conductive barrier pattern, and a gate electrode positioned in a remaining area of the portion not occupied by the conductive barrier or filling layer pattern.

Abstract: Provided are an electromagnetic wiping device for controlling the amount of coating of a steel sheet, a steel sheet wiping device including the same, and a method for manufacturing the steel sheet. The present invention can prevent overcoating at least at the edge of the steel sheet by removing a coating layer of at least an edge part of the steel sheet passing through a plating bath by using electromagnetism and forming the gas wiping, and can reduce gas wiping capabilities while maintaining the line speed of the steel sheet so as to reduce the amount of scattered material or dross due to the scattered material, thereby ultimately improving the coating quality and the productivity of the steel sheet.

Abstract: An image sensor includes a pixel array, a column signal processor, and a column mismatch compensator. The pixel array outputs a pixel signal from each column line during a pixel measuring time, and outputs a reference signal during a reference measuring time. The column signal processor performs correlated double sampling (CDS) on the reference signal to generate a reference CDS signal, and performs CDS on the pixel signal to generate a pixel CDS signal. The column mismatch compensator compensates the pixel CDS signal based on the reference CDS signal.

Abstract: A temperature sensor includes a band gap reference (BGR) circuit, a voltage generation unit and a digital CDS circuit. The band gap reference (BGR) circuit generates a reference voltage proportional to a temperature. The voltage generation unit generates a first voltage and a second voltage based on the reference voltage, where the first voltage and the second voltage are proportional to the temperature. The digital CDS circuit generates a digital signal corresponding to the temperature by performing a digital correlated double sampling (CDS) operation on the first voltage and the second voltage. The temperature sensor is able to detect a temperature accurately.