Patents by Inventor Tae Jim KANG

Tae Jim KANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device packages and methods of manufacturing the same
    Patent number: 8816480
    Abstract: The electronic device package includes a package substrate including a frame portion and a cantilever portion surrounded by the frame portion, at least one semiconductor chip mounted on the cantilever portion, and a molding member disposed on the package substrate to cover the at least one semiconductor chip. The cantilever portion has a first edge connected to the frame portion and declines from the first edge toward a second edge located opposite to the first edge. Related methods are also provided.
    Type: Grant
    Filed: December 18, 2012
    Date of Patent: August 26, 2014
    Assignee: SK Hynix Inc.
    Inventor: Tae Jim Kang
  • ELECTRONIC DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
    Publication number: 20140015072
    Abstract: The electronic device package includes a package substrate including a frame portion and a cantilever portion surrounded by the frame portion, at least one semiconductor chip mounted on the cantilever portion, and a molding member disposed on the package substrate to cover the at least one semiconductor chip. The cantilever portion has a first edge connected to the frame portion and declines from the first edge toward a second edge located opposite to the first edge. Related methods are also provided.
    Type: Application
    Filed: December 18, 2012
    Publication date: January 16, 2014
    Applicant: SK HYNIX INC.
    Inventor: Tae Jim KANG