Patents by Inventor Tae Jin Park
Tae Jin Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240423691Abstract: Provided is a surgical instrument for electrocautery including an end tool including one or more jaws and configured to be rotatable in two or more directions, a connection part extending in a first direction (an X-axis) and having one end to which the end tool is coupled, a wire having one end connected to the end tool, a shrink tube into which the other end of the wire, opposite to the one end of the wire connected to the end tool, is inserted, and a shaft tube, into which the other end of the shrink tube, opposite to one end of the shrink tube into which the wire is inserted, is inserted, wherein the wire and the shaft tube are separated by the shrink tube, and the wire and the shaft tube are insulated from each other.Type: ApplicationFiled: June 21, 2024Publication date: December 26, 2024Inventors: Dong Hoon KANG, Tae Hyun LIM, Mi Ryoung CHOI, Jae Yeong LEE, Tae Jin PARK, Dong San LEE
-
Publication number: 20240418360Abstract: A waste heat recovery system and method are disclosed. The waste heat recovery system disclosed herein comprises: a waste heat recovery boiler; a waste heat supply member configured to supply waste heat to the waste heat recovery boiler; and a water tank configured to fluidly communicate with the waste heat supply member.Type: ApplicationFiled: November 9, 2022Publication date: December 19, 2024Applicant: Samsung E&A Co., Ltd.Inventors: Chae Gwan PARK, Joeng Min OH, Tae Jin PARK, Jun Ho SEO, Yong Jung KIM
-
Publication number: 20240411509Abstract: An electronic device according to an embodiment of the present disclosure may comprise a speaker, a wireless communication interface configured to communicate with an external speaker and a controller configured to acquire a first output information of the speaker and a second output information of the external speaker, and based on the first output information and the second output information, output a first audio signal to the speaker and transmit a second audio signal to the external speaker through the wireless communication interface.Type: ApplicationFiled: November 28, 2023Publication date: December 12, 2024Applicant: LG ELECTRONICS INC.Inventors: Tae Young KIM, Tae Jin PARK, Hyung Woo PARK, Sang Hun KIM, Eun Jung LEE, Hyo Jeong JEONG
-
Publication number: 20240365532Abstract: Semiconductor memory devices including capacitors and methods for manufacturing thereof. The semiconductor memory device may include a substrate, an element isolation pattern defining an active area in the substrate, a first conductive pattern on the substrate and the element isolation pattern, and extending in a first direction, wherein the first conductive pattern is connected to a first portion of the active area, a capacitor structure on the substrate and the element isolation pattern and connected to a second portion of the active area, a gate trench defined in the substrate and the element isolation pattern and extending in a second direction, wherein a first trench width of a portion of the gate trench in the active area is greater than a second trench width of a portion of the gate trench in the element isolation pattern.Type: ApplicationFiled: November 13, 2023Publication date: October 31, 2024Inventors: Tae Jin Park, Jun Soo Kim, Ji Ho Park, Ki Seok Lee, Myeong-Dong Lee, Ho Sang Lee
-
Publication number: 20240357795Abstract: There is provided a semiconductor memory device comprising: a substrate; a base insulating film on an upper surface of the substrate; a plurality of first conductive patterns on the base insulating film and spaced apart from each other, wherein the plurality of first conductive patterns extend in a first direction; a spacer structure on a side surface of each of the plurality of first conductive patterns; a barrier metal film on a side surface of the spacer structure, wherein the barrier metal film extends through the base insulating film to be electrically connected to the substrate; a filling metal film on the barrier metal film, wherein the filling metal film fills at least a portion of a space between adjacent ones of the plurality of first conductive patterns; and a capacitor structure on the filling metal film, wherein the capacitor structure is electrically connected to the filling metal film.Type: ApplicationFiled: November 17, 2023Publication date: October 24, 2024Inventors: Tae Jin PARK, Hui-Jung KIM, Sang Jae PARK, Ki Seok LEE, Myeong-Dong LEE
-
Publication number: 20240357802Abstract: A semiconductor memory device comprising: a substrate including active patterns; a gate structure intersecting the active patterns; bit-line structures on the substrate; first contacts, wherein the bit-line structures and the first contacts are alternately arranged with each other; insulating patterns respectively disposed on the bit-line structures, wherein an insulating pattern among the insulating patterns is disposed in a first trench exposing a sidewall of a first contact among the first contacts and at least a portion of the gate structure; and second contacts disposed on the first contacts, wherein a second contact among the second contacts is disposed in a second trench exposing a sidewall of the insulating pattern and an upper surface of the first contact, wherein the insulating pattern overlaps an upper surface of a bit-line structure among the bit-line structures and extends along sidewalls of the first and second trenches and contacts the first and second contacts.Type: ApplicationFiled: November 30, 2023Publication date: October 24, 2024Inventors: Tae Jin PARK, Hui Jung KIM
-
Publication number: 20240334020Abstract: An electronic device comprises a speaker; a wireless communication interface configured to communicate with an external device, wirelessly; and a controller configured to transmit a sound source to the speaker, transmit the sound source to the external device through the wireless communication interface, obtain a first audio corresponding to the sound source output through the speaker and a second audio corresponding to the sound source output through the external device, and control an EQ (Equalizer) mode of the external device based on a comparison result between the first audio and the second audio, or output a calibrated sound source to the speaker.Type: ApplicationFiled: June 20, 2023Publication date: October 3, 2024Applicant: LG ELECTRONICS INC.Inventors: Sang Hun KIM, Hyo Jeong JEONG, Tae Young KIM, Tae Jin PARK, Hyung Woo PARK
-
Publication number: 20240119949Abstract: An encoding/decoding apparatus and method for controlling a channel signal is disclosed, wherein the encoding apparatus may include an encoder to encode an object signal, a channel signal, and rendering information for the channel signal, and a bit stream generator to generate, as a bit stream, the encoded object signal, the encoded channel signal, and the encoded rendering information for the channel signal.Type: ApplicationFiled: November 30, 2023Publication date: April 11, 2024Applicant: Electronics and Telecommunications Research InstituteInventors: Jeong Il SEO, Seung Kwon BEACK, Dae Young JANG, Kyeong Ok KANG, Tae Jin PARK, Yong Ju LEE, Keun Woo CHOI, Jin Woong KIM
-
Patent number: 11875802Abstract: An encoding/decoding apparatus and method for controlling a channel signal is disclosed, wherein the encoding apparatus may include an encoder to encode an object signal, a channel signal, and rendering information for the channel signal, and a bit stream generator to generate, as a bit stream, the encoded object signal, the encoded channel signal, and the encoded rendering information for the channel signal.Type: GrantFiled: March 28, 2022Date of Patent: January 16, 2024Assignee: Electronics and Telecommunications Research InstituteInventors: Jeong Il Seo, Seung Kwon Beack, Dae Young Jang, Kyeong Ok Kang, Tae Jin Park, Yong Ju Lee, Keun Woo Choi, Jin Woong Kim
-
Patent number: 11825600Abstract: Provided are a printed circuit board, a display device and a method of manufacturing a display device. The printed circuit board includes a base film including a first surface and a second surface, lead lines disposed on the first surface of the base film, and a first cover layer that covers at least a part of the lead lines and includes fill-in portions disposed between the lead lines. Each of the fill-in portions has a surface height less than a surface height of each of the lead lines with respect to the first surface of the base film.Type: GrantFiled: August 24, 2021Date of Patent: November 21, 2023Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Tae Jin Park, Gyung Hyun Ko, Hee Ju Ma, Woo Jin Lee, Yeon Je Cho
-
Patent number: 11705503Abstract: A semiconductor device includes a substrate, a gate electrode on the substrate, a gate spacer on a sidewall of the gate electrode, an active pattern penetrating the gate electrode and the gate spacer, and an epitaxial pattern contacting the active pattern and the gate spacer. The gate electrode extends in a first direction. The gate spacer includes a semiconductor material layer. The active pattern extends in a second direction crossing the first direction.Type: GrantFiled: September 30, 2020Date of Patent: July 18, 2023Inventors: Jin Bum Kim, MunHyeon Kim, Hyoung Sub Kim, Tae Jin Park, Kwan Heum Lee, Chang Woo Noh, Maria Toledano Lu Que, Hong Bae Park, Si Hyung Lee, Sung Man Whang
-
Patent number: 11682402Abstract: Disclosed is a binaural rendering method and apparatus for decoding a multichannel audio signal. The binaural rendering method may include: extracting an early reflection component and a late reverberation component from a binaural filter; generating a stereo audio signal by performing binaural rendering of a multichannel audio signal base on the early reflection component; and applying the late reverberation component to the generated stereo audio signal.Type: GrantFiled: March 15, 2021Date of Patent: June 20, 2023Assignee: Electronics and Telecommunications Research InstituteInventors: Yong Ju Lee, Jeong Il Seo, Jae Hyoun Yoo, Seung Kwon Beack, Jong Mo Sung, Tae Jin Lee, Kyeong Ok Kang, Jin Woong Kim, Tae Jin Park, Dae Young Jang, Keun Woo Choi
-
Publication number: 20230043936Abstract: A semiconductor device and a method for fabricating the same is provided. The semiconductor device includes a lower semiconductor film, a buried insulating film, and an upper semiconductor film which are sequentially stacked; an element isolation film defining an active region inside the substrate and including a material having an etching selectivity with respect to silicon oxide; a first gate trench inside the upper semiconductor film; a first gate electrode filing a part of the first gate trench; a second gate trench inside the element isolation film; and a second gate electrode filling a part of the second gate trench, a bottom side of the element isolation film being inside the lower semiconductor film.Type: ApplicationFiled: May 3, 2022Publication date: February 9, 2023Applicant: Samsung Electronics Co., Ltd.Inventors: Tae Jin PARK, Gyul GO, Jun Soo KIM, Gyung Hyun YOON, Eui Jun CHA, Hui-Jung KIM, Yoo Sang HWANG
-
Patent number: 11497472Abstract: Provided are an ultrasound imaging apparatus and a method of processing an ultrasound image. The ultrasound imaging apparatus includes a display configured to display a moving image consisting of a plurality of ultrasound images that are played back according to a time order together with at least one icon, corresponding to at least one piece of change information for changing a display of at least one of the plurality of ultrasound images, in association with the time order.Type: GrantFiled: July 10, 2019Date of Patent: November 15, 2022Assignee: SAMSUNG MEDISON CO., LTD.Inventors: Tae-jin Park, Dae-woong Kang, Yea-chan Choi
-
Patent number: 11495215Abstract: Techniques for speech processing using a deep neural network (DNN) based acoustic model front-end are described. A new modeling approach directly models multi-channel audio data received from a microphone array using a first model (e.g., multi-geometry/multi-channel DNN) that includes a frequency aligned network (FAN) architecture. Thus, the first model may perform spatial filtering to generate a first feature vector by processing individual frequency bins separately, such that multiple frequency bins are not combined. The first feature vector may be used similarly to beamformed features generated by an acoustic beamformer. A second model (e.g., feature extraction DNN) processes the first feature vector and transforms it to a second feature vector having a lower dimensional representation. A third model (e.g., classification DNN) processes the second feature vector to perform acoustic unit classification and generate text data. The DNN front-end enables improved performance despite a reduction in microphones.Type: GrantFiled: December 11, 2019Date of Patent: November 8, 2022Assignee: Amazon Technologies, Inc.Inventors: Minhua Wu, Shiva Sundaram, Tae Jin Park, Kenichi Kumatani
-
Patent number: 11468919Abstract: A semiconductor device is provided. The semiconductor device includes a substrate a bit line structure disposed on the substrate, a trench adjacent to at least one side of the bit line structure, a storage contact structure disposed within the trench, and comprising a storage contact, a silicide layer, and a storage pad which are stacked sequentially. A spacer structure is disposed between the bit line structure and the storage contact structure.Type: GrantFiled: April 7, 2020Date of Patent: October 11, 2022Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Tae Jin Park, Won Seok Yoo, Keun Nam Kim, Hyo-Sub Kim, So Hyun Park, In Kyoung Heo, Yoo Sang Hwang
-
Publication number: 20220223159Abstract: An encoding/decoding apparatus and method for controlling a channel signal is disclosed, wherein the encoding apparatus may include an encoder to encode an object signal, a channel signal, and rendering information for the channel signal, and a bit stream generator to generate, as a bit stream, the encoded object signal, the encoded channel signal, and the encoded rendering information for the channel signal.Type: ApplicationFiled: March 28, 2022Publication date: July 14, 2022Applicant: Electronics and Telecommunications Research InstituteInventors: Jeong Il SEO, Seung Kwon BEACK, Dae Young JANG, Kyeong Ok KANG, Tae Jin PARK, Yong Ju LEE, Keun Woo CHOI, Jin Woong KIM
-
Patent number: 11289105Abstract: An encoding/decoding apparatus and method for controlling a channel signal is disclosed, wherein the encoding apparatus may include an encoder to encode an object signal, a channel signal, and rendering information for the channel signal, and a bit stream generator to generate, as a bit stream, the encoded object signal, the encoded channel signal, and the encoded rendering information for the channel signal.Type: GrantFiled: June 20, 2019Date of Patent: March 29, 2022Assignee: Electronics and Telecommunications Research InstituteInventors: Jeong Il Seo, Seung Kwon Beack, Dae Young Jang, Kyeong Ok Kang, Tae Jin Park, Yong Ju Lee, Keun Woo Choi, Jin Woong Kim
-
Publication number: 20220087015Abstract: Provided are a printed circuit board, a display device and a method of manufacturing a display device. The printed circuit board includes a base film including a first surface and a second surface, lead lines disposed on the first surface of the base film, and a first cover layer that covers at least a part of the lead lines and includes fill-in portions disposed between the lead lines. Each of the fill-in portions has a surface height less than a surface height of each of the lead lines with respect to the first surface of the base film.Type: ApplicationFiled: August 24, 2021Publication date: March 17, 2022Applicant: Samsung Display Co., LTD.Inventors: Tae Jin PARK, Gyung Hyun KO, Hee Ju MA, Woo Jin LEE, Yeon Je CHO
-
Patent number: 11251307Abstract: A device includes a substrate, a first electrode on the substrate, an insulating pattern on the substrate, a second electrode on an upper end of the insulating pattern, a two-dimensional (2D) material layer on a side surface of the insulating pattern, a gate insulating layer covering the 2D material layer, and a gate electrode contacting the gate insulting layer. The insulating pattern extends from the first electrode in a direction substantially vertical to the substrate. The 2D material layer includes at least one atomic layer of a 2D material that is substantially parallel to the side surface of the insulating pattern.Type: GrantFiled: September 4, 2018Date of Patent: February 15, 2022Assignee: Samsung Electronics Co., Ltd.Inventors: Tae-jin Park, Jin-bum Kim, Bong-soo Kim, Kyu-pil Lee, Hyeong-sun Hong, Yoo-sang Hwang