Abstract: The present disclosure relates to a coating solution composition for a 3D model, that includes a rubber material and an organic solvent, a preparation method thereof, and a preparation method of a 3D model using the same. When a 3D model is coated using the coating solution composition for a 3D model of the present disclosure, the coated 3D model will have a similar elasticity and strength as those of an organ, thus enabling surgical simulation, and therefore, it can be used in surgeries that require surgical simulation due to the small size of pediatric hearts and the like and variety and complexity of related diseases, thereby inducing successful surgeries, and thus it can be widely used in the medical industry.

Abstract: Provided is a method of forming reference information for defining a fault pattern of equipment, and monitoring equipment. One example embodiment method may include performing an angle spectrum analysis by re-classifying fault points distributed on a plane, the plane including a first component axis and a second component axis, and the re-classifying fault points including calculating an angle for each of the fault points with reference to any one of the first component axis and the second component axis of the plane, and forming a reference fault pattern for defining a fault pattern of the re-classified fault points.

Abstract: Provided is a method of forming reference information for defining a fault pattern of equipment, and monitoring equipment. One example embodiment method may include performing an angle spectrum analysis by re-classifying fault points distributed on a plane, the plane including a first component axis and a second component axis, and the re-classifying fault points including calculating an angle for each of the fault points with reference to any one of the first component axis and the second component axis of the plane, and forming a reference fault pattern for defining a fault pattern of the re-classified fault points.

Abstract: Example embodiments of the present invention relate to a multivariate modeling method, a method of fabricating semiconductors using a semiconductor fabricating facility and a multivariate model creating apparatus. Other example embodiments of the present invention relate to a method and apparatus for modeling multivariate parameters having constants and the same pattern and a semiconductor fabricating method of detecting whether a semiconductor fabricating facility is operating normally using the multivariate modeling method. In a multivariate modeling method according to example embodiments of the present invention, data of parameters are selected during a modeling period. Averages and standard deviations of the data of the parameters may be calculated. It may be determined whether the data of the parameters contain non-random data. If the data of the parameters do not contain non-random data, the data may be normalized using the averages and standard deviations of the data of the parameters.

Abstract: An apparatus for controlling a semiconductor manufacturing process includes, a filter which receives from semiconductor processing devices first process parameters for processing a wafer and measured data obtained by measuring the wafer, and removes noise from the first process parameters and the measured data, a model generating unit which receives the first process parameters and the measured data from the filter and generates process models for predicting results of processing the wafer, a model selecting unit which selects a process model suitable for processing the wafer from a plurality of the process models stored in the model generating unit according to a received request, a process predicting unit which receives second process parameters for processing the wafer from the semiconductor processing devices, requests and receives the process model to and from the model selecting unit, and predicts a result of processing the wafer using the received process model, and a process controlling unit which rec

Abstract: An apparatus for polish-grinding a semiconductor wafer which assuredly removes contaminant dusts from the polished wafer includes a grinding device for polishing a surface of the wafer. The grinding device has a chuck table on which the wafer is laid, a grinding wheel for grindingly polishing the wafer, and means for supplying water to the wafer. The means for supplying water provides water to region of contact between the grinding wheel and the wafer. The apparatus also includes a cleaning device for cleaning any remaining dust on the wafer, having a spin chuck table for rotating the polished wafer, means for supplying a detergent to the polished wafer. The means for supplying the detergent injects the detergent on the surfaces of the polished wafer. The apparatus also includes a controller for controlling the grinding device and the cleaning device.