Patents by Inventor Tae-Joon Chung

Tae-Joon Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250096389
    Abstract: Provided is a battery pack and a vehicle including the same. The battery pack includes a plurality of pouch-type battery cells, a pack case having an inner space in which the plurality of pouch-type battery cells are accommodated, and a cell cover at least partially surrounding and supporting at least some of the plurality of pouch-type battery cells. The cell cover includes a first cover portion covering one side surface of at least one of the plurality of battery cells, a second cover portion covering the other side surface of at least one of the plurality of battery cells, and a third cover portion connecting the first cover portion to the second cover portion and covering an upper end portion of the at least one battery cell. A first venting hole through which gas or flame is discharged is formed in at least one portion of the third cover portion.
    Type: Application
    Filed: July 14, 2023
    Publication date: March 20, 2025
    Applicant: LG Energy Solution, Ltd.
    Inventors: Woo-Yong Kwon, Seung-Joon Kim, In-Soo Kim, Jin-Yong Park, Se-Yun Chung, Myung-Woo Lee, Song-Ju Shin, Ho-June Chi, Jong-Mo Kang, Kyung-Woo Kim, Duck-Hee Moon, Hyun-Mo Yoon, Tae-Kyeong Lee, Jong-Ha Jeong, Ji-Soo Hwang
  • Publication number: 20250087826
    Abstract: A battery pack includes a plurality of pouch-type battery cells; a pack case accommodating the pouch-type battery cells in the internal space; and a cell cover. The cell cover includes two unit covers at least partially spaced apart, provided to at least partially surround at least some of the pouch-type battery cells among the plurality of pouch-type battery cells in the internal space of the pack case. The cell cover is configured to allow venting gas to be discharged into the separation space between the two unit covers, thereby ensuring excellent safety when a thermal event occurs. Moreover, the present application discloses a battery module and a vehicle including the same.
    Type: Application
    Filed: July 13, 2023
    Publication date: March 13, 2025
    Applicant: LG Energy Solution, Ltd.
    Inventors: Jin-Yong Park, Woo-Yong Kwon, Seung-Joon Kim, In-Soo Kim, Song-Ju Shin, Myung-Woo Lee, Jong-Mo Kang, Kyung-Woo Kim, Duck-Hee Moon, Tae-Kyeong Lee, Se-Yun Chung, Jong-Ha Jeong, Ho-June Chi, Ji-Soo Hwang
  • Publication number: 20250070365
    Abstract: A cell assembly according to the present disclosure includes a cell stack including one pouch-type battery cell or two or more pouch-type battery cells stacked; and a cell cover covering two side portions of the cell stack along a widthwise direction of the cell stack and a top portion of the cell stack, wherein the cell cover is configured to adjust a width of the cell cover according to a width of the cell stack.
    Type: Application
    Filed: August 7, 2023
    Publication date: February 27, 2025
    Applicant: LG Energy Solution, Ltd.
    Inventors: Jin-Yong Park, Woo-Yong Kwon, Seung-Joon Kim, In-Soo Kim, Song-Ju Shin, Myung-Woo Lee, Jong-Mo Kang, Kyung-Woo Kim, Duck-Hee Moon, Tae-Kyeong Lee, Se-Yun Chung, Jong-Ha Jeong, Ho-June Chi, Ji-Soo Hwang
  • Patent number: 9286552
    Abstract: An image forming apparatus includes a communication interface unit which receives print data, an image forming unit which prints the received print data, a volatile memory which, if the received print data is data that needs to be stored, stores the received print data, and a controller which, if a power-off command regarding the image forming apparatus is input, backs up print data stored in the volatile memory in a storage medium connectable to the image forming apparatus and converts an operation mode of the image forming apparatus to a power-off mode.
    Type: Grant
    Filed: April 19, 2013
    Date of Patent: March 15, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Tae-joon Chung, Yeon-jung Lim
  • Patent number: 8994988
    Abstract: Disclosed are an image forming apparatus, a host apparatus, and a print method thereof. A method includes receiving a one touch print command from a print button provided in the image forming apparatus to print an image of at least one monitor among a plurality of monitors of a host apparatus connected to the image forming apparatus. With this configuration, high quality output products may be provided without any image distortion due to a difference in resolution upon receiving a one touch print command in the multi monitor environment.
    Type: Grant
    Filed: June 2, 2011
    Date of Patent: March 31, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sun-ki Min, Do-hyung Kim, Tae-joon Chung
  • Patent number: 8854655
    Abstract: Provided are a method of generating an additional information-added document and an image forming apparatus performing the method, the method including inputting a property of the additional information to at least one document box in the image forming apparatus, storing a first document, which is an object document, to one of the at least one document box, generating a second document by adding additional information corresponding to a property that is set in the document box in which the first document is stored, to the first document, and storing the second document.
    Type: Grant
    Filed: April 8, 2010
    Date of Patent: October 7, 2014
    Assignee: SAMSUNG Electronics Co., Ltd.
    Inventor: Tae-joon Chung
  • Patent number: 8835302
    Abstract: A method of fabricating a package substrate including preparing a substrate having at least one conductive pad, forming an insulating layer having an opening to expose the conductive pad on the substrate, forming a separation barrier layer on the conductive pad inside the opening to be higher than the upper surface of the insulating layer along the side walls thereof, forming a post terminal on the separation barrier layer, and forming a solder bump on the post terminal.
    Type: Grant
    Filed: April 19, 2013
    Date of Patent: September 16, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Dong Gyu Lee, Dae Young Lee, Tae Joon Chung, Seon Jae Mun, Jin Won Choi
  • Publication number: 20140138821
    Abstract: Disclosed herein is substrate for flip chip bonding, in which a base solder layer is formed between a pad and a metal post, thereby increasing impact resistance and mounting reliability. A method of fabricating the substrate for flip chip bonding is also provided.
    Type: Application
    Filed: January 27, 2014
    Publication date: May 22, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hueng Jae OH, Tae Joon CHUNG, Dong Gyu LEE, Seon Jae MUN, Jin Won CHOI
  • Publication number: 20140126012
    Abstract: An image forming apparatus includes a communication interface unit which receives print data, an image forming unit which prints the received print data, a volatile memory which, if the received print data is data that needs to be stored, stores the received print data, and a controller which, if a power-off command regarding the image forming apparatus is input, backs up print data stored in the volatile memory in a storage medium connectable to the image forming apparatus and converts an operation mode of the image forming apparatus to a power-off mode.
    Type: Application
    Filed: April 19, 2013
    Publication date: May 8, 2014
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Tae-joon CHUNG, Yeon-jung LIM
  • Patent number: 8671564
    Abstract: Disclosed is a substrate for flip chip bonding, in which a base solder layer is formed between a pad and a metal post, thereby increasing impact resistance and mounting reliability. A method of fabricating the substrate for flip chip bonding is also provided.
    Type: Grant
    Filed: September 4, 2009
    Date of Patent: March 18, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hueng Jae Oh, Tae Joon Chung, Dong Gyu Lee, Seon Jae Mun, Jin Won Choi
  • Publication number: 20130237049
    Abstract: A method of fabricating a package substrate including preparing a substrate having at least one conductive pad, forming an insulating layer having an opening to expose the conductive pad on the substrate, forming a separation barrier layer on the conductive pad inside the opening to be higher than the upper surface of the insulating layer along the side walls thereof, forming a post terminal on the separation barrier layer, and forming a solder bump on the post terminal.
    Type: Application
    Filed: April 19, 2013
    Publication date: September 12, 2013
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Gyu Lee, Dae Young Lee, Tae Joon Chung, Seon Jae Mun, Jin Won Choi
  • Patent number: 8486760
    Abstract: There is provided a method of manufacturing a substrate for flip chip, and a substrate for flip chip manufactured using the same. The method includes providing a base substrate including at least one conductive pad, forming a solder resist layer on the base substrate, the solder resist layer including a first opening exposing the conductive pad, forming a dry film on the solder resist layer, the dry film including a second opening connected with the first opening, forming a metal post in the first opening and a part of the second opening, filling the second opening above the metal post with solder paste, forming a solder cap by performing a reflow process on the filled solder paste, planarizing a surface of the solder cap, and removing the dry film. Accordingly, fine pitches and improve reliability can be achieved.
    Type: Grant
    Filed: September 29, 2010
    Date of Patent: July 16, 2013
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Joon Chung, Jin Won Choi, Dong Gyu Lee, Hueng Jae Oh, Seon Jae Mun
  • Patent number: 8456003
    Abstract: There is provided a package substrate capable of controlling the degree of warpage thereof by improving the composition and formation of a post terminal and a method of fabricating the same. The package substrate includes a substrate having at least one conductive pad; an insulating layer provided on the substrate and having an opening to expose the conductive pad; a separation barrier layer provided on the conductive pad inside the opening and formed to be higher than the upper surface of the insulating layer along the side walls thereof; a post terminal provided on the separation barrier layer; and a solder bump provided on the post terminal.
    Type: Grant
    Filed: November 9, 2010
    Date of Patent: June 4, 2013
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Dong Gyu Lee, Dae Young Lee, Tae Joon Chung, Seon Jae Mun, Jin Won Choi
  • Publication number: 20120092705
    Abstract: Disclosed are an image forming apparatus, a host apparatus, and a print method thereof. A method includes receiving a one touch print command from a print button provided in the image forming apparatus to print an image of at least one monitor among a plurality of monitors of a host apparatus connected to the image forming apparatus. With this configuration, high quality output products may be provided without any image distortion due to a difference in resolution upon receiving a one touch print command in the multi monitor environment.
    Type: Application
    Filed: June 2, 2011
    Publication date: April 19, 2012
    Applicant: Samsung Electronics Co., Ltd
    Inventors: Sun-ki MIN, Do-hyung Kim, Tae-joon Chung
  • Publication number: 20110186991
    Abstract: There is provided a package substrate capable of controlling the degree of warpage thereof by improving the composition and formation of a post terminal and a method of fabricating the same. The package substrate includes a substrate having at least one conductive pad; an insulating layer provided on the substrate and having an opening to expose the conductive pad; a separation barrier layer provided on the conductive pad inside the opening and formed to be higher than the upper surface of the insulating layer along the side walls thereof; a post terminal provided on the separation barrier layer; and a solder bump provided on the post terminal.
    Type: Application
    Filed: November 9, 2010
    Publication date: August 4, 2011
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Dong Gyu Lee, Dae Young Lee, Tae Joon Chung, Seon Jae Mun, Jin Won Choi
  • Publication number: 20110133332
    Abstract: There is provided a package substrate allowing for enhanced reliability by improving the structure of a solder bump and a method of fabricating the same. The package substrate includes: a substrate having at least one conductive pad; an insulating layer provided on the substrate and having an opening to expose the conductive pad; a post terminal provided on the conductive pad inside the opening; and a solder bump provided on the post terminal and having an angle between a bottom surface and a side surface thereof ranging from 80° to 120°.
    Type: Application
    Filed: November 5, 2010
    Publication date: June 9, 2011
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seon Jae Mun, Dae Young Lee, Tae Joon Chung, Dong Gyu Lee, Jin Won Choi
  • Publication number: 20110079926
    Abstract: There is provided a method of manufacturing a substrate for flip chip, and a substrate for flip chip manufactured using the same. The method includes providing a base substrate including at least one conductive pad, forming a solder resist layer on the base substrate, the solder resist layer including a first opening exposing the conductive pad, forming a dry film on the solder resist layer, the dry film including a second opening connected with the first opening, forming a metal post in the first opening and a part of the second opening, filling the second opening above the metal post with solder paste, forming a solder cap by performing a reflow process on the filled solder paste, planarizing a surface of the solder cap, and removing the dry film. Accordingly, fine pitches and improve reliability can be achieved.
    Type: Application
    Filed: September 29, 2010
    Publication date: April 7, 2011
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Joon Chung, Jin Won Choi, Dong Gyu Lee, Hueng Jae Oh, Seon Jae Mun
  • Publication number: 20110007350
    Abstract: Provided are a method of generating an additional information-added document and an image forming apparatus performing the method, the method including inputting a property of the additional information to at least one document box in the image forming apparatus, storing a first document, which is an object document, to one of the at least one document box, generating a second document by adding additional information corresponding to a property that is set in the document box in which the first document is stored, to the first document, and storing the second document.
    Type: Application
    Filed: April 8, 2010
    Publication date: January 13, 2011
    Applicant: Samsung Electronics Co., Ltd
    Inventor: Tae-joon CHUNG
  • Publication number: 20100314161
    Abstract: Disclosed is a substrate for flip chip bonding, in which a base solder layer is formed between a pad and a metal post, thereby increasing impact resistance and mounting reliability. A method of fabricating the substrate for flip chip bonding is also provided.
    Type: Application
    Filed: September 4, 2009
    Publication date: December 16, 2010
    Inventors: Hueng Jae OH, Tae Joon Chung, Dong Gyu Lee, Seon Jae Mun, Jin Won Choi
  • Publication number: 20100270067
    Abstract: A printed circuit board and a method of manufacturing the printed circuit board are disclosed. In accordance with an embodiment of the present invention, the method includes providing a substrate having a pad formed thereon, forming a resist on the substrate, in which the resist has an opening formed therein such that the pad is exposed, forming a metal post inside the opening such that the metal post is electrically connected to the pad, forming a through-hole in the resist by removing a portion of the resist such that the through-hole surrounds the metal post, and forming a solder layer inside the through-hole and on an upper surface of the metal post so as to cover an exposed surface of the metal post.
    Type: Application
    Filed: November 3, 2009
    Publication date: October 28, 2010
    Inventors: Jin-Won CHOI, Tae-Joon Chung, Dong-Gyu Lee, Seok-Hwan Ahn, Seung-Wan Kim