Abstract: There is provided a camera module. The camera module includes a housing accommodating a lens barrel in which a lens is arranged, a close range lens provided in the housing and covering the lens at the time of shooting at close range, and a driving unit driving the close range lens to cover the lens.

Abstract: There is provided a camera module package including: a housing having an optical system; a board bonded to a bottom end of the housing and mounting an image sensor on a top surface thereof; a contact part integrally formed in the housing to electrically connect a sensor bonding pad of the image sensor with a board bonding pad of the board each other when the housing is engaged with the board. In the camera module package, a process of bonding the housing and the board together is performed at the same time as a process of electrically connecting the image sensor and the board to each other. This simplifies an assembly process and enhances productivity. Also, the camera module package is fundamentally free from contamination of external contact terminals caused by an overflowing bonding material when the board and the housing are bonded together.

Abstract: There is provided a camera module. The camera module includes a housing accommodating a lens barrel in which a lens is arranged, a close range lens provided in the housing and covering the lens at the time of shooting at close range, and a driving unit driving the close range lens to cover the lens.

Abstract: There is provided a camera module. The camera module comprises a lens module including at least one lens; a body coupled to the lens module to allow the lens module to move along an optical axis; a magnet unit applying a predetermined magnetic field to drive the body; and coil film chips each having a predetermined coil integrated in the form of chips and disposed closely adjacent to the magnet unit to generate a driving force by means of a magnetic field provided from the magnet unit, thus to allow the body to move.

Abstract: There is provided a camera module package including: a housing having an optical system; a board bonded to a bottom end of the housing and mounting an image sensor on a top surface thereof; a contact part integrally formed in the housing to electrically connect a sensor bonding pad of the image sensor with a board bonding pad of the board each other when the housing is engaged with the board. In the camera module package, a process of bonding the housing and the board together is performed at the same time as a process of electrically connecting the image sensor and the board to each other. This simplifies an assembly process and enhances productivity. Also, the camera module package is fundamentally free from contamination of external contact terminals caused by an overflowing bonding material when the board and the housing are bonded together.

Abstract: A camera module comprises a lens array including at least one lens, a lens accommodating unit having an inner space, in which the lens array is arranged, and an incident hole, and a housing mounted on a circuit board. The housing has a counter-engagement part engaged with an engagement part formed at the lens accommodating unit such that the lens accommodating unit is moved in the direction of the optical axis. An image sensor has an image area on which light is focused. The image sensor is electrically connected to the circuit board. A filter is disposed between the lens array and the image sensor. The filter includes a transparent medium through which light introduced along the optical axis is transmitted to the image area, and a prevention film for preventing electromagnetic waves generated by the image sensor from being emitted out of the housing.

Abstract: The present invention relates generally to a camera lens system for image pickup devices, which is mounted in a mobile phone or personal digital assistant, and more particularly to a camera lens system for image pickup devices, which has a minimized overall length thereof to implement a micro lens, and in which lenses are formed to have suitable aspheric coefficients to reduce an incident angle of light on the lenses and improve the resolving power of the camera lens system. The camera lens system includes a first group lens having a convex, aspheric surface facing an object, a second group lens on which a light beam is incident from the first group lens and which is formed in an aspheric shape, an iris disposed at a side of the first group lens close to the object, a filter disposed at a side of the second group lens close to an image of the object, and an image sensor for converting the image formed through the first and second group lenses into an electrical signal.

Abstract: The present invention relates generally to a camera lens system for image pickup devices, which is mounted in a mobile phone or personal digital assistant, and more particularly to a camera lens system for image pickup devices, which has a minimized overall length thereof to implement a micro lens, and in which lenses are formed to have suitable aspheric coefficients to reduce an incident angle of light on the lenses and improve the resolving power of the camera lens system. The camera lens system includes a first group lens having a convex, aspheric surface facing an object, a second group lens on which a light beam is incident from the first group lens and which is formed in an aspheric shape, an iris disposed at a side of the first group lens close to the object, a filter disposed at a side of the second group lens close to an image of the object, and an image sensor for converting the image formed through the first and second group lenses into an electrical signal.

Abstract: Disclosed is an image sensor module applied to a thin image sensor device. A method of fabricating the image sensor module consists of the steps of forming a bump on a glass, attaching the glass to an image sensor at a wafer level, and firstly and secondly dicing the resulting structure. Therefore, the present invention is advantageous in that fabrication of an inferior image sensor module is reduced, thus improving a quality of the image sensor module, productivity of the image sensor module is improved because the image sensor module is fabricated at the wafer level, and a gold wiper process is omitted, thus reducing fabrication costs of the image sensor module.

Abstract: Disclosed herein is an embedded type camera module. The embedded type camera module includes a transparent plate, an image sensor chip, a digital signal processing chip, and one or more peripheral chips. A circuit pattern is formed on one surface of the transparent plate which is connected with a connector. The image sensor chip is electrically connected to the circuit pattern and constructed to receive image signals inputted from the outside. The digital signal processing chip converts signals received from the image sensor chip into digital signals. The peripheral chips are mounted a printed circuit board formed in a product to be disposed in conjunction with the image sensor chip and the digital signal processing chip. The transparent plate, the image sensor chip, the digital signal processing chip and the peripheral chips are packaged together.

Abstract: Disclosed is an image sensor module applied to a thin image sensor device. A method of fabricating the image sensor module consists of the steps of forming a bump on a glass, attaching the glass to an image sensor at a wafer level, and firstly and secondly dicing the resulting structure. Therefore, the present invention is advantageous in that fabrication of an inferior image sensor module is reduced, thus improving a quality of the image sensor module, productivity of the image sensor module is improved because the image sensor module is fabricated at the wafer level, and a gold wiper process is omitted, thus reducing fabrication costs of the image sensor module.