Patents by Inventor Tae-Keun Park

Tae-Keun Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250079659
    Abstract: The present disclosure relates to a cap plate assembly, a method of manufacturing a cap plate assembly, and a battery cell including the same. The cap plate assembly may include a cap plate formed to cover an upper side of a housing and having a first accommodation hole formed through at least a part of the cap plate so that the inside and outside of the housing communicate with each other, and a first electrode part coupled to the first through-hole from above and below the cap plate.
    Type: Application
    Filed: November 2, 2023
    Publication date: March 6, 2025
    Inventors: Jeong-keun LEE, Wooseok SHIM, Tae-keun PARK, Su-dong JANG, Jeho SHIN, Ju-hyun SUN
  • Patent number: 12238903
    Abstract: A water-cooled heat dissipation module assembly capable of cooling a power module of a vehicle driving inverter system using a battery or fuel cell. The water-cooled heat dissipation module assembly includes a housing unit provided in the form of a housing having an opening portion at least partially opened at one side thereof. The housing unit and at least a part of a rim region of the cooling unit are made of a plastic material, and the housing unit and the cooling unit are joined to each other by plastic welding using a laser.
    Type: Grant
    Filed: August 4, 2022
    Date of Patent: February 25, 2025
    Assignee: DONG YANG PISTON CO., LTD.
    Inventors: Kwan Ho Ryu, Jeong Keun Lee, Min Woo Lee, Ju Hyun Sun, Tae Keun Park, Kang Wook Park, Lee Cheol Ji, Hyeok Chul Yang, Tae Heon Kim, Keun Jae Lee
  • Publication number: 20240121924
    Abstract: A water-cooled heat dissipation module assembly capable of cooling a power module of a vehicle driving inverter system using a battery or fuel cell. The water-cooled heat dissipation module assembly includes a housing unit provided in the form of a housing having an opening portion at least partially opened at one side thereof. The housing unit and at least a part of a rim region of the cooling unit are made of a plastic material, and the housing unit and the cooling unit are joined to each other by plastic welding using a laser.
    Type: Application
    Filed: August 4, 2022
    Publication date: April 11, 2024
    Inventors: Kwan Ho RYU, Jeong Keun LEE, Min Woo LEE, Ju Hyun SUN, Tae Keun PARK, Kang Wook PARK, Lee Cheol JI, Hyeok Chul YANG, Tae Heon KIM, Keun Jae LEE
  • Publication number: 20090273655
    Abstract: A replaceable ink reservoir adapted to an inkjet print system is provided. Since the inkjet print system of the conventional arts drives an air pump to inject air into the ink reservoir to discharge the ink stored in the ink storage pack to a printer cartridge, serious noise may be generated when the air pump is driven. In addition, in order to discharge the ink through the injection of the air, the ink reservoir should be one integrated body having a hermetically sealed structure, therefore, a user cannot visually check an ink storage level in the ink storage pack from the exterior of the ink reservoir. Further, since a nozzle connecting pipe is always connected to an ink outlet port connected to a front end of the ink storage pack, it is difficult to uniformly maintain discharge pressure of the ink, thereby causing an error image to be formed on a recording medium.
    Type: Application
    Filed: June 14, 2005
    Publication date: November 5, 2009
    Applicant: SJ-D5 INC.
    Inventors: Jin-Cheol Song, Tae-Keun Park, Choong-Ho Lee, Sang-Yup Yu