Patents by Inventor Tae Ki Hong
Tae Ki Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230273708Abstract: A method for selecting one or more items by an electronic device is provided.Type: ApplicationFiled: May 8, 2023Publication date: August 31, 2023Inventors: Won-Gi CHAE, Do-Yeon NAM, Jin-Chun PARK, Jae-Wan SEO, Tae-Ki HONG
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Patent number: 11681411Abstract: A method for selecting one or more items by an electronic device is provided. The method includes receiving a first input for selecting two more points on a screen, in response to the first input, executing a multi-selection mode for selecting one or more items, receiving a second input which is inputted in succession to the first input, and in response to the second input, selecting the one or more items.Type: GrantFiled: June 22, 2020Date of Patent: June 20, 2023Inventors: Won-Gi Chae, Do-Yeon Nam, Jin-Chun Park, Jae-Wan Seo, Tae-Ki Hong
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Publication number: 20200319761Abstract: A method for selecting one or more items by an electronic device is provided. The method includes receiving a first input for selecting two more points on a screen, in response to the first input, executing a multi-selection mode for selecting one or more items, receiving a second input which is inputted in succession to the first input, and in response to the second input, selecting the one or more items.Type: ApplicationFiled: June 22, 2020Publication date: October 8, 2020Inventors: Won-Gi CHAE, Do-Yeon Nam, Jin-Chun Park, Jae-Wan Seo, Tae-Ki Hong
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Patent number: 10251615Abstract: Disclosed is an X-ray imaging device, the device including: an X-ray radiation unit for radiating X-rays to the predetermined target areas of an object to be imaged in respective imaging positions; an X-ray sensing unit for receiving the X-rays; a movement unit for arranging the X-ray radiation unit and the X-ray sensing unit to allow the X-ray radiation unit and the X-ray sensing unit to face each other in the respective imaging positions, with the object located therebetween; a position information provision unit for providing position information of the X-ray radiation unit and the X-ray sensing unit, position information of the variable rotary shaft, and position information of the target areas; a control unit for controlling the X-ray radiation unit, the X-ray sensing unit, and the movement unit; and an image processing unit for producing three-dimensional images of the object from the projection data.Type: GrantFiled: August 20, 2014Date of Patent: April 9, 2019Assignees: VATECH Co., Ltd., VATECH EWOO Holdings Co., Ltd.Inventors: Sung Il Choi, Tae Woo Kim, Tae Ki Hong
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Publication number: 20190013180Abstract: A plasma treatment apparatus, includes a plasma chamber configured to perform a plasma treatment. An upper plate is disposed in an upper part of the plasma chamber. A lower plate is disposed under the upper plate. An antenna is disposed between the upper plate and the lower plate. At least a first portion of the antenna is separated from the upper plate and at least a second portion of the antenna is separated from the lower plate. A coolant path is formed in the antenna, and an inner surface of the coolant path includes a same material as an outer surface of the antenna.Type: ApplicationFiled: January 12, 2018Publication date: January 10, 2019Inventors: SANG CHUL HAN, Tae Ki Hong
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Patent number: 10020280Abstract: The present invention relates to a method of manufacturing a carrier tape, wherein a TAB tape including a base film having a central area and edge areas at both directions of the central area, a wiring pattern formed at the central area of the base film, a transfer area formed at the edge area of the base film and exposed by the base film, a plurality of sprocket holes arranged in a row on the transfer area and a metal pattern discretely formed from the wiring pattern, and formed at the edge areas of the base film, wherein the metal pattern is formed with a paired structure formed at both sides of the plurality of sprocket holes, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of the sprocket holes from which friction is generated by a driving roller during assembly work between a drive IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability of the product.Type: GrantFiled: July 6, 2015Date of Patent: July 10, 2018Assignee: LG INNOTEK CO., LTD.Inventors: Tae Ki Hong, Dong Guk Jo, Han Mo Koo, Jun Young Lim, Ki Tae Park, Sang Ki Cho, Dae Sung Yoo, Nak Ho Song, Joo Chul Kim, Jae Sung Jo
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Patent number: 10020248Abstract: Provided is a tape for electronic devices with lead crack and a method of manufacturing the tape. According to the present invention, by forming a cutting portion on a narrow circuit pattern to be connected from an inner lead to an outer lead and further forming the cutting portion within a resin application portion, the problem of occurrence of cracks along a width of a narrow wiring can be avoided. The tape may include a first lead and a second lead formed on a dielectric substrate and a cutting portion formed on one of the first lead and the second lead wherein the cutting portion is formed within a resin application portion.Type: GrantFiled: May 13, 2016Date of Patent: July 10, 2018Assignee: LG INNOTEK CO., LTD.Inventors: Dae Sung Yoo, Han Mo Koo, Ki Tae Park, Jun Young Lim, Tae Ki Hong
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Publication number: 20170338232Abstract: A method of fabricating semiconductor device is provided. The method includes providing a substrate having a trench, plasma-ionizing a gas which comprises a deposition material precursor and a doping material precursor to respectively obtain a plasma-ionized deposition material and a plasma-ionized doping material, and depositing the plasma-ionized deposition material and the plasma-ionized doping material in the trench by applying a bias voltage to a bottom surface of the trench, wherein the bottom surface of the trench comprises a first material, and sidewalls of the trench comprise a second material different from the first material.Type: ApplicationFiled: February 14, 2017Publication date: November 23, 2017Inventors: Sang Chul HAN, Do Hyung KIM, Tae ki HONG, Jin Hyuk CHOI, Moon Hyeong HAN
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Patent number: 9648731Abstract: The present invention relates to a method for manufacturing a TAB tap. The method includes forming a circuit pattern region having input/output terminal pattern on a base film, and forming an exposing region at a convey region having a sprocket hole for exposing the base film. Accordingly, the present invention provides a TAB tape that improves reliability of a product by fundamentally preventing the generation of metal particles by forming exposing regions that expose a base film through selectively etching and removing a metal layer of a convey region formed at both side of a TAB tape and having a sprocket hole, and that prevents short-circuit by partially removing a base film at a predetermined region not having a circuit pattern formed thereon through etching.Type: GrantFiled: February 7, 2014Date of Patent: May 9, 2017Assignee: LG INNOTEK CO., LTD.Inventors: Tae Ki Hong, Jun Young Lim, Ki Tae Park, Sang Ki Cho, Dae Sung Yoo, Han Mo Koo
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Patent number: 9480152Abstract: The present invention relates to a method for manufacturing a TAB tap. The method includes forming a circuit pattern region having input/output terminal pattern on a base film, and forming an exposing region at a convey region having a sprocket hole for exposing the base film. Accordingly, the present invention provides a TAB tape that improves reliability of a product by fundamentally preventing the generation of metal particles by forming exposing regions that expose a base film through selectively etching and removing a metal layer of a convey region formed at both side of a TAB tape and having a sprocket hole, and that prevents short-circuit by partially removing a base film at a predetermined region not having a circuit pattern formed thereon through etching.Type: GrantFiled: July 22, 2011Date of Patent: October 25, 2016Assignee: LG INNOTEK CO., LTD.Inventors: Tae Ki Hong, Han Mo Koo, Jun Young Lim, Ki Tae Park, Sang Ki Cho, Dae Sung Yoo
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Publication number: 20160254219Abstract: Provided is a tape for electronic devices with lead crack and a method of manufacturing the tape. According to the present invention, by forming a bending portion on a narrow circuit pattern to be connected from an inner lead to an outer lead and further forming the bending portion within a resin application portion, crack occurred in a narrow wiring width can be avoided. The tape may includes a first lead and a second lead formed on a dielectric substrate and a bending portion formed on one of the first lead and the second lead wherein the bending portion is formed within a resin application portion.Type: ApplicationFiled: May 13, 2016Publication date: September 1, 2016Applicant: LG INNOTEK CO., LTD.Inventors: Dae Sung YOO, Han Mo KOO, Ki Tae PARK, Jun Young LIM, Tae Ki HONG
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Publication number: 20160199012Abstract: Disclosed is an X-ray imaging device, the device including: an X-ray radiation unit for radiating X-rays to the predetermined target areas of an object to be imaged in respective imaging positions; an X-ray sensing unit for receiving the X-rays; a movement unit for arranging the X-ray radiation unit and the X-ray sensing unit to allow the X-ray radiation unit and the X-ray sensing unit to face each other in the respective imaging positions, with the object located therebetween; a position information provision unit for providing position information of the X-ray radiation unit and the X-ray sensing unit, position information of the variable rotary shaft, and position information of the target areas; a control unit for controlling the X-ray radiation unit, the X-ray sensing unit, and the movement unit; and an image processing unit for producing three-dimensional images of the object from the projection data.Type: ApplicationFiled: August 20, 2014Publication date: July 14, 2016Applicants: Vatech Co., Ltd., Vatech Ewoo Holdings Co., Ltd.Inventors: Sung Il CHOI, Tae Woo KIM, Tae Ki HONG
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Publication number: 20160124589Abstract: A method for selecting one or more items by an electronic device is provided. The method includes receiving a first input for selecting two more points on a screen, in response to the first input, executing a multi-selection mode for selecting one or more items, receiving a second input which is inputted in succession to the first input, and in response to the second input, selecting the one or more items.Type: ApplicationFiled: April 24, 2015Publication date: May 5, 2016Inventors: Won-Gi Chae, Do-Yeon Nam, Jin-Chun Park, Jae-Wan Seo, Tae-Ki Hong
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Publication number: 20150311176Abstract: The present invention relates to a carrier tape for TAB-package and a manufacturing method thereof, wherein a TAB tape including a base film having a central area and edge areas at both directions of the central area, a wiring pattern formed at the central area of the base film, a transfer area formed at the edge area of the base film and exposed by the base film, a plurality of sprocket holes arranged in a row on the transfer area and a metal pattern discretely formed from the wiring pattern, and formed at the edge areas of the base film, wherein the metal pattern is formed with a paired structure formed at both sides of the plurality of sprocket holes, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of the sprocket holes from which friction is generated by a driving roller during assembly work between a drive IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability ofType: ApplicationFiled: July 6, 2015Publication date: October 29, 2015Inventors: Tae Ki Hong, Dong Guk Jo, Han Mo Koo, Jun Young Lim, Ki Tae Park, Sang Ki Cho, Dae Sung Yoo, Nak Ho Song, Joo Chul Kim, Jae Sung Jo
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Publication number: 20150284847Abstract: In a method of forming an epitaxial layer, a first plasma may be generated from a first reaction gas in a first region. The first plasma may be applied to a second reaction gas provided to a second region isolated from the first region to generate a second plasma from the second reaction gas. A blocking gas may be injected into the second region toward an edge of the substrate to help prevent the first plasma and the second plasma from being horizontally diffused. The first plasma and the second plasma may be applied to the substrate to form the epitaxial layer. Thus, the epitaxial layer may be formed at a temperature relatively lower than a temperature in a heating process.Type: ApplicationFiled: October 22, 2014Publication date: October 8, 2015Inventors: Tae-Ki Hong, Young-Min Park, Hyoung-Won Oh, Jin-Hyuk Choi, Sang-Chul Han
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Patent number: 9105631Abstract: The present invention relates to a carrier tape for TAB-package and a manufacturing method thereof, wherein a TAB tape including a base film having a central area and edge areas at both directions of the central area, a wiring pattern formed at the central area of the base film, a transfer area formed at the edge area of the base film and exposed by the base film, a plurality of sprocket holes arranged in a row on the transfer area and a metal pattern discretely formed from the wiring pattern, and formed at the edge areas of the base film, wherein the metal pattern is formed with a paired structure formed at both sides of the plurality of sprocket holes, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of the sprocket holes from which friction is generated by a driving roller during assembly work between a drive IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability ofType: GrantFiled: June 13, 2014Date of Patent: August 11, 2015Assignee: LG INNOTEK CO., LTD.Inventors: Tae Ki Hong, Dong Guk Jo, Han Mo Koo, Jun Young Lim, Ki Tae Park, Sang Ki Cho, Dae Sung Yoo, Nak Ho Song, Joo Chul Kim, Jae Sung Jo
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Publication number: 20150050805Abstract: A semiconductor pattern is formed on a substrate. An interlayer insulating layer is formed on the semiconductor pattern. A contact hole in the interlayer insulating layer is formed the semiconductor pattern is exposed. A lower plug is formed in the contact hole by a selective epitaxial growth (SEG) process. An upper plug is formed in the contact hole on the lower plug by alternately and repeatedly performing a deposition process and an etching process.Type: ApplicationFiled: March 7, 2014Publication date: February 19, 2015Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: HYOUNG-WON OH, Tae-Jin Lim, Tae-Ki Hong
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Patent number: 8956970Abstract: A semiconductor pattern is formed on a substrate. An interlayer insulating layer is formed on the semiconductor pattern. A contact hole in the interlayer insulating layer is formed the semiconductor pattern is exposed. A lower plug is formed in the contact hole by a selective epitaxial growth (SEG) process. An upper plug is farmed in the contact hole on the lower plug by alternately and repeatedly performing a deposition process and an etching process.Type: GrantFiled: March 7, 2014Date of Patent: February 17, 2015Assignee: Samsung Electronics Co., Ltd.Inventors: Hyoung-Won Oh, Tae-Jin Lim, Tae-Ki Hong
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Publication number: 20140291004Abstract: The present invention relates to a carrier tape for TAB-package and a manufacturing method thereof, wherein a TAB tape including a base film having a central area and edge areas at both directions of the central area, a wiring pattern formed at the central area of the base film, a transfer area formed at the edge area of the base film and exposed by the base film, a plurality of sprocket holes arranged in a row on the transfer area and a metal pattern discretely formed from the wiring pattern, and formed at the edge areas of the base film, wherein the metal pattern is formed with a paired structure formed at both sides of the plurality of sprocket holes, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of the sprocket holes from which friction is generated by a driving roller during assembly work between a drive IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability ofType: ApplicationFiled: June 13, 2014Publication date: October 2, 2014Inventors: Tae Ki Hong, Dong Guk Jo, Han Mo Koo, Jun Young Lim, Ki Tae Park, Sang Ki Cho, Dae Sung Yoo, Nak Ho Song, Joo Chul Kim, Jae Sung Jo
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Patent number: 8791370Abstract: The present invention relates to a carrier tape for TAB-package and a manufacturing method thereof, wherein a TAB tape including a wiring pattern and a metal plating layer formed on a base film comprises a transfer area including a row of sprocket holes arranged along the edges of the base film at predetermined intervals, and wherein the transfer area includes an exposure area from which the base film is exposed, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of the sprocket holes from which friction is generated by a driving roller during assembly work between a drive IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability of the product.Type: GrantFiled: February 23, 2010Date of Patent: July 29, 2014Assignee: LG Innotek Co., Ltd.Inventors: Tae Ki Hong, Dong Guk Jo, Han Mo Koo, Jun Young Lim, Ki Tae Park, Sang Ki Cho, Dae Sung Yoo, Nak Ho Song, Joo Chul Kim, Jae Sung Jo