Abstract: An electronic device structure having a shielding structure includes a substrate with an electronic component electrically connected to the substrate. The shielding structure includes conductive spaced-apart pillar structures that have proximate ends connected to the substrate and distal ends spaced apart from the substrate, and that are laterally spaced apart from the first electronic component. In one embodiment, the conductive pillar structures are conductive wires attached at one end to the substrate with an opposing end extending away from the substrate so that the conductive wires are provided generally perpendicular to the substrate. A package body encapsulates the electronic component and the conductive spaced-apart pillar structures. In one embodiment, the shielding structure further includes a shielding layer disposed adjacent to the package body, which is electrically connected to the conductive spaced-apart pillar structures.

Abstract: The present invention relates to a cap mounted with a bone conduction module. The cap includes a body part directly contacting a user's head, a cap part protruding from a front portion of the body part, and a bone conduction module provided on the body part and the cap part. The body part is provided on both sides with audio signal output parts, the cap part is provided on one side with a first recess part and on the other side with a second recess part, a wireless communication part of the bone conduction module is inserted in the first recess part, a battery part of the bone conduction module is inserted in the second recess part, and the first recess part and the second recess part are disposed spaced apart on both sides of the cap part and have a shallower depth than the thickness of the cap part.