Abstract: The present invention relates to induction-heated soldering automation equipment and, particularly, to equipment comprising: a jig unit for fixing a substrate on which an electronic element is mounted; a first conveyor for transferring the jig unit; an induction heating unit which is provided above the jig unit so as to be movable in the X-axis, Y-axis, and Z-axis directions, and which includes a magnetic induction coil for soldering the electronic element by induction-heating the substrate fixed to the jig unit; and a controller for controlling the first conveyor and the induction heating unit, wherein continuously supplied molded interconnected devices (MIDs), PCBs, or FPCBs are locally heated through contactless induction heating so that electronic elements can be automatically soldered in a state in which thermal damage is minimized.

Abstract: A method of manufacturing interior parts for a vehicle includes: forming a first plating layer on a surface of an injection molded product through electroless plating; printing a symbol part on the first plating layer; partially removing the first plating layer to a size corresponding to the symbol part from a rear surface of the injection molded product; forming a second plating layer on the first plating layer; and removing the symbol part and the first plating layer from the surface of the injection molded product on which the second plating layer is formed.

Abstract: An image sensing device comprising, a latch array including, a first latch group, a second latch group, a first latch controller generates a first latch control signal to control the first latch group, and a second latch controller generates a second latch control signal to control the second latch group, wherein a second edge of the second latch control signal occurs after a first edge of the first latch control signal.

Abstract: A light-emitting diode (LED) lamp for a vehicle and a method of manufacturing the same use MID and magnetic induction technologies. The LED lamp includes a LED module, a housing accommodating the LED module, and a molded interconnect device (MID) electrode formed on a surface of the housing. The LED module may be mounted on the MID electrode by soldering using magnetic induction heating, the housing may be an injection molded product, and the MID electrode may be formed on the housing using a MID process.

Abstract: Disclosed is a semiconductor device including a first pad, a pull-up resistor connected between the first pad and a supply terminal of a high voltage, a second pad connected to the first pad, a pull-down driver connected between the second pad and a supply terminal of a low voltage, and suitable for selectively driving the second pad with the low voltage based on a control signal corresponding to a predetermined signal, a first leakage prevention driver connected between an input terminal of the control signal and the supply terminal of the low voltage, and suitable for selectively driving the control signal with the low voltage based on a leakage prevention signal, and a controller connected to the second pad, and suitable for generating the leakage prevention signal based on a mode signal and a tie control signal.

Abstract: A light-emitting diode (LED) lamp for a vehicle and a method of manufacturing the same use MID and magnetic induction technologies. The LED lamp includes a LED module, a housing accommodating the LED module, and a molded interconnect device (MID) electrode formed on a surface of the housing. The LED module may be mounted on the MID electrode by soldering using magnetic induction heating, the housing may be an injection molded product, and the MID electrode may be formed on the housing using a MID process.