Abstract: Provided are a method and apparatus for constructing a peer-to-peer (P2P) overlay network.

Abstract: Disclosed is a chemical mechanical polishing pad formed at a polishing surface thereof with micro-holes each having a desired cross-sectional area while having a desired depth. The shape, size, and density of the micro-holes can be optionally adjusted. The chemical mechanical polishing pad provides an effect of maintaining a desired polishing rate during a polishing process. In accordance with the present invention, the micro-holes can have diverse arrangements depending on given process conditions.

Abstract: Disclosed is a chemical mechanical polishing pad formed with holes, grooves or a combination thereof. The chemical mechanical polishing pad is characterized in that a plurality of concentric circles each having grooves, holes, or a combination thereof are formed at a polishing surface of the polishing pad. The chemical mechanical polishing pad provides effects of effectively controlling a flow of slurry during a polishing process, thereby achieving a stability in the polishing process in terms of a polishing rate, and achieving an enhancement in the planarization of a wafer.

Abstract: Disclosed is a method for forming micro-holes, perforated holes, and/or grooves on a polishing pad using a laser beam and a mask. This method involves the steps of determining a pattern of micro-holes, grooves, and/or perforated holes to be formed on a polishing pad, inputting the determined pattern to a computer numerical control (CNC) controller, selecting a mask corresponding to the determined pattern, positioning the mask under a laser device, parallel to the polishing pad, and driving the laser device adapted to irradiate the laser beam and a table adapted to conduct a three-dimensional movement and rotation while supporting the polishing pad, under the control of the CNC controlled, thereby irradiating the laser beam from the laser device through the mask onto the polishing pad according to the inputted pattern.

Abstract: Disclosed is a method for forming micro-holes, perforated holes, or grooves on a chemical mechanical polishing pad by a laser. This method involves the steps of determining a pattern of micro-holes, grooves, or perforated holes to be formed on a polishing pad, inputting the determined pattern to a computer numerical control (CNC) controller, and driving a laser device adapted to irradiate a laser beam and a table adapted to conduct a three-dimensional movement and rotation while supporting the polishing pad, under the control of the CNC controller based on the inputted pattern, thereby irradiating the laser beam from the laser device onto the polishing pad supported by the table while moving the table in accordance with the inputted pattern, so that micro-holes, grooves, or perforated holes having a pattern corresponding to the determined pattern are formed on the polishing pad.

Abstract: Disclosed is a chemical mechanical polishing pad formed at a polishing surface thereof with a plurality of concentric wave-shaped grooves having different radiuses while having the same shape. Each groove has a desired depth, width, and shape. The chemical mechanical polishing pad provides effects of effectively controlling a flow of slurry during a polishing process, thereby achieving a stability in the polishing process in terms of a polishing rate, and achieving an enhancement in the planarization of a wafer.

Abstract: Disclosed is a chemical mechanical polishing pad formed with holes, grooves or a combination thereof. The chemical mechanical polishing pad is characterized in that a plurality of concentric circles each having grooves, holes, or a combination thereof are formed at a polishing surface of the polishing pad. The chemical mechanical polishing pad provides effects of effectively controlling a flow of slurry during a polishing process, thereby achieving a stability in the polishing process in terms of a polishing rate, and achieving an enhancement in the planarization of a wafer.

Abstract: Disclosed is a chemical mechanical polishing pad formed at a polishing surface thereof with micro-holes each having a desired cross-sectional area while having a desired depth. The shape, size, and density of the micro-holes can be optionally adjusted. The chemical mechanical polishing pad provides an effect of maintaining a desired polishing rate during a polishing process. In accordance with the present invention, the micro-holes can have diverse arrangements depending on given process conditions.

Abstract: Disclosed is a method for forming micro-holes, perforated holes, or grooves on a chemical mechanical polishing pad by a laser. This method involves the steps of determining a pattern of micro-holes, grooves, or perforated holes to be formed on a polishing pad, inputting the determined pattern to a computer numerical control (CNC) controller, and driving a laser device adapted to irradiate a laser beam and a table adapted to conduct a three-dimensional movement and rotation while supporting the polishing pad, under the control of the CNC controller based on the inputted pattern, thereby irradiating the laser beam from the laser device onto the polishing pad supported by the table while moving the table in accordance with the inputted pattern, so that micro-holes, grooves, or perforated holes having a pattern corresponding to the determined pattern are formed on the polishing pad.

Abstract: Disclosed is a chemical mechanical polishing pad formed at a polishing surface thereof with a plurality of concentric wave-shaped grooves having different radiuses while having the same shape. Each groove has a desired depth, width, and shape. The chemical mechanical polishing pad provides effects of effectively controlling a flow of slurry during a polishing process, thereby achieving a stability in the polishing process in terms of a polishing rate, and achieving an enhancement in the planarization of a wafer.

Abstract: An apparatus for detecting a sync signal in a digital data record/replay device having a parallel clock generator, a parallel data generator, and a window unit comprises: a sync signal detector for comparing a pattern matching sync signal output from a sync pattern detector with an output signal of the window unit and detecting a sync signal according to clocks of the parallel clock generator; a latch unit for latching the sync signal detected by the sync signal detector and outputting the sync signal as a sync position signal according to clocks of the parallel clock generator; an identification error correction code (ID ECC) controller for generating an ID ECC control signal according to the sync position signal of the latch unit; an ID ECC decoder for decoding ID areas of parallel data generated by the parallel data generator; and a sync signal checking unit for outputting the sync position signal of the latch unit as a final sync signal and, when errors are detected as a result of the ID ECC decoding, sen