Abstract: A home port for a semiconductor manufacturing nozzle head includes a body having a discharge space configured to receive treatment liquid discharged from a plurality of nozzles, discharge flow passages connected to be in communication with the discharge space and penetrating through the body so as to face the plurality of nozzles, and a cleaning liquid distribution system, which is formed to penetrate through the body, and is connected to transfer a cleaning liquid to the discharge flow passages. The cleaning liquid distribution system includes supply flow passages connected to supply the cleaning liquid to the discharge flow passages, and a lead-in passage connected to and which joins the supply flow passages, and connected to receive the cleaning liquid injected from the outside.

Abstract: The present invention relates to novel mesylate salt of N-(5-(4-(4-((dimethylamino)methyl)-3-phenyl-1H-pyrazol-1-yl)pyrimidine-2-ylamino)-4-methoxy-2-morpholinophenyl)acrylamide, a novel crystalline form thereof, and a process for preparing the same. More specifically, the present invention relates to mesylate salt of N-(5-(4-(4-((dimethylamino)methyl)-3-phenyl-1H-pyrazol-1-yl)pyrimidine-2-ylamino)-4-methoxy-2-morpholinophenyl)acrylamide, which is excellent in stability, solubility, and bioavailability when it is administered not only alone but also in combination with other drugs and which has a high purity, a crystalline form thereof, and a process for preparing the same.

Abstract: A semiconductor device and a method of fabricating the same are provided. According to the present invention, a semiconductor device comprises an active region formed in a substrate, and including flat surfaces and hole-shaped recess portions; upper-level plugs disposed over the flat surfaces; a spacer disposed between the upper-level plugs and providing a trench exposing the hole-shaped recess portions; a lower-level plug filling the hole-shaped recess portions; and a buried conductive line disposed over the lower-level plug and partially filling the trench.

Abstract: A method of manufacturing a semiconductor device includes: forming a trench in an insulating interlayer by etching the insulating interlayer; forming a conductive layer on bottom, side, and upper surfaces of the insulating interlayer where the trench is formed, using a first deposition process, the conductive layer on the bottom surface of the trench being thicker than the conductive layer on the side surface of the trench; forming a sacrificial layer in the trench covering the conductive layer formed on the bottom surface of the trench using a second deposition process different from the first deposition process; selectively removing the conductive layer formed on the upper surface of the insulating interlayer and formed on the side surface of the trench left exposed through the sacrificial layer; and selectively removing the sacrificial layer, to form a conductive line using the conductive layer remaining on the bottom surface of the trench.

Abstract: The present invention provides a touch switch attachable on a wall. The touch switch, attachable on a wall, comprises: a switch box unit which is inserted into an embedded box formed on a wall; a back cover unit which is inserted inside the switch box unit and has a plurality of PCBs stacked and placed; a fixing plate unit which is coupled to the switch box unit and fixes the back cover unit; and an LCD touch pad unit which is fixed on one end of the back cover unit passing through the fixing plate unit, is electrically connected to the plurality of PCBs, and is for inputting switching operation information to the plurality of PCBs by means of capacitive touch.

Abstract: The present invention provides a touch switch attachable on a wall. The touch switch, attachable on a wall, comprises: a switch box unit which is inserted into an embedded box formed on a wall; a back cover unit which is inserted inside the switch box unit and has a plurality of PCBs stacked and placed; a fixing plate unit which is coupled to the switch box unit and fixes the back cover unit; and an LCD touch pad unit which is fixed on one end of the back cover unit passing through the fixing plate unit, is electrically connected to the plurality of PCBs, and is for inputting switching operation information to the plurality of PCBs by means of capacitive touch.