Abstract: A vehicle configured for container-swapping, includes: a main frame including a pair of drive modules spaced in a forward/backward direction of the vehicle, and a connecting portion extending in the forward/backward direction of the vehicle to connect the pair of drive modules so that a coupling space is formed therebetween; a container module selectively inserted into the coupling space of the main frame; and a coupling portion configured to couple the main frame and the container to each other while the container module is inserted into the coupling space of the main frame, wherein a driving portion operates and moves the main frame so that the container module is inserted into the coupling space of the main frame.

Abstract: A method for providing an electronic package structure includes providing a substrate having a die pad having a die pad top surface and an opposing die pad bottom surface, leads laterally spaced apart from the die pad, and a substrate encapsulant interposed between the die pad and the leads and includes a substrate top surface and an opposing substrate bottom surface. The substrate encapsulant is provided such that the die pad and the leads protrude outward from the substrate bottom surface. The method includes providing an electronic device having opposing major surfaces and a pair of opposing outer edges. The method includes connecting the electronic device to the substrate such that one major surface of the electronic device is spaced apart from the die pad top surface and upper surfaces of the leads, and the outer edges overlap an opposing pair of the leads.

Abstract: A method for providing an electronic package structure includes providing a substrate having a die pad having a die pad top surface and an opposing die pad bottom surface, leads laterally spaced apart from the die pad, and a substrate encapsulant interposed between the die pad and the leads and includes a substrate top surface and an opposing substrate bottom surface. The substrate encapsulant is provided such that the die pad and the leads protrude outward from the substrate bottom surface. The method includes providing an electronic device having opposing major surfaces and a pair of opposing outer edges. The method includes connecting the electronic device to the substrate such that one major surface of the electronic device is spaced apart from the die pad top surface and upper surfaces of the leads, and the outer edges overlap an opposing pair of the leads.

Abstract: A semiconductor device having an EMI shield layer and/or EMI shielding wires, and a manufacturing method thereof, are provided. In an example embodiment, the semiconductor device includes a semiconductor die, an EMI shield layer shielding the semiconductor die, and an encapsulating portion encapsulating the EMI shield layer. In another example embodiment, the semiconductor device further includes EMI shielding wires extending from the EMI shield layer and shielding the semiconductor die.

Abstract: A semiconductor device having an EMI shield layer and/or EMI shielding wires, and a manufacturing method thereof, are provided. In an example embodiment, the semiconductor device includes a semiconductor die, an EMI shield layer shielding the semiconductor die, and an encapsulating portion encapsulating the EMI shield layer. In another example embodiment, the semiconductor device further includes EMI shielding wires extending from the EMI shield layer and shielding the semiconductor die.

Abstract: A method for providing an electronic package structure includes providing a substrate having a die pad having a die pad top surface and an opposing die pad bottom surface, leads laterally spaced apart from the die pad, and a substrate encapsulant interposed between the die pad and the leads and includes a substrate top surface and an opposing substrate bottom surface. The substrate encapsulant is provided such that the die pad and the leads protrude outward from the substrate bottom surface. The method includes providing an electronic device having opposing major surfaces and a pair of opposing outer edges. The method includes connecting the electronic device to the substrate such that one major surface of the electronic device is spaced apart from the die pad top surface and upper surfaces of the leads, and the outer edges overlap an opposing pair of the leads.

Abstract: An electronic package includes a lead frame structure having one or more structural features configured to improve board level reliability. In one embodiment, the structural feature comprises lead frame protrusions extending outward from the electronic package, which are configured to laterally engage solder structures used to attach the electronic package to a next level of assembly. In another embodiment, conductive bumps are attached to exposed portions of the lead frame in advance of next level assembly processes. In a further embodiment, the lead frame comprises laterally separated contact points for attaching an electron die and for attaching the electronic package to a next level of assembly.

Abstract: A semiconductor package, and a method of manufacturing thereof, comprising a contact in a plated sidewall encapsulant opening, substantially as shown in and/or described in connection with at least one of the figures, as set forth more completely in the claims.

Abstract: An electronic package includes a lead frame structure having one or more structural features configured to improve board level reliability. In one embodiment, the structural feature comprises lead frame protrusions extending outward from the electronic package, which are configured to laterally engage solder structures used to attach the electronic package to a next level of assembly. In another embodiment, conductive bumps are attached to exposed portions of the lead frame in advance of next level assembly processes. In a further embodiment, the lead frame comprises laterally separated contact points for attaching an electron die and for attaching the electronic package to a next level of assembly.

Abstract: A semiconductor package, and a method of manufacturing thereof, comprising a contact in a plated sidewall encapsulant opening, substantially as shown in and/or described in connection with at least one of the figures, as set forth more completely in the claims.

Abstract: A device control method and system that sets a control setting through a user interface generated by using an XML (eXtensible Markup Language) document is provided. Operation control of a device is set through a user interface that is generated using an XML (eXtensible Markup Language) document. A user interface is generated for control settings of a device based on received first information, second information corresponding to control setting values is input through the user interface, and the second information is transmitted to the device and corresponding control settings of the device are set. Accordingly, operation control of the device can be controlled through a user interface by using a single standardized document regardless of the type of device.

Abstract: A semiconductor device and method of manufacturing the same are provided. The semiconductor device comprises a semiconductor die including a bond pad, a redistribution layer, and a solder ball. The redistribution layer is formed by sequentially plating copper and nickel, sequentially plating nickel and copper, or sequentially plating copper, nickel, and copper. The redistribution layer includes a nickel layer in order to prevent a crack from occurring in a copper layer. Further, a projection is formed in an area of the redistribution layer or a dielectric layer to which the solder ball is welded and corresponds, so that an area of the redistribution layer to which the solder ball is welded increases, thereby increasing bonding power between the solder ball and the redistribution layer.

Abstract: A server connected to an image forming apparatus and a client, a client, and a method of remotely installing a driver of the image forming apparatus. A method of remotely installing a driver of an image forming apparatus in which a server is connected to at least one image forming apparatus and at least one client, the method including selecting at least one client where a driver of the image forming apparatus is to be installed, selecting a kind of at least one driver to be installed in the selected at least one client, receiving status information from the selected at least one client, displaying installation information of the driver on the at least one selected client according to the received status information, and selectively installing the driver in the selected at least one client according to the display installation information.

Abstract: A management apparatus to manage a device driver using a device driver package or a device driver configuration package and a method of managing the device driver of the management apparatus are provided. The management apparatus and the method are to deploy at least one of a device driver package to install a device driver using the device driver or a common device driver corresponding to at least one image forming apparatus and a device driver configuration package to modify a configuration of an installed device driver.

Abstract: A device control method and system that sets a control setting through a user interface generated by using an XML (eXtensible Markup Language) document is provided. Operation control of a device is set through a user interface that is generated using an XML (eXtensible Markup Language) document. A user interface is generated for control settings of a device based on received first information, second information corresponding to control setting values is input through the user interface, and the second information is transmitted to the device and corresponding control settings of the device are set. Accordingly, operation control of the device can be controlled through a user interface by using a single standardized document regardless of the type of device.

Abstract: A print control method of a host apparatus which is connected to at least one image forming apparatus in a network, the method including receiving changed IP information from the at least one image forming apparatus; determining whether the host apparatus performs a print job with respect to the image forming apparatus which has the changed IP information; holding the print job if there is the print job; changing a print option for the print job; and transmitting print data corresponding to the print job according to the changed print option. With this, the apparatus and the method may normally perform a print job by changing a port of an image forming apparatus and prevent data loss due to a failure to change the port normally even if there is a print job for an image forming apparatus whose IP address is changed.

Abstract: A device control method and system that sets a control setting through a user interface generated by using an XML (eXtensible Markup Language) document is provided. Operation control of a device is set through a user interface that is generated using an XML (eXtensible Markup Language) document. A user interface is generated for control settings of a device based on received first information, second information corresponding to control setting values is input through the user interface, and the second information is transmitted to the device and corresponding control settings of the device are set. Accordingly, operation control of the device can be controlled through a user interface by using a single standardized document regardless of the type of device.

Abstract: A semiconductor device is disclosed. A conductive pillar for electrically connecting a semiconductor die to a circuit board may be gradually slimmed from the semiconductor die to the circuit board. A dummy conductive layer may be disposed between the semiconductor die and the conductive pillar. A width of an opening for opening a pattern of the circuit board may range from about 50% to 90% of the width of the lower end of the conductive pillar. Accordingly, a mechanical stress is prevented from being transmitted from the conductive pillar to the semiconductor die, or is absorbed by the dummy conductive layer, and thus, preventing cracks of the semiconductor die and a dielectric layer having a low dielectric constant.

Abstract: A method and apparatus for installing a printer driver of an image forming apparatus in a printing environment using a universal printer driver, the method including: displaying one or more functions that are supported by one or more image forming apparatuses connected to the printing environment; selecting at least one function from among the displayed functions; and installing a printer driver of a connected image forming apparatus that supports the selected at least one function. Thus, even if a model name of the printer driver of the image forming apparatus to be used is not recognized, a printer driver of the image forming apparatus that supports the functions to be used can be installed.

Abstract: An application management method, computer-readable medium, server, and host device are provided. The application management method includes receiving policy information including a management policy for an application used by a host device from the management server, receiving an installation program for the application based on the policy information, and installing the installation program in the host device based on the policy information.