Patents by Inventor Tae Ryung HU

Tae Ryung HU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220199315
    Abstract: A coil component includes: a body; a coil portion disposed in the body and including a lead-out pattern exposed on one end surface of the body; an insulating layer disposed on the one end surface of the body and having an opening disposed on the lead-out pattern; an external electrode including a connection portion, disposed to be in contact with the lead-out pattern, and a pad portion extending from the connection portion to one surface of the body; and a cover insulating layer disposed on the one end surface of the body to cover the connection portion. The connection portion is spaced apart from all corner portions of the one end surface of the body, except for a corner portion between the one end surface of the body and one surface of the body, on the one end surface of the body.
    Type: Application
    Filed: November 18, 2021
    Publication date: June 23, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyun Ju JUNG, Tae Ryung HU
  • Patent number: 11348723
    Abstract: A coil component includes: a body including a support member including a through-hole, a first insulating layer supported by the support member and including a first opening portion, a second insulating layer disposed on the first insulating layer and including a second opening portion, and a coil including a coil pattern filled in the first and second opening portions; and external electrodes disposed on an outer surface of the body.
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: May 31, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Min Moon, Cheol Soon Kim, Yu Jong Kim, Dong Min Kim, Young Do Choi, Tae Ryung Hu
  • Patent number: 11205538
    Abstract: An inductor includes: a body including a support member including a through-hole and a via hole, an insulator disposed on the support member and including a first opening exposing portions of the support member, and a coil pattern disposed in the first opening, and including a plurality of layers including a seed layer in contact with the support member; and an external electrode disposed on an external surface of the body and electrically connected to the coil pattern. The support member may have a multilayer structure of at least first and second insulating layers, and the via hole may penetrate through both of the first and second insulating layers.
    Type: Grant
    Filed: May 17, 2018
    Date of Patent: December 21, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Min Moon, Cheol Soon Kim, Yu Jong Kim, Dong Min Kim, Young Do Choi, Tae Ryung Hu
  • Patent number: 11145457
    Abstract: A coil component includes a body in which a coil part is embedded. The coil part includes a support member having trenches, pattern walls extending from the trenches in the support member, and coil patterns extending between the pattern walls on the support member.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: October 12, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Do Choi, Yu Jong Kim, Sung Min Moon, Tae Ryung Hu, Sang Seob Kim, Dong Min Kim
  • Patent number: 11107616
    Abstract: A coil component includes a body in which a coil part is embedded. The coil part includes a support member, pattern walls formed on the support member, and coil patterns extending between the pattern walls on the support member, and the pattern walls include support portions having a width greater than an average width of the pattern walls.
    Type: Grant
    Filed: December 12, 2018
    Date of Patent: August 31, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Do Choi, Yu Jong Kim, Sung Min Moon, Tae Ryung Hu, Sang Seob Kim, Dong Min Kim
  • Patent number: 10902991
    Abstract: A coil component includes: a body including a support member including a through-hole, a first insulating layer disposed on the support member and including a first opening pattern, a second insulating layer disposed on the first insulating layer and including a second opening pattern, and a coil including a coil pattern filled in the first and second opening patterns; and external electrodes disposed on an outer surface of the body. The coil pattern has a stacking structure composed of a plurality of layers, and the plurality of layers includes a thin film conductor layer in contact with the support member, the thin film conductor layer extending to an entire lower surface of the first opening pattern and at least portions of side surfaces of the first opening pattern.
    Type: Grant
    Filed: July 5, 2018
    Date of Patent: January 26, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Min Moon, Cheol Soon Kim, Yu Jong Kim, Dong Min Kim, Young Do Choi, Tae Ryung Hu
  • Publication number: 20200168392
    Abstract: A coil electronic component includes a support substrate, a coil portion disposed on at least one surface of the support substrate, a body in which the support substrate and the coil portion are embedded, and first and second external electrodes disposed on a surface of the body and connected to both ends of the coil portion, respectively. A thickness of the body is 0.55 mm or less. The body includes a cover portion disposed on the coil portion. A ratio of a thickness of the coil portion to a thickness of the cover portion is 5:5 to 8:2.
    Type: Application
    Filed: October 9, 2019
    Publication date: May 28, 2020
    Inventors: Tae Ryung HU, Yu Jong KIM, Hye Yeon JEON, Young Do CHOI, Jong Min LEE, Seung Hee KIM
  • Publication number: 20200126712
    Abstract: A coil electronic component includes a support substrate having a thickness of 20 to 40 ?m. A coil pattern is disposed on at least one of a first surface and a second surface of the support substrate opposing each other, and has an aspect ratio of 4 or higher. An encapsulant encapsulates at least portions of the support substrate and the coil pattern, and an external electrode is disposed in an external region of the encapsulant and connected to the coil pattern.
    Type: Application
    Filed: September 17, 2019
    Publication date: April 23, 2020
    Inventors: Yu Jong Kim, Young Do Choi, Seung Hee Kim, Jong Min Lee, Hye Yeon Jeon, Tae Ryung Hu
  • Publication number: 20190304654
    Abstract: A coil component includes a body in which a coil part is embedded. The coil part includes a support member, pattern walls formed on the support member, and coil patterns extending between the pattern walls on the support member, and the pattern walls include support portions having a width greater than an average width of the pattern walls.
    Type: Application
    Filed: December 12, 2018
    Publication date: October 3, 2019
    Inventors: Young Do CHOI, Yu Jong KIM, Sung Min MOON, Tae Ryung HU, Sang Seob KIM, Dong Min KIM
  • Publication number: 20190304680
    Abstract: A coil component includes a body in which a coil part is embedded. The coil part includes a support member having trenches, pattern walls extending from the trenches in the support member, and coil patterns extending between the pattern walls on the support member.
    Type: Application
    Filed: December 11, 2018
    Publication date: October 3, 2019
    Inventors: Young Do CHOI, Yu Jong KIM, Sung Min MOON, Tae Ryung HU, Sang Seob KIM, Dong Min KIM
  • Publication number: 20190180915
    Abstract: A coil component includes: a body including a support member including a through-hole, a first insulating layer disposed on the support member and including a first opening pattern, a second insulating layer disposed on the first insulating layer and including a second opening pattern, and a coil including a coil pattern filled in the first and second opening patterns; and external electrodes disposed on an outer surface of the body. The coil pattern has a stacking structure composed of a plurality of layers, and the plurality of layers includes a thin film conductor layer in contact with the support member, the thin film conductor layer extending to an entire lower surface of the first opening pattern and at least portions of side surfaces of the first opening pattern.
    Type: Application
    Filed: July 5, 2018
    Publication date: June 13, 2019
    Inventors: Sung Min MOON, Cheol Soon Kim, Yu Jong Kim, Dong Min Kim, Young Do Choi, Tae Ryung Hu
  • Publication number: 20190180927
    Abstract: A coil component includes: a body including a support member including a through-hole, a first insulating layer supported by the support member and including a first opening portion, a second insulating layer disposed on the first insulating layer and including a second opening portion, and a coil including a coil pattern filled in the first and second opening portions; and external electrodes disposed on an outer surface of the body.
    Type: Application
    Filed: July 6, 2018
    Publication date: June 13, 2019
    Inventors: Sung Min MOON, Cheol Soon KIM, Yu Jong KIM, Dong Min KIM, Young Do CHOI, Tae Ryung HU
  • Publication number: 20190180913
    Abstract: An inductor includes: a body including a support member including a through-hole and a via hole, an insulator disposed on the support member and including a first opening exposing portions of the support member, and a coil pattern disposed in the first opening, and including a plurality of layers including a seed layer in contact with the support member; and an external electrode disposed on an external surface of the body and electrically connected to the coil pattern. The support member may have a multilayer structure of at least first and second insulating layers, and the via hole may penetrate through both of the first and second insulating layers.
    Type: Application
    Filed: May 17, 2018
    Publication date: June 13, 2019
    Inventors: Sung Min MOON, Cheol Soon KIM, Yu Jong KIM, Dong Min KIM, Young Do CHOI, Tae Ryung HU