Patents by Inventor Tae Ryung HU
Tae Ryung HU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20220199315Abstract: A coil component includes: a body; a coil portion disposed in the body and including a lead-out pattern exposed on one end surface of the body; an insulating layer disposed on the one end surface of the body and having an opening disposed on the lead-out pattern; an external electrode including a connection portion, disposed to be in contact with the lead-out pattern, and a pad portion extending from the connection portion to one surface of the body; and a cover insulating layer disposed on the one end surface of the body to cover the connection portion. The connection portion is spaced apart from all corner portions of the one end surface of the body, except for a corner portion between the one end surface of the body and one surface of the body, on the one end surface of the body.Type: ApplicationFiled: November 18, 2021Publication date: June 23, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hyun Ju JUNG, Tae Ryung HU
-
Patent number: 11348723Abstract: A coil component includes: a body including a support member including a through-hole, a first insulating layer supported by the support member and including a first opening portion, a second insulating layer disposed on the first insulating layer and including a second opening portion, and a coil including a coil pattern filled in the first and second opening portions; and external electrodes disposed on an outer surface of the body.Type: GrantFiled: July 6, 2018Date of Patent: May 31, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sung Min Moon, Cheol Soon Kim, Yu Jong Kim, Dong Min Kim, Young Do Choi, Tae Ryung Hu
-
Patent number: 11205538Abstract: An inductor includes: a body including a support member including a through-hole and a via hole, an insulator disposed on the support member and including a first opening exposing portions of the support member, and a coil pattern disposed in the first opening, and including a plurality of layers including a seed layer in contact with the support member; and an external electrode disposed on an external surface of the body and electrically connected to the coil pattern. The support member may have a multilayer structure of at least first and second insulating layers, and the via hole may penetrate through both of the first and second insulating layers.Type: GrantFiled: May 17, 2018Date of Patent: December 21, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sung Min Moon, Cheol Soon Kim, Yu Jong Kim, Dong Min Kim, Young Do Choi, Tae Ryung Hu
-
Patent number: 11145457Abstract: A coil component includes a body in which a coil part is embedded. The coil part includes a support member having trenches, pattern walls extending from the trenches in the support member, and coil patterns extending between the pattern walls on the support member.Type: GrantFiled: December 11, 2018Date of Patent: October 12, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Do Choi, Yu Jong Kim, Sung Min Moon, Tae Ryung Hu, Sang Seob Kim, Dong Min Kim
-
Patent number: 11107616Abstract: A coil component includes a body in which a coil part is embedded. The coil part includes a support member, pattern walls formed on the support member, and coil patterns extending between the pattern walls on the support member, and the pattern walls include support portions having a width greater than an average width of the pattern walls.Type: GrantFiled: December 12, 2018Date of Patent: August 31, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Do Choi, Yu Jong Kim, Sung Min Moon, Tae Ryung Hu, Sang Seob Kim, Dong Min Kim
-
Patent number: 10902991Abstract: A coil component includes: a body including a support member including a through-hole, a first insulating layer disposed on the support member and including a first opening pattern, a second insulating layer disposed on the first insulating layer and including a second opening pattern, and a coil including a coil pattern filled in the first and second opening patterns; and external electrodes disposed on an outer surface of the body. The coil pattern has a stacking structure composed of a plurality of layers, and the plurality of layers includes a thin film conductor layer in contact with the support member, the thin film conductor layer extending to an entire lower surface of the first opening pattern and at least portions of side surfaces of the first opening pattern.Type: GrantFiled: July 5, 2018Date of Patent: January 26, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sung Min Moon, Cheol Soon Kim, Yu Jong Kim, Dong Min Kim, Young Do Choi, Tae Ryung Hu
-
Publication number: 20200168392Abstract: A coil electronic component includes a support substrate, a coil portion disposed on at least one surface of the support substrate, a body in which the support substrate and the coil portion are embedded, and first and second external electrodes disposed on a surface of the body and connected to both ends of the coil portion, respectively. A thickness of the body is 0.55 mm or less. The body includes a cover portion disposed on the coil portion. A ratio of a thickness of the coil portion to a thickness of the cover portion is 5:5 to 8:2.Type: ApplicationFiled: October 9, 2019Publication date: May 28, 2020Inventors: Tae Ryung HU, Yu Jong KIM, Hye Yeon JEON, Young Do CHOI, Jong Min LEE, Seung Hee KIM
-
Publication number: 20200126712Abstract: A coil electronic component includes a support substrate having a thickness of 20 to 40 ?m. A coil pattern is disposed on at least one of a first surface and a second surface of the support substrate opposing each other, and has an aspect ratio of 4 or higher. An encapsulant encapsulates at least portions of the support substrate and the coil pattern, and an external electrode is disposed in an external region of the encapsulant and connected to the coil pattern.Type: ApplicationFiled: September 17, 2019Publication date: April 23, 2020Inventors: Yu Jong Kim, Young Do Choi, Seung Hee Kim, Jong Min Lee, Hye Yeon Jeon, Tae Ryung Hu
-
Publication number: 20190304654Abstract: A coil component includes a body in which a coil part is embedded. The coil part includes a support member, pattern walls formed on the support member, and coil patterns extending between the pattern walls on the support member, and the pattern walls include support portions having a width greater than an average width of the pattern walls.Type: ApplicationFiled: December 12, 2018Publication date: October 3, 2019Inventors: Young Do CHOI, Yu Jong KIM, Sung Min MOON, Tae Ryung HU, Sang Seob KIM, Dong Min KIM
-
Publication number: 20190304680Abstract: A coil component includes a body in which a coil part is embedded. The coil part includes a support member having trenches, pattern walls extending from the trenches in the support member, and coil patterns extending between the pattern walls on the support member.Type: ApplicationFiled: December 11, 2018Publication date: October 3, 2019Inventors: Young Do CHOI, Yu Jong KIM, Sung Min MOON, Tae Ryung HU, Sang Seob KIM, Dong Min KIM
-
Publication number: 20190180915Abstract: A coil component includes: a body including a support member including a through-hole, a first insulating layer disposed on the support member and including a first opening pattern, a second insulating layer disposed on the first insulating layer and including a second opening pattern, and a coil including a coil pattern filled in the first and second opening patterns; and external electrodes disposed on an outer surface of the body. The coil pattern has a stacking structure composed of a plurality of layers, and the plurality of layers includes a thin film conductor layer in contact with the support member, the thin film conductor layer extending to an entire lower surface of the first opening pattern and at least portions of side surfaces of the first opening pattern.Type: ApplicationFiled: July 5, 2018Publication date: June 13, 2019Inventors: Sung Min MOON, Cheol Soon Kim, Yu Jong Kim, Dong Min Kim, Young Do Choi, Tae Ryung Hu
-
Publication number: 20190180927Abstract: A coil component includes: a body including a support member including a through-hole, a first insulating layer supported by the support member and including a first opening portion, a second insulating layer disposed on the first insulating layer and including a second opening portion, and a coil including a coil pattern filled in the first and second opening portions; and external electrodes disposed on an outer surface of the body.Type: ApplicationFiled: July 6, 2018Publication date: June 13, 2019Inventors: Sung Min MOON, Cheol Soon KIM, Yu Jong KIM, Dong Min KIM, Young Do CHOI, Tae Ryung HU
-
Publication number: 20190180913Abstract: An inductor includes: a body including a support member including a through-hole and a via hole, an insulator disposed on the support member and including a first opening exposing portions of the support member, and a coil pattern disposed in the first opening, and including a plurality of layers including a seed layer in contact with the support member; and an external electrode disposed on an external surface of the body and electrically connected to the coil pattern. The support member may have a multilayer structure of at least first and second insulating layers, and the via hole may penetrate through both of the first and second insulating layers.Type: ApplicationFiled: May 17, 2018Publication date: June 13, 2019Inventors: Sung Min MOON, Cheol Soon KIM, Yu Jong KIM, Dong Min KIM, Young Do CHOI, Tae Ryung HU